JB/T 56050-1999 Quality classification of copper-based solder products

JB/T 56050-1999 Quality classification of copper-based solder products JB/T56050-1999 Standard download decompression password: www.bzxz.net

Machinery Industry Standard of the People's Republic of China
JB/T56050-1999
Copper-based solder
Product quality classification
(Internal use)
Published on December 30, 1999
National Bureau of Machinery Industry
Implemented on June 1, 2000
JB/T56050-1999
This standard is a revision of JB/T56050.193 "Copper-based solder product quality classification". During the revision, the original standard was edited, and the main technical content remained unchanged. This standard replaces JB/T56050.1-93 from the date of implementation. This standard is proposed and managed by the National Welding Standardization Technical Committee. Drafting units of this standard: Harbin Welding Research Institute, Shanghai Cimic Welding Materials Co., Ltd. The main drafters of this standard: Xue Songbai, Xu Qi This standard was first issued in 1993, and this is the first revision. 1 Scope
This standard specifies the quality grade, inspection and test methods, sampling methods, evaluation methods, etc. of copper-based pin materials. This standard is applicable to copper-based pin materials used in methods such as gas flame welding, resistance brazing, furnace brazing, induction brazing and dip brazing. 2 Cited standards
The provisions contained in the following standards constitute the provisions of this standard through reference in this standard. When this standard is published, the versions shown are valid. All standards will be revised, and parties using this standard should explore the possibility of using the latest versions of the following standards. GB/T6418——1993bzxz.net
GB/T86191988
GB/T11363—1989
3 Quality Grade
Copper-Based Solder
Test Method for Solder Seam Strength
Test Method for Solder Joint Strength
The product quality level of copper-based solder is divided into three grades: qualified product, first-class product and superior product, and is assessed in terms of external quality and internal quality. The quality indicators of different grades are shown in Table 1. The root pass rate is not assessed for disc solder. Table 1 Quality indicators
Inspection items
External quality
(score)
Average root pass rate
Chemical composition of solder
Qualified products
Conform to the relevant provisions of GB/T6418
Quality grade indicators
Second-class products
Conform to the relevant
provisions of GB/T6418. Among them, the total amount of impurities in copper solder
is not more than 0.090%; the total amount of impurities in copper-zinc solder
is not more than 0.40%
the total amount of impurities in copper-phosphorus solder is not large
superior quality
4 Inspection method
4.1 External quality inspection
JB/T56050-1999
4.1.1 The external quality inspection items, score distribution and inspection quantity of solder are shown in Table 2. Table 2 Inspection contents of external quality
Score distribution
Inspection items
(Except length)
(Burr edge)
Cast strip
(Fractional item)
Wire, etc.
(Fractional item)
Disc, ring
And ring
(Fractional/item)
Number of inspections||tt ||Straight and ring
(root, ring item)
Disc and ring
(m/item)
The length of cast strip solder should be ≥250mm, and the length error of the same batch of solder should be ≤±2mm4.1.2 Details of solder external quality inspection
4.1.2.1 Impurities
The solder surface has obvious inclusions and impurities that affect the brazing quality, which is unqualified for this item. If the number of unqualified impurities exceeds 30, the product is judged as unqualified. 4.1.2.2 Oil marks
The solder surface has obvious oil marks, which is unqualified for this item. 4.1.2.3 Cracks
The surface cracks of the needle material, a single longitudinal length greater than or equal to 30mm or a transverse length greater than or equal to 1/2 of the circumference is unqualified. If there are more than three longitudinal cracks greater than 20mm or transverse cracks less than 1/2 of the circumference but greater than 1/3 of the circumference, the item is unqualified. 4.1.2.4 Size (except length)
The size of the solder shall comply with the relevant provisions of GB/T6418. 4.1.2.5 Peeling
JB/T56050-1999
The solder surface is peeled or warped, which is unqualified. 4.1.2.6 Pits
The area of ​​the pits on the solder surface is greater than 4mm, and the depth is clearly visible, which is unqualified. 4.1.2.7 Pull marks
The depth of the local pull marks of the solder is greater than 0.2mm, or the pull marks of the entire root or section of the solder can be clearly detected, which is unqualified. 4.1.2.8 Burrs
The solder cut is uneven, which is unqualified. 4.1.2.9 Burr
If the surface is not smooth and can be clearly detected or felt, it is unqualified for this item. 4.1.2.10 Double knife
If there are obvious double knife marks on the solder blade, it is unqualified for this item. 4.1.2.11 Deflection
The maximum deflection of straight solder should not be greater than the provisions of Table 3. Table 3 Allowable deflection
Solder diameter
Copper phosphorus wire solder
4.1.2.12 Length
The solder length should comply with the relevant provisions of GB/T6418. 4.1.2.13 Distortion
If the solder is obviously twisted, it is unqualified for this item. 4.1.2.14 Burr
If the burr of cast strip solder is obvious, it is unqualified for this item. 4.1.2.15 Sand head
Sand head of cast strip solder is obvious, which is considered as unqualified. 4.1.3 Scoring method
Length≤350
Bolting material deflection
Length350
4.1.3.1 For straight solder and ring solder, except for size, 10% of the total score of each unqualified solder will be deducted for each (ring). If more than 10 solders are used, 0.1 point will be deducted for each solder: For disc and ring solder, except for size, 500mm is a section, and 10% of the total score of each unqualified solder will be deducted for each section
4.1.3.2 If a straight solder or ring solder has more than one unqualified item, the points will be deducted according to the higher-scoring item, and the points will not be deducted repeatedly, but the number of unqualified items (rings) will be counted.
When more than one item in each section of the disk and ring solder is unqualified, the points can be deducted repeatedly. 4.1.3.3 The size item can be deducted repeatedly, but the number of unqualified roots (rings) is not counted. 4.1.3.4 The average root (ring) pass rate of straight solder and ring solder is calculated according to formula (1): 3
JB/T56050-1999
Average root (ring pass rate (%) - number of inspection items 100 roots (rings) - unqualified root (ring) 100% - number of inspection items × 100 roots (rings)
4.2 Internal quality inspection of solder
4.2.1 Chemical composition analysis of solder
The chemical composition of solder shall comply with GB/T64 18, the analysis method shall be in accordance with the provisions of the relevant standards. 4.2.2 Brazing joint strength test
Brazing joint tensile and shear tests shall be carried out in accordance with GB/T8619 or GB/T11363. 4.3 Re-inspection
4.3.1 First-class and superior products shall be subject to one inspection, and re-inspection is not allowed. When the unqualified products reach the first-class or superior products during re-inspection, they can only be judged as qualified products.
4.3.2 If any of the internal quality tests fails, the test shall be doubled. Re-test. The double re-test results should meet the requirements for qualified products for this inspection.
4.3.3 If the external quality inspection shows unqualified products, double re-test should be conducted, and each inspection item should be used as a re-test item. The re-test results should meet the requirements for qualified products.
4.3.4 If the external quality is unqualified again after double re-test, the batch of products should be re-selected or judged as unqualified products. 5 Sampling method
5.1 Sample 100 pieces (rings) of straight solder and ring solder for each batch, and 100 pieces (rings) of disc solder and ring solder for each batch. 6m of sample, and there should be no less than two sampling locations. 5.2 When two items need to be inspected at the same time, 120 pieces (rings) of straight needle material and ring material can be sampled, and 7m of disc solder and ring solder can be sampled.
5.3 When the inspection fails and needs to be re-inspected, the sampling should be doubled according to the above method. 6 Evaluation method
6.1 Qualified products
The external and internal quality of the solder meet the requirements of qualified products. First-class products
The external and internal quality of the solder meet the requirements of first-class products. 6.3Superior products
Boring materials' external and internal quality meet the requirements of superior products. 4
Republic
Mechanical industry standard
Copper-based solder
Product quality classification
(for internal use)
JB/T56050—1999
Published and distributed by the Mechanical Science Research Institute
Printed by the Mechanical Science Research Institute
(No. 2, Shouti South Road, Beijing, zip code 100044)*
Book size 880×1 230
2Words 1Q000
1/16Printing sheet 1/2
First edition in April 2000
Printing quantity 1-500
First printing in April 2000
Price 1000 yuan
No. 99-1537
Mechanical Industry Standard Service Network: http/kvwwJB.ac.cn6660009
Tip: This standard content only shows part of the intercepted content of the complete standard. If you need the complete standard, please go to the top to download the complete standard document for free.