JB/T 7092-1993 Basic performance measurement method of silver-based composite electrical contacts

This standard specifies the measurement of the Vickers hardness of the working layer and base layer of silver-based composite electrical contacts, composite bonding strength, working layer shape and thickness, coaxiality, spherical radius and cone angle. This standard is applicable to rivet-type or flat-sheet silver-based composite electrical contacts processed by various methods. JB/T 7092-1993 Basic performance measurement method of silver-based composite electrical contacts JB/T7092-1993 standard download decompression password: www.bzxz.net

National Standard of the People's Republic of China
Outline dimensions of semiconductor integrated circuits
1 Subject content and scope of application
This standard specifies the outline dimensions of semiconductor integrated circuits (hereinafter referred to as devices). This standard applies to the inspection of the finished dimensions of devices. 2 Reference standards
IEC191
GB1182
GB1183
GB1184
Mechanical standardization of semiconductor devices
Shape and position tolerance codes and their notation
Shape and position tolerance terms and definitions
Shape and position tolerance provisions without tolerance GB4457.4
Mechanical drawing
Mechanical drawing
GB4458.4 Mechanical drawing
Appearance classification and code
Appearance category
3.2 Appearance code
Drawing method||tt| |Dimensioning method
Ceramic flat package (FP);
Ceramic sealed flat package (CFP);
Ceramic dual in-line package (DIP);
Ceramic sealed dual in-line package (CDIP);
Plastic dual in-line package (PDIP);
Metal round package;
Plastic dual in-line bent lead package (SOP);
Plastic chip carrier package (PLCC);
Ceramic leadless chip carrier package (CCC); Plastic quad flat package (PQFP); Ceramic quad flat package (QFP); Ceramic pin grid array package (PGA).
The numbering method of the shape code shall comply with the provisions of Appendix A (supplement) of this standard. 4 Numbering and identification of lead terminals
4.1F, H, N and Q type packages
GB/T7092-93 approved by the State Administration of Technical Supervision on January 21, 1993
Replaced GB7092-86
Implemented on August 1, 1993
Observed from the front view, the lead terminal identification mark is 1, and in the counterclockwise direction, it is 2, 3.4.2D, J, P and O type packages
Observed from the top view, the lead terminal identification mark is 4.3T-type package
Observed from the bottom view, the terminal identification mark is n, and in the clockwise direction, they are 1, 2, 3..4.4C-type package
Observed from the bottom view, the terminal identification mark is 1, and in the clockwise direction, they are 2, 3.*4.5G-type package
Observed from the bottom view, the terminal identification mark is A1, and the coordinate numbers of other terminals are determined by the detailed specifications of the specific device. 4.6E-type package
Observed from the top view, when the number of terminals on one side of the terminal identification mark area is odd, the terminal on the center line is 1, and in the counterclockwise direction, they are 23.
When the number of terminals on one side of the terminal identification mark area is even when viewed from the top view, the first terminal below the center line is 1, and the following terminals are 2 and 3 in the counterclockwise direction.
5 Dimensional symbols
The meaning of the dimensional symbols shall be in accordance with the provisions of Appendix B (Supplement) of this standard. 6 Dimensions and tolerances
The outline drawings and dimensions specified in this standard are applicable to finished devices, so the manufacturing tolerances are not marked, only the limit dimensions or nominal dimensions are marked. 7 Appearance drawings
7.1 Ceramic flat package
(Type F)www.bzxz.net
7.1.1 Leads leaded out on both sides
Note: 1) This is the terminal identification mark area.
Dimensional symbols
GB/T7092—93
Note: 1) The leads should not be bent, cut or used within this size range. Outline code
z(max), mm
7.1.2 Lead wires are wired on four sides and led out on two sides
Note: 1) This is the identification mark of the lead terminal.
Value, mm
Dimension symbol
GB/T7092—93
Note: 1) The lead wires shall not be bent, cut or used within this size range. Outline code
z(max), mm
Ceramic fusion sealed flat package
(H type)
Note: 1) This is the identification mark area of ​​the lead terminal.
Value, mm
Dimension symbol
GB/T7092—93
Note: 1) The lead wires shall not be bent, cut or used within this size range. Outline code
z(max), mm
Ceramic dual-row package
(D type)
allallz
value, mm
Note: 1) It is the assembly plane. It is measured when the device lead is fully inserted into the hole with a diameter of 0.8±0.05mm. The center of the hole is located on the day/grid. 2) It is the lead-out terminal identification mark area.
The span is 7.62mm. Package size
Dimension symbol
GB/T7092-
value, mm
Note: 1) The L value should be selected from the following values; 2.54~3.00; 2.9~3.4; 3.2~3.9; 4.5~5.0; 3.5~5.0. Outline code
D(max), mm
z(max), mm
Span is 10.16mm
Package size
Dimension symbol
Value, mm
Note, 1) L value should be selected from the following values: 2.54~3.00; 2.9~3.4; 3.2~3.9; 4.5~5.0; 3.5~5.0. Outline code
D(max), mm
z(max), mm
Span of 15.24mm package
Dimension symbol
GB/T7092—93
Value, mm
Note: 1) L value should be selected from the following values: 2.54~3.00; 2.9~3.4; 3.2~3.9; 4.5~5.0; 3.5~5.0. Outline code
D(max), mm
z(max), mm
Ceramic fusion sealed dual row package
(J type)
Note: 1) It is the assembly plane. It is measured when the device lead is fully inserted into the hole with a diameter of 0.8±0.05mm. The center of the hole is located on the / grid. 2) It is the lead-out terminal identification mark area.
Dimensions of the package with a span of 7.62mm
Dimension symbol
GB/T7092—93
Value, mm
Note: 1) The L value should be selected from the following values: 2.54~3.00; 2.9~3.4; 3.2~3.9; 4.5~5.0; 3.5~5.0. Outline code
D (maximum), mm
z (maximum), mm
Dimensions of the package with a span of 10.16mm
Dimension symbol
Value, mm
Note: 1) The L value should be selected from the following values; 2.54~3.00; 2.9~3.4; 3.2~3.9; 4.5~5.0; 3.5~5.0. Outline code
D(max), mm
z(max), mm
Dimensions of the package with a span of 15.24 mm
Angle(°)
Angle()
Dimension symbol
GB/T7092—93
Value, mm
Note: 1) The L value should be selected from the following values: 2.54~3.00; 2.9~3.43.2~3.9; 4.5~5.0; 3.5~5.0. Outline code
D(max), mm
z(max), mm
Plastic dual-row package
(P type))
Angle(\)
Note: 1) It is the assembly plane. Measure again when the device lead is fully inserted into the hole with a diameter of 0.8±0.05mm. The center of the hole is located on the day/grid. 2) It is the lead-out terminal identification mark area.
7.5.1 The dimension of the package with a span of 7.62mm
Dimension symbol
GB/T7092—93
Value, mm
Note: 1) The L value should be selected from the following values: 2.54~3.00; 2.9~3.4; 3.2~3.9; 4.5~5.0; 3.5~5.0. Appearance code
D (maximum), mm
z (maximum), mm
The span is 10.Dimensions of 16mm package
Dimension symbol
Value, mm
Note: 1) The L value should be selected from the following values; 2.54~3.00; 2.9~3.4; 3.2~3.9; 4.5~5.0; 3.5~5.0. Outline code
D(max), mm
z(max), mm
Dimensions of 15.24mm package
Angle (°)
Angle (°)
Dimension symbol
GB/T 7092—93
Value, mm
Note: 1) The L value should be selected from the following values: 2.54~3.00; 2.9~3.4; 3.2~3.9; 4.5~5.0; 3.5~5.0. Outline code
D(max), mm
z(max), mm
Metal round package
No pillar
(T type)
Angle()
Tip: This standard content only shows part of the intercepted content of the complete standard. If you need the complete standard, please go to the top to download the complete standard document for free.