GB/T 4677-2002 Printed board test methods

This standard specifies the test methods and procedures and their classification applicable to printed boards, but has nothing to do with the manufacturing method of printed boards. GB/T 4677-2002 Printed Board Test Methods GB/T4677-2002 Standard Download Decompression Password: www.bzxz.net

ICS31.180
National Standard of the People's Republic of China
GB/T4677-2002
eqvIEC60326-21990
Test methods of printed boards
Test methods of printed boards2002-11-25Promulgated
People's Republic of ChinawwW.bzxz.Net
General Administration of Quality Supervision, Inspection and Quarantine
2003-04-01Implementation
GB/T4677—2002
Referenced standards
General inspection
Electrical test
Mechanical test
Other tests
9 Environmental tests
Appendix A (Appendix to the standard) Appendix B (Informative Appendix)
Test Method Index
Outgassing Test for Plated-Through Holes (Non-destructive)
GB/T4677--2002
This standard is equivalent to the International Electrotechnical Commission IEC60326-2:1990 "Printed Boards Part 2: Test Methods" and its first amendment IEC326-2AMD1:1992, and is equivalent to them in terms of technical content and format. This standard involves test methods for printed boards, and the referenced documents, specified technical parameters and test methods used are advanced and reasonable, and conform to my country's national conditions.
This standard is a revision of GB/T4677.1~4677.23-1988 "Test Methods for Printed Boards", GB/T4825.1-1984 "Test Methods for Partial Discharge of Conductors on Printed Boards", GB/T4825.2-1984 "Test Methods for Current Carrying Capacity of Conductors on Printed Boards", GB/T7613.1-1987 "Test Methods for Withstanding Current of Conductors on Printed Boards", GB/T7613.2-1987 "Test Methods for Withstanding Voltage on Surfaces of Printed Boards", and GB/T7613.3-1987 "Test Methods for Withstanding Current of Metallized Holes on Printed Boards". For ease of use, this standard has unified the classification of the original series of standards. For example, the original GB/T4677.1 is included in 6.4.1 electrical test of this standard, the original GB/T4677.4 is included in 7.1 of this standard, and the original GB/T4677.23 is included in 8.4 other tests. In addition, the standard also adds technical contents that are not in the original standard, such as adding the inapplicable measurement range of the sample and the requirements for sample grinding and polishing, inspection methods, inspection elements and specified details in 8.3.2 microsection.
The main technical differences between this standard and IEC60326-2 are: adding the test method for the flame retardant performance of printed boards, the test method for ionic contamination on the surface of printed boards, the contents specified under the standard atmospheric conditions of the test, and the schematic diagram of the solderability of plated-through holes in Appendix A. Appendix A of this standard is the standard appendix, and Appendix B is the prompt appendix. This standard is proposed by the Ministry of Information Industry of the People's Republic of China. This standard is under the jurisdiction of the National Technical Committee for Printed Circuit Standardization. This standard is drafted by the 15th Institute of Electronics of the Ministry of Information Industry. The main drafters of this standard are: Tang Yanmin, Lou Yafen, Jiang Qian, Shi Lei, Zhang Chunting. 1 Scope
National Standard of the People's Republic of China
Test methods of printed boards
Test methods of printed boardsGB/T4677—2002
eqvIEC60326-2:1990
Replaces GB/T4677.1~4677.23—1988GB/T4825.14825.2—1984
GB/T7613.1~7613.31987
The test methods and procedures and their classification specified in this standard are applicable to printed boards, but have nothing to do with the manufacturing methods of printed boards. The test methods included in this standard are shown in Appendix A. 2 Referenced standards
The provisions included in the following standards constitute the provisions of this standard through reference in this standard. When this standard is published, the versions shown are valid. All standards will be revised, and parties using this standard should explore the possibility of using the latest versions of the following standards. GB/T1360-1998 Printed circuit grid system (idtIEC97: 1991) GB/T2036-1994 Printed circuit terminology (neqIEC194: 1988) GB/T2421-1999 Environmental testing for electric and electronic products Part 1: General (idtIEC68-11988) Tin-lead solder (neqISO9453: 1990) GB/T3131-2001
GB/T4588.1-1996 Sectional specification for single-sided and double-sided printed boards without metallized holes (idtIEC/PQC89: 1990) GB/T4588. 2-1996 Single-sided and double-sided printed boards with metallized holes (idtIEC/PQC90:1990) GB/T4588.3-2002 Design and use of printed boards (egvIEC326-3.1991) GB/T4588.4-1996 Multilayer printed boards (idtIEC/PQC91:1990) GB/T4721-1992 General rules for copper foil laminates for printed circuits (neqIEC249:1985~1988) 2 Test methods for copper foil laminates for printed circuits (neqIEC249-1:1982) GB/T4722- 1992
GB/T5169.11—1997 Fire hazard testing for electric and electronic products Test methods Glow-wire test and guidance for finished products (idtIEC695-2-1/1:1994)
Fire hazard testing for electric and electronic products Part 2: Test methods Part 2: Needle flame test GB/T5169.5—1997
(idtIEC695-2-2:1991)
SJ20604-1996 General specification for flexible and rigid printed boards SJ/Z9001.5-1987 Basic environmental testing procedures Part 2: Various tests Ca: Steady-state damp heat SJ/Z9001.10—1987 Basic environmental test procedures Part 2: Various tests Z/AD: Temperature/humidity combination cycle test SJ/Z9001.31—1987 Basic environmental test procedures Part 2: Various tests T: Soldering SJ/Z9033-1987 Printed boards, Part 1: General guidance for specification developers ISO Standard 3448 (1975): Industrial grade liquid lubricants—ISO viscosity grade 3 Purpose This standard specifies standard test methods for evaluating the characteristics, properties and dimensions of printed boards. Approved by the General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China on November 25, 2002 and implemented on April 1, 2003
4 Overview
4.1 Standard atmospheric conditions for testing
GB/T4677—2002
Unless otherwise specified, all tests shall be conducted under standard atmospheric conditions for testing: temperature: 15℃~35℃, relative humidity: 45%~75%, air pressure: 86kPa106kPa. The ambient temperature and relative humidity during the measurement shall be stated in the report. When there is a dispute between the supplier and the buyer over the test results, the test shall be conducted under one of the "arbitration conditions" in SJ/Z9001.10. 4.2 Test specimens
Unless otherwise specified, the test shall be conducted using finished panels. For specific tests, test coupons shall be used. In order to make the specimens representative of the finished board, the test coupons may be included in the finished board or may be a separate composite test board produced using the same materials and processing technology as the finished board. When producing separate composite test boards, they should be evenly distributed in a considerable number of products to obtain a better overall evaluation. 5 General Inspection
5.1 Test 1: Visual Inspection
Visual inspection is to check whether the printed board's logo, appearance, processing quality, surface coating, graphics, etc. meet the requirements of the relevant specifications under magnification or without magnification.
5.1.1 Test 1a: 3 times magnification
Visual inspection is carried out under appropriate lighting conditions with a linear magnifier of approximately 3 times. 5.1.2 Test 1b: 10 times magnification
When specified, visual inspection is carried out under appropriate lighting conditions with a linear magnifier of approximately 10 times. 5.1.3 Test 1c: 250 times magnification
When specified, inspection is carried out with a microscope of approximately 250 times. Microsectioning is generally required. 5.2 Test 2 Dimensional Inspection
Dimensional inspection refers to measuring the actual dimensions of the printed board with the help of measuring tools and measuring devices to see if they meet the relevant specifications. 5.2.1 Measuring tools and devices shall have an accuracy and readability appropriate to the dimensions and tolerances being measured. Appearance inspection shall use a vernier caliper or other suitable measuring tool with an accuracy of not less than 0.02 mm; thickness measurement shall use a micrometer or other suitable measuring tool with an accuracy of not less than 0.01 mm: hole position, hole diameter, ring width, wire width and spacing inspection shall use a measuring tool with an accuracy of not less than 0.01 mm. 5.2.2 Test 2a: Optical method
When specified, the measurement of dimensions such as hole and wire edge defects shall use an optical instrument with a measuring crosshair capable of reading 0.025 mm.
5.2.3 "When specified, measurements such as warpage of printed boards shall be made using gauges in accordance with the test methods and/or detailed specifications.
6 Electrical tests
6.1 Test 3: Resistance
6.1.1 Test 3a: Wire resistance
6.1.1.1 Purpose
Determine the resistance of the wire.
6.1.1.2 Test specimen
GB/T4677—2002
Measurements shall be made on the specified wires. The wires to be measured shall be as long and narrow as possible. 6.1.1.3 Method
Two wires located at different positions shall be selected and their resistance shall be measured using an appropriate method. The measurement error shall not exceed 5% and shall Keep the current small enough to avoid appreciable heating of the conductor. When there is a dispute, the four-terminal method shall be used. 6.1.1.4 Specified Details
a) Conductor to be tested;
b) Resistance value;
c) Any deviation from the test method of this standard 6.1.2 Test 3b: Interconnection Resistance
6.1.2.1 Purpose
Determine the interconnection resistance of a printed board.
6.1.2.2 Test Specimen
Specified portion of a finished board, test coupon, or composite test board. 6.1.2.3 Method
The resistance between two specified holes shall be measured using the four-terminal method or an equivalent method. The measuring current shall not exceed 0.1A. All measurement errors shall be less than 5%. Two typical connection methods See Figures 1 and 2. Connection method A
Solder the leads in the specified holes according to Figure 1.
Connection method B
Connect with two pairs of contact pins according to Figure 2.
Note: The test probes described in test 5a can be used (see Figure 3). Connection of interconnection resistance test equipment
Voltage wire clamp
Current wire center
The distance between the lead and the hole is not important
A--Insulating sleeve:
-Insulating compression spring,
-Stainless steel probe suitable for the hole diameter for testing, printed board
GB/T4677-2002
Golden layer
Contact pins for current measurement
Contact pins for voltage measurement
Figure 3 Test probe for current withstand test
Details specified in 6.1.2.4
a) Holes and interconnections to be tested;
b) Method of connection:
c) Maximum resistance value;
d) Any deviation from the test method of this standard. 6.1.3 Test 3c: Change in resistance of plated-through holes Thermal cycling 6.1, 3.1 Purpose
When the holes are subjected to thermal cycling, the resistance shall be continuously monitored to determine the increase in the resistance of the plated-through holes that may occur. The increase in resistance value indicates the quality of the electroplating layer. 4
6.1.3.2 Test specimen
GB/T4677—2002
A suitable printed board with a series of connected plated-through holes. When the test coupon specified in GB/T4588.2 or GB/T4588.4 is used, the test shall be carried out on "Test Pattern D".
The test board should preferably not be electroplated with lead-tin. If it has been plated, it should be removed by chemical methods before testing. However, care should be taken to avoid any damage to the copper foil.
Note: The composition and content of the lead-tin stripping solution are: 330mL 60% HNO (density 1.36g/cm2, 20℃); 3mL 40% bottle acid (density 1.32g/cm2, 20℃): 670mL deionized water.
Note that when using the lead-tin stripping solution, necessary protective measures should be taken to prevent health hazards. 6.1.3.3 Method
Use the four-terminal method to measure the resistance (or corresponding voltage drop) of a series of connected plated holes at a constant test current of (100±5)mA. The resistance should be continuously monitored during the test. The specimen should be connected to the recording instrument, for example through a suitable board edge connector. Thermal cycling is accomplished by alternating between two separate fluid baths: a) a room temperature bath as specified in 9.2.1 Test 19a, maintained at (25 ± 2)°C; to ensure effective cooling at 25°C, the bath shall be filled with a low viscosity liquid;
b) a hot bath as specified in 9.2.1 Test 19a, maintained at 260+°C. The specimen shall be vertically immersed in the fluid to a depth such that the connection area (e.g., edge connector) is approximately 30 mm above the surface of the fluid. While immersed in the hot fluid, the specimen shall be gently moved (horizontally parallel to its surface) to improve heat transfer. After immersion, remove from the 25°C bath and remove any residual liquid from the specimen before the next immersion. The specimen shall be alternately immersed in the 25°C and 260°C baths. The transition from the 260°C bath to the 25°C bath shall be rapid and without delay. The cycle shall be started and ended by leaving the 25°C bath. The total number of cycles shall be as specified in the relevant specifications. The specimen shall remain immersed in the 25°C bath until the resistance reading stabilizes. The time for the specimen to be immersed in the 260°C bath shall be (20 ± 1) s. If the printed board substrate is different, the relevant specifications may specify different immersion times or be agreed upon by the supplier and the purchaser.
Draw a curve of immersion times (corresponding to the time table) and resistance values ​​(or corresponding voltage drops) on a coordinate graph. The graph obtained from the chart recorder is similar to Figure 4.
Gongwangjia
Details specified in 6.1.3.4
a) Specimens to be tested;
First immersion in 25°C
First immersion in 260°C
Initial resistance!
Last immersion at 260℃
First immersion at 25℃ after immersion
Number of immersions
cd, e correspond to c), d), e in 6.1.3.4 respectively) Figure 4 Thermal cycle immersion times and resistance curve b) Immersion times at 260℃;
GB/T4677-2002
c) Maximum percentage of resistance increase allowed between the first and last immersion in the 25℃ bath; d) Maximum percentage of resistance increase allowed between the first and last immersion in the 260℃ bath; e) Maximum percentage of resistance allowed between any immersion in the 260℃ bath; f) Any difference from the test methods of this standard. 6.2 Test 4: Electrical integrity
Electrical integrity shall be based on two test methods: Test 4a: Circuit insulation and Test 4b: Circuit continuity. These two tests can be performed on the same specimen after completing one of them. The circuit continuity test (Test 4b) is usually performed first. In addition to the use of automatic test equipment, the use of common current values ​​as the limiting conditions (i.e., as the boundary between circuit insulation conditions and circuit continuity conditions) can also simplify this combined measurement. These tests are not a substitute for visual inspection (Test 1a). 6.2.1 Test 4a: Circuit Insulation
6.2.1.1 Purpose
To verify that there are no shorts between specified conductive patterns on the printed board in accordance with relevant specifications (i.e., photographic plates, user requirements, computer-aided data, etc.).
6.2.1.2 Test Specimen
All or specified portions of conductive patterns between or on any layer of the finished printed board. 6.2.1.3 Method
Connect the specified points on the conductive pattern that are close but not connected to the test source by suitable means, for example, by contacting the specified wire or pad with the test probe. The remaining circuits not to be tested can be connected together or in groups or tested separately in sequence. When applicable, multiple arrays of test probes (such as bed of nails, integrated circuit or hybrid circuit pattern probes, etc.) can be used. For plugs on printed boards, suitable board edge connectors or test probes can be used. During the test, the specified test voltage should be applied to the conductive pattern. If a short circuit exists, a current will flow. The test voltage source should have a means to monitor the supply current and should be able to limit the current value to the current carrying capacity of the circuit during the test to avoid overheating. For quick assessment of short circuits, a simple display can be used. For example, an indicator light or a measuring instrument or a circuit that converts the current into an assessment signal for automatic test equipment.
Complex short circuit assessment is that the monitoring current should be able to determine the minimum resistance value required for the circuit insulation limit between the separated conductive patterns when the measurement error does not exceed 100%.
There should be no short circuit between the specified points. During the assessment, the resistance value determined by the current passing between the separated conductors shall remain above 1 MΩ or as specified in the user's detailed specification.
6.2.1.4 Specific items to be specified
a) Test voltage;
b) Minimum resistance permitted when not 1 MΩ;
c) Portion of the conductive pattern to be tested;
d) Maximum permissible current,
e) Any deviation from the test method of this standard. 6.2.2 Test 4b: Circuit Continuity
6.2.2.1 Purpose
To verify that the electrical continuity of the specified connection points on the conductive pattern of the printed board conforms to the relevant specification (i.e. photographic plate, user requirements, computer-aided data, etc.).
6.2.2.2 Test specimen
All or specified portions of the conductive pattern between or on any layer of the finished printed board. 6.2.2.3 Method
Specified points on the conductive pattern shall be connected to the test circuit by appropriate means. For example, use the test probe to contact the specified wire or solder pad. Multiple array circuit test probes can be used where appropriate. Suitable board edge connectors or test probes can be used where there are printed plugs.
Each individually connected conductive pattern (such as solder pads, board edge connectors, contacts) that passes through external susceptible circuit connection points in turn and the specified external connection points should be applied with a specified voltage or pass a specified current. Circuit connectivity can be quickly assessed with a simple display. For example, an indicator light or a measuring instrument or a circuit that converts current into a signal for automatic test equipment.
Complex circuit connectivity assessment is that when the measurement error does not exceed 100%, the total current monitored by each circuit should be able to determine the resistance value between any two points in the circuit, and the resistance value should not be greater than the maximum value required by the circuit connectivity limit. During the test, the maximum current of the equipment should be limited to the current carrying capacity of the circuit. The specified points of each circuit should be electrically connected. For complex equipment, electrical continuity is considered to exist when the current passing between any points in the circuit indicates a resistance value less than 5Ω or a value specified in the user's detailed specification. 6.2.2.4 Specific items
a) Test voltage:
b) Maximum permissible resistance when not 5α; c) Part of the conductive pattern to be tested:
d) Maximum permissible current;
e) Any deviation from the test method of this standard. 6.3 Test 5: Withstand current
6.3.1 Test 5a: Withstand current of plated double holes
6.3.1.1 Test
Evaluate the ability of the electroplated layer of the plated-through hole to withstand the specified test current. 6.3.1.2 Test specimen
Plated holes of the finished board or holes suspected of being defective are visually inspected. 6.3.1.3 Method
Pass the current value in Table 1 through the plated-through hole for a period of 30 s and monitor continuously. Table 1 Test current for plated-through holes
Diameter/mm
A suitable AC or DC power supply is used to provide a steady current. Test current/A
The current is applied by a suitable test probe, see Figure 3. Apply sufficient pressure to ensure good electrical contact, a force of about 1N is appropriate. 6.3.1.4 Specified details
a) The hole to be tested;
b) Final measurements and requirements;
c) Any deviation from the test method of this standard. 6.3.2 Test 5b: Conductor current withstand
6.3.2.1 Purpose
GB/T4677—2002
To assess the ability of the conductor and the connection between the conductor and the plated hole to withstand a specified current. 6.3.2.2 Test specimen
Specified part of the finished board, test coupon or composite test board. 6.3.2.3 Method
A specified direct or alternating current is passed through the conductor for a specified time and the current is continuously monitored. The current magnitude is selected in accordance with the provisions of GB/T4588.3. Good electrical contact should be maintained during the test.
6.3.2.4 Specific items
a) Conductors to be tested, including connection points;
b) Current value and duration;
c) Final measurements and requirements;
d) Any differences from the test methods of this standard. 6.4 Test 6: Insulation resistance
6.4.1 Test 6a: Surface insulation resistance
6.4.1.1 Purpose
Determine the insulation resistance of a specified portion of the conductive pattern on the surface of a printed board or on any layer of a multilayer board before lamination. The insulation resistance can indicate whether the quality of the materials and processes used in production meets the requirements. The relationship between the insulation resistance of the metal foil substrate specified in GB/T4721 and the insulation resistance specified in this test is explained in GB/T4588.3.
6.4.1.2 Test specimen
Conductive pattern between any two specified points on any layer of the finished board or multilayer board before lamination. The specimen should be held carefully to avoid any contamination. For example, fingerprints, dust, etc. 6.4.1.3 Method
The specimen should be pre-treated according to test 18a.
The insulation resistance should be measured using a megger or other suitable equipment with a range of not less than 10\Ω, and the error should not exceed 10%. The measurement voltage, that is, the voltage across the insulation resistance to be measured as specified in the relevant specification, should be (10±1)V or (100±15)V or (500±50)V. The test voltage should be pre-loaded for 1min before measurement. If the measurement reading stabilizes quickly, the measurement can be carried out quickly. If it does not stabilize within 1min, it should be recorded in the test report. The relevant specification may also require the insulation resistance to be measured at high temperature. For example, when the sample is still in the test chamber, the same method is used for measurement under damp heat conditions.
When the test lead is introduced into the test chamber, the influence on the insulation resistance reading must be avoided as much as possible. 6.4.1.4 Specific items
a) The part of the pattern to be tested;
b) Test voltage:
c) Temperature and (or) relative humidity different from standard conditions; d) Minimum value of insulation resistance:
e) Any difference from the test method of this standard. 6.4.2 Test 6b: Inner layer insulation resistance
6.4.2.1 Purpose
Determine the insulation resistance between the specified parts of the inner conductive pattern of a multilayer printed board. The insulation resistance indicates whether the quality of the materials and processes used in production meets the requirements. Since this insulation resistance is a combination of surface resistance and volume resistance, it has nothing to do with the specified value of the metal foil substrate specified in GB/T4721.
6.4.2.2 Test specimen
GB/T4677—2002
Any two specified points on the inner conductive pattern of the finished board or the test coupon. It should be noted that the specified test points cannot affect other layers. The specimen should be held carefully to avoid any contamination. For example, fingerprints, dust, etc. 6.4.2.3 Method
The method specified in test 6a is applicable to this test. 6.4.2.4 Specific items
a) The portion of the pattern to be tested;
b) Test voltage;
c) Temperature and (or) humidity different from standard conditions; d) Minimum value of insulation resistance;
e) Any difference from the test method of this standard. 6.4.3 Test 6c: Interlayer insulation resistance
6.4.3.1 Purpose
Determine the insulation resistance between the specified conductive pattern portions between adjacent layers of the printed board. Insulation resistance indicates the quality of workmanship, the adequacy of the substrate thickness or the quality of the bonding layer.
6.4.3.2 Test specimens
Specified points on the conductive pattern between adjacent layers on the printed board. The specimens should be handled carefully to avoid any contamination, such as fingerprints, dust, etc. 6.4.3.3 Method
The method specified in test 6a applies to this test. 6.4.3.4 Specified details
a) Part to be tested;
b) Test voltage;
c) Temperature and/or humidity different from standard conditions; d) Minimum value of insulation resistance;
e) Any deviation from the test method of this standard. 6.5 Test 7: Withstand voltage
6.5.1 Test 7a: Surface withstand voltage
6.5.1.1 Purpose
To assess the ability of a specified part of the surface pattern of a printed board to withstand a specified test voltage without any destructive discharge indicated by flashover (surface discharge), spark discharge (air discharge) or breakdown (through discharge). The discharge may be observed by eye or displayed in an appropriate manner by the test instrument.
Note that the withstand voltage test cannot replace the distance measurement between the conductors. 6.5.1.2 The test specimen
The test shall be carried out on the pattern of the specified part of the surface of the printed board. When the test is performed on the graphics of the specified part of the surface of the multi-layer printed board, the influence of other parts or other layers should be avoided. The sample should be handled carefully to avoid any contamination, such as fingerprints, dust, etc. 6.5.1.3 Method
The sample should be pre-treated according to test 18a.
The test voltage should be a DC voltage or an AC peak voltage with a frequency of 40Hz to 60Hz that is close to a sine wave. The test equipment should be able to provide the required high voltage and display destructive discharge and (or) specified leakage current without visible damage to the naked eye.
The voltage should be applied between the specified points and gradually increased, rising to the specified value after 5s, and then maintained for 1min. 9
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