GB/T 5095.12-1997 Basic test procedures and measurement methods for electromechanical components for electronic equipment Part 12: Soldering test Part 6: Test 12f Resistance of seals to flux and cleaning agents in machine welding

This standard specifies the test method, which should be adopted when detailed specifications of electromechanical components for electronic equipment are required. It can also be adopted when detailed specifications of similar components are required. It is to establish detailed standard test methods to evaluate the effect of resistance of seals of components to solvents and cleaning agents during machine welding. The test results cannot represent the test results of other fluxes, such as the resin-reduced foaming flux and other fluxes and cleaning methods mentioned in this standard. GB/T 5095.12-1997 Basic test procedures and measurement methods for electromechanical components for electronic equipment Part 12: Soldering test Part VI: Test 12f Resistance of seals to flux and cleaning agents during machine welding GB/T5095.12-1997 Standard download decompression password: www.bzxz.net

GB/F5095.12: Basic test procedures and test methods Part 12 This standard is equivalent to IEC512-126: 1996 or Electromechanical components for electronic equipment: Soldering test - Part 6: Test 12f - Resistants and cleaning agents at the weld seal during machine welding. This standard was proposed by the Ministry of Electronics Industry of the People's Republic of China. All contents of this standard are under the jurisdiction of the Technical Committee for Standardization of Electromechanical Components for Electronic Equipment. This standard was drafted by the Standardization Research Institute of the Ministry of Electronics Industry. The main contributors to this standard are: Yu Changfang, Jiang Qilong, Zhang Juhua, and Ka Tang. GB/T5095.12: 1997 IEC Foreword 1) IEC (International Electromechanical Commission) is a worldwide standardization organization composed of national electronic committees (IEC National Committees). The purpose of IEC is to promote international cooperation on standardization issues in the field of electronics. For this purpose, among other activities, IEC publishes international standards. The development of international standards is undertaken by technical committees. Any national committee that is concerned with the subject matter may participate in the development of international standards. Any international, governmental and non-governmental organization that has a relationship with the IFC may also participate in the development of international standards. IEC and the International Organization for Standardization (ISO) maintain a close cooperative relationship under conditions agreed upon by the two organizations. 2) IEC's formal resolutions or agreements on technical issues are developed by technical committees with the participation of national committees that are particularly concerned with these issues, and represent the international consensus on the issues involved as much as possible. 3) These resolutions or agreements are published in the form of standards, technical reports or guidelines, and are recommended for international use and, in this sense, are recognized by the national committees.
1) To promote international unification, each IEC National Committee has the responsibility to make its national and regional standards adopt IC standards as much as possible. Any differences between the IEC standard and the corresponding national or regional standard should be indicated in the national or regional standard. 5) IEC has not established any procedures for the use of the approval mark. When claiming that a product conforms to the corresponding IEC standard, IFC is not responsible. 6) The market is aware that some parts of this international standard may involve patent rights. IFC is not responsible for any patent rights. The international standard IEC512-12-6 was published by IEC/TC48 (Electronic Equipment Development Components The text of this standard is based on the following documents: FDIS
18B/420/FDIS
Decision report
48B/461/RVD
Detailed information on the approval of this standard can be found in the voting report listed above. National Standard of the People's Republic of China
Electromechanical components for electronic equipment
Basic test procedures and measurement methods
Part 12: Soldering test
Chapter VI: Test 12f Resistance of seals to flux and cleaning agents in machine welding
Elcetremecbanical components for electranic equipmenBasic testing procedures and meusuring methodsPart 12:Soldering tests
Section 6:Test 12f-Sealing ngainst fluxand eleaning solvents in machine saldering1Scope and purpose
GB/T 5095.121997
idtIEC 512-12-6:1996
The test methods specified in this standard shall be adopted when detailed specifications are required for electromechanical components used in electrical equipment. They may also be used when detailed specifications are required for similar components.
The purpose is to establish detailed standard test methods to evaluate the effects of component seals on resistance to fluxes and cleaning agents during machine soldering. The results of this test cannot replace the test results of other agents, such as resin-reduced foaming fluxes and other fluxes and cleaning methods mentioned in this standard.
2 Referenced standards
The provisions contained in the following standards constitute the provisions of the standard through reference in this standard. At the time of publication of this standard, the versions shown are valid: all standards will be revised. Parties using this standard should investigate the feasibility of using the latest versions of the following standards. 1EC68-1:1988 Environmental testing - Part 1: General principles and guidelines IEC 68-2-20;1979 Environmental testing - Part 2 Part; Test Test T, Solderability 3 Test Sample Preparation
The test sample should be pre-treated, wired and assembled according to the detailed specifications 4 Test Equipment
The foaming flux preheated piece is a typical wave soldering machine with a single or double wave. Note: There are small wave soldering machines suitable for field tests produced by different manufacturers on the market. The foaming wave should be adjusted to contact the printed board test sample without components, and the flux just reaches the upper edge of the plated hole. Preheating temperature: 70~-90
At the end of preheating, it should be 100%.
If a cleaning agent test is carried out, a cleaning station should be used. It can be a separate machine from the welding machine. The work should be cleaned immediately after welding. Approved by the State Administration of Technical Supervision on December 26, 1997 and implemented on October 1, 1998
5 Test procedure
GR/T 5095.12 1997
The test specimens shall be placed as specified in the detailed specification. 5.1 Test specimens immersed
The test specimens shall be immersed in a flux solution conforming to 1FC:68-2-20. Inactive flux shall be used preferably.
In order to facilitate inspection, it is recommended to add the additives listed in the table to the flux. Table 1 bzxZ.net
Additives
Neck flux concentration
.1.4g/
It will also be convenient for optical inspection of the flux when it penetrates into the state. If the flux sheet infiltrated with the additives in Table 1 is used to inspect the test sample under ultraviolet light, it may be better to evaluate. 5.2 Welding
The solder should preferably be the solder in Appendix B of IEC68-2-204: Soldering temperature: 260℃±5C:
Soldering time: 5:1s .
5.3 Cleaning agent
When cleaning is required in the detailed specification, the cleaning agent shall be specified or selected from Table 2. The test procedure may also be specified in the detailed specification or selected from Table 3. Possible combinations are listed in Table 4. I2
Distilled water: 10%
Moisturizer (volume %), 45% ethyl alcohol butyl ether
46% 1-propanol
Specific gravity: 0.785kg/dm
Cleaning agent
Test procedure code
Qinggu Ruihao
GB/T 5095. 12
Identification/Test Method
Immersion of printed board mounting surface up to 2rIr-:
Flooding time (2\) mic:
Cleanser temperature (23±5);
Cleanser allowable contamination: flux (volume content) less than 'ng/E.: The printed board does not move during flooding.
Printed board set immersion 25n1m, single box procedure:
Flow time (2+0.2)min:
Cleanser temperature (23±5)C:| |tt||The inter-contamination of the free cleaning agent is allowed to contain flux (solid content) <1mg/1.; The printed board does not move during the design process.
The printed board is not 25mm, multi-box method;
The printing gel does not move during the design process
Questions in the test point:
Three-box or four-box construction process;
Test design (cooling·heating):
10 boxes of cleaning agent:
The quality of the cleaning agent in the sea;
The immersion time of each box.
If C Item. However, the ultrasonic effect of the frequency of 35kHz~40kHz is sufficient to test the problem of the island:
Ultrasonic action time:
Design of the test box with an ultrasonic source;
The position of the test sample relative to the ultrasonic source. Table 4
Try to convert the program code
Note: Indicates the possible existence of the platform
5.4 Printed board test sample
The test sample of the printed board shall be made according to the detailed specifications. It is best to use a civil standard version with double metallized holes. Size: 190mm×160mm:
Thickness: 1.5mm;
... Material; Detailed specification;
EB/T 5095,12-1997
Grid: 2.50mm or 2.54mm,As required by the detailed specification, additional holes shall be provided for the installation of specific components. Openings in areas not to be installed may be covered with suitable tape or foil, unless otherwise specified in the detailed specification: holes below components shall be kept as small as possible. 6 Test preparation
For mechanical welding, the test specimens shall be mounted on the printed board test specimens before pretreatment. The test specimens shall be tested on the printed board. Special mounting methods shall be used (if required for the test specimens): Whether the test specimens are tested individually or when mounted at the minimum distance between phases shall be specified in the detailed specification. 7 Requirements
7.1 Initial testing
At least one electrical or mechanical property test shall be carried out as specified in the detailed specification, such as contact resistance, operating force or force, operating characteristics, etc.
.2 Conditioning test
The conditioning test includes solvent treatment, preheating and soldering according to the peak soldering machine specified in Chapter 4. If desmearing is specified, it shall comply with the severity level of the detailed specification. Cleaning treatment shall be started within 3 minutes after soldering and cooling shall not be allowed. 7.3 After cleaning treatment, the printed board shall be stored for 24 hours under the standard atmospheric conditions of the test specified in IEC68-1. 7.4 Final inspection
The interphase measurement items specified in the initial inspection shall be carried out. The test limit should be specified in the detailed specification. 7.5 Visual inspection
After the electrical and mechanical tests, the test samples shall be inspected by suitable optical methods for flux residues and cleaning agent residues in the areas specified in the detailed specifications (as applicable). No residues are allowed in the specified areas:
8 Details to be specified
The detailed specification requires that the following details be specified during this test:) Number of test samples:
) Placement of the test printed board (if applicable):) Provisions for the masking and configuration of the holes under the test sample (if applicable): d) Position of the test sample on the printed board; d) Cleaner and cleaning procedure (if applicable?); f) Requirements for initial and final inspections: d) Definition of no-marker and no-cleaner areas (if applicable); h) What are the differences from the standard test method. ..com
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