SJ 20723-1998 Detailed specification for GG6001 pulse signal photoelectric isolation assembly

This specification specifies the technical requirements, quality assurance regulations, inspection and test methods, delivery preparation and other requirements of GG6001 pulse signal photoelectric isolation components (hereinafter referred to as "components"). This specification applies to the development, production and procurement of components. SJ 20723-1998 GG6001 pulse signal photoelectric isolation component detailed specification SJ20723-1998 Standard download decompression password: www.bzxz.net

Military standard for the electronics industry of the People's Republic of China FL5980
SJ20723—1998
GG6001 type pulse signal
Detail specification for photoelectric isolator assembly for pulse signal1998-03-18 Issued
1998-05-01 Implementation
Approved by the Ministry of Electronics Industry of the People's Republic of China Military standard for the electronics industry of the People's Republic of China GC6001 type pulse signal
Detaill specification for type GG6001 optoelectronic isolator assenbly for pulse signal1 ScopewwW.bzxz.Net
1.1 Subject content
SI 20723 - 1998
This specification specifies the technical requirements, quality assurance provisions, inspection and test methods, delivery preparation and other requirements of GG600I pulse signal optoelectronic isolation components (hereinafter referred to as "components"). 1.2 Scope of application
This specification applies to the development, production and procurement of components. 2 Reference documents
GB 3431.1 — 82
GB 5232 — 85
GB 7408 - 87
GB 11315 --- 89
GB 11499 89
GB 12507 — 90
GB/T 15651 95
GJB 150 - 86
GJB 179A — 96
GJB 360A —- 96
GJB 548A — 96
GJB 1427 — 92
GJB 2835 — 97
Semiconductor integrated circuits symbols for electrical parameters symbols for machining brass-chemical composition and product shape week number
BNC type radio frequency coaxial connector
Semiconductor discrete device symbols
General specification for optical fiber and cable connectors
Semiconductor devices discrete devices and integrated circuits Part 5 Environmental test methods for optoelectronic devices military equipment
Counting sampling inspection procedures and tables
Test methods for electronic and electrical components
Test methods and procedures for microelectronic devices
General specification for optical fiber
Specification for packaging of microcircuits
The Ministry of Electronics Industry of the People's Republic of China issued on March 18, 1998, 1998-05~ 01 Implementation
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3 Requirements
3.1 General
SI 20723 1998
The manufacturer of components supplied in accordance with this specification shall have and use equipment and instruments sufficient to ensure compliance with the requirements of this specification for production and testing, and shall formulate a quality assurance plan for the corresponding components. Whether the manufacturer of components meets the requirements of this specification shall be determined by the certification body. Only components that have been inspected and meet all the requirements of this specification can be marked with military markings or certification marks. 3.1.1 Priority
When the requirements of this specification are inconsistent with the requirements of related documents, the requirements shall be determined in the following order of priority: Information. This specification;
b, documents referenced in Chapter 2.
3.2 Qualification
The components submitted in accordance with this specification shall be qualified products. The certification body shall review the manufacturer's product quality (reliability) assurance program to determine whether it has the qualification for certification.
3.3 Product Assurance Requirements
Components submitted in accordance with this specification shall comply with the quality assurance provisions of Chapter 4 and shall be delivered in accordance with the provisions of Chapter 5. 3.3.1 Components supplied in accordance with this specification must have complete design documents, process documents, inspection documents, inspection and test records before obtaining qualification. 3.3.2 A complete set of quality assurance, management and control systems must be established during the development and production of components, which should at least include:
8. Converting user requirements into internal regulations of the contractor; b. Training and assessment of staff;
c. Inspection of incoming materials and processed parts;
d. Quality control work;
e. Quality assurance work;
f. Standards and regulations for design, process, rework, tools and materials; g. Purification and environmental control of the work area;
h. Management of technical documents and change control of design, materials and processes; i. Maintenance and metrological verification of tools, gauges, instruments and equipment; j. Analysis and data feedback of failure and non-conforming products; k. Corrective measures and their evaluation;
1. After-sales service system.
The above systems should be frequently implemented in the form of documents, and the implementation status should be recorded. 3.4 Design, Structure and Materials
The design, structure, materials and dimensions of the components supplied in accordance with this specification shall comply with the provisions of this specification. 3.4.1 Design
When designing the product, the following requirements shall be considered: a. This specification; b. The actual use requirements of the user; c. Quality information feedback from the user of the same type of components produced by the contractor. 3.4.2 Structure
In addition to meeting the requirements of the working environment such as anti-vibration, anti-interference, and heat dissipation, the overall layout of the component shall also be easy to use and maintain; the structure of the component is unidirectional, with independent receiving and transmitting parts. The light transmission adopts an infrared emitting diode with a peak wavelength of 0.85rm, and the light reception adopts a PIN photodiode plus a FET preamplifier component. 3.4.3 Packaging
Components supplied in accordance with this specification shall use a metal frame, and the upper and lower bottom covers shall be fixed with screws. The electrical connector shall be BNC-9 type, which shall comply with the provisions of GB11315. The optical fiber connector shall be FC/PC type, which shall comply with the provisions of CB12507. The optical fiber shall comply with the provisions of GJB1427.
3.4.4 Materials
a. Metal materials
The external metal of the component shall be processed brass, which shall comply with the provisions of GB5232, and the metal surface shall be chrome-plated. b. Other materials shall be inspected and qualified in accordance with the provisions of relevant documents, and shall not produce harmful effects under the specified storage and working environment.
3.4.5 Components
Components used in components supplied in accordance with this specification shall comply with the requirements of this specification and relevant detailed specifications, and shall preferably be selected in accordance with the corresponding Products that have passed the national military standard inspection. Before assembling the components, the components used should be evaluated in accordance with the provisions of Article 4.9. 3.4.6 Circuit diagram
The circuit diagram of the component is shown in Figure 1.
3.4.7 Dimensions
The dimensions (the dimensions of the light emitting part and the light receiving part are the same) should comply with the provisions of Figure 2. 3.4.8 Terminal arrangement
The terminal arrangement of the transmitting part should comply with the provisions of Figure 3 (a), and the terminal arrangement of the receiving part should comply with the provisions of Figure 3 (b).
3.4.9 Appearance quality
The appearance of the component should be smooth and free of pits and burrs. The chrome plating should be free of bubbles, cracks, and rust. The fixing screws should not be loose. The countersunk screws should not be higher than the countersunk hole surface; the markings should be clear and easy to identify. 3
TTTKAONrKAca-
SJ 20723 -- 1998
(a) Transmitter circuit diagram
(b) Receiving circuit diagram
Figure 1 Circuit diagram
TciTC2
Dimension symbols
Minimum value
Maximum value
Electrical input
3.4.10 Weight
(a) Optical transmission
The weight of the component should not exceed 0.3kg.
3.5 Maximum ratings and main optoelectronic characteristics
3.5.1 Maximum rating
40 ~ 70
- 40 ~ 70
SJ 20723 1998
Figure 2 Dimensions
Optical output
Optical input
Figure 3 Terminal arrangement
Transmitting part
Main photoelectric characteristics (-40℃≤T≤70℃)Put
（b）Optical reception
Electric clamp
Receiving part
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Output high level
Output low level
Pulse rise time
Pulse fall time
Delay time
Output value Optical power
Minimum receivable optical power
Optical reception dynamic range
SJ 20723 - 1998
Test conditions
Val=5V, Vez=12V, input pulse width 66ms single pulse, TIL level
Vcl= 5V, auxiliary pulse width 66ns single pulse, TEL level
Val = 5V, Ve2 = 12V, axis pulse width 66ns single pulse, TIL level
Note: 1) Optical power test method is in accordance with GB/T15651, 3.6 Marking
Limit value
Components should have markings in accordance with this specification, and the markings should be clear and obvious. After the test, the markings are still clear. Damage to the markings caused by mechanical test fixtures should not be used as a basis for rejection, but the markings should be reprinted to ensure that the markings are complete and clear at the time of delivery. Unless otherwise specified , each component shall include the following markings: 8. Component identification number (see 3.6.1):
b. Inspection batch identification code (see 3.6.2); c. Component serial number (see 3.6.3);
d. Contractor name and trademark (see 3.6.4); e. Each interface mark (see 3.6.5).
3.6.1 Component identification number
Each component shall be marked with an identification number according to the following example. J or J| |tt||GG6001
Military mark or certification mark Component model
3.6.1.1 Military mark or certification mark
Military mark or certification mark (according to the military component quality certification regulations) indicates military products or certified qualified products produced in accordance with the requirements of this specification.
3.6.2 Inspection batch identification code
Components should be marked with inspection batch identification code. The identification code consists of 4 Arabic numerals, the first 2 digits are the last 2 digits of the year, and the last 2 digits are the week number of the batch of components submitted for inspection. The week number should comply with the provisions of GB7408.
3.6.3 Component serial number
The serial number is used to distinguish components in the inspection batch for easy traceability. The serial number should be immediately after the inspection batch identification code.
3.6.4 Contractor name and trademark
The contractor name and trademark should be marked in accordance with the provisions of this specification. 6
3.6.5 Marking of each interface
SJ 20723 - 1998
The function of each interface shall be marked in words according to the provisions of Article 3.4.8, such as power supply, electrical input, optical output, optical input, electrical output.
3.6.6 Marking on the package
Except for Articles 3.6.3 and 3.6.5, all the marks specified in Article 3.6 and the number of this specification shall be marked on the package for delivery. 4 Quality assurance provisions
4.1 Inspection responsibilities
Unless otherwise specified, the contractor shall perform all inspections specified in this specification. The relevant competent authorities have the right to conduct any inspection specified in this specification, including performance inspection and inspection of the implementation of the product quality assurance outline, so as to ensure that the components meet the requirements of the specification.
4.2 Components stored for more than the first period of time
Components that have passed the identification inspection or quality consistency inspection and have been stored at the contractor for more than 36 months shall be re-inspected by the contractor according to all the inspection requirements of Group A inspection before delivery. If the re-inspection fails, all components shall be subjected to 100% of all inspections of the unqualified grouping. Components that do not meet any of the requirements shall be removed from the batch and rejected. 4.3 Inspection Classification
The inspections specified in this specification are divided into:
b. Component evaluation (see 4.9);
c. Screening (see 4.10);
c. Identification inspection (see 4.11);
d. Quality consistency inspection (see 4.12). 4.4 Composition of batches
4.4.1 Production batches
Components shall be divided into identifiable production batches to meet the requirements of production control. A production batch shall consist of components of the same type produced on the same production line using similar materials and components under the same manufacturing technology and control. 4.4.2 Inspection batches
Components shall be grouped into inspection batches to meet the quality assurance inspection and testing requirements of this specification. All components of each inspection batch shall be completed within a business cycle of no more than 13 weeks. Inspection batches shall be traceable from formation to receipt, and their traceability shall begin when the production batch is formed.
4.5 Sample handling
Products that have been subjected to destructive tests or failed in any test shall not be delivered as qualified products. Samples that have passed the identification or quality consistency inspection, and have undergone the non-destructive tests specified in 4.5.2 and other tests proved to be non-destructive during the inspection, and whose characteristics after the test meet the qualification criteria of Group A, may be delivered as qualified products. 4.5.1 Destructive tests
Mechanical and climatic tests shall be treated as destructive tests at the beginning. Only when the data accumulated subsequently are sufficient to show that the test is a non-destructive test, can it be regarded as a non-destructive test. If a test is repeated 5 times on a group of samples without cumulative degradation or signs of failure of the test, the test can be regarded as a non-destructive test. TKANiKAca-
4.5.2 Non-destructive test
The following tests are non-destructive tests:
External visual inspection
High temperature working test
Low temperature working test
High temperature storage test
Low temperature storage test
SJ 20723 - 1998
Items specified in this specification as screening and group A inspections should also be regarded as non-destructive. 4.6 Failures caused by equipment failure or operator error When it is determined that a failure is caused by equipment failure or operator error, the failure shall be recorded in the test record, which shall be kept for reference together with all the information confirming that such failure should not result in the failure of the component. At this time, samples shall be re-sampled for all tests of the test group. 4.7 Resubmitted batches
When any inspection batch submitted for appraisal or quality consistency inspection fails to meet the requirements of any of the inspection groups A, B or C, the contractor shall report the failure to the appraisal agency and relevant departments, and shall take corrective measures based on the reasons for the failure. After taking corrective measures approved by the appraisal agency, the unqualified inspection group shall be resubmitted for inspection. The re-inspection of group A shall be carried out 100%, and the re-inspection of groups B and C shall be carried out with double sampling (the number of failures allowed is 0) except for group C5. If group C5 fails, it can be re-tested according to the original sampling plan. If there are still failures after re-sampling inspection, the contractor shall provide the information on the failure and the corrective measures taken to the appraisal agency and relevant competent authorities for decision.
4.B Inspection and Test Methods
Inspection and test methods shall comply with the provisions of Tables 1 to 6 of this specification and the following provisions. 4.6.1 Test Conditions and Methods
a. Test conditions and methods shall comply with the provisions of this specification. If the contractor can prove to the certification body that the use of other test methods instead of the test methods specified in the standard does not relax the requirements of this specification, the alternative test methods may be used with the consent of the certification body.
h. Unless otherwise specified, tests and inspections shall be carried out under normal environmental conditions. Normal test atmospheric conditions are:
Temperature: 15%℃~35%
Relative humidity: 20%~80%
Air pressure: Test site air pressure
4.8.2 Inspection of dimensions, appearance quality and weight Use monthly measurements and measuring tools and scales that meet the accuracy requirements to inspect the components to verify whether their dimensions, appearance quality and weight meet the requirements (see 3.4.7, 3.4.9 and 3.4.10). 4.8.3 Electrical aging and steady-state life test
The components are subjected to the specified power supply voltage (Vcel=5V, Ve2=12V), and the electrical aging is continued for 96 hours at TA=70℃, and the steady-state life is continued for 500 hours. After the test is completed and the components are restored under normal atmospheric conditions for 4 hours, the main photoelectric characteristics of the tested components shall comply with the provisions of Article 3.5.2.
4.9 Component evaluation
4.9.1 General requirements
4.9.1.1 Test sequence
SJ 20723 - 1998
The group tests in Tables 1 and 2 can be carried out in any order, but the tests in a group shall be completed in the specified order.
4.9.1.2 Samples
Samples shall be randomly selected. The minimum number for evaluation is given in the sample column of Tables 1 and 2, and the corresponding number of failed acceptances is in brackets.
4.9.1.3 Evaluation location
The evaluation can be completed at the component manufacturer or at the optoelectronic assembly manufacturer. 4.9.1.4 Characteristics
The characteristics to be checked should be those required by both the component specifications and the assembly process, and at least should be those that cannot be checked after assembly but may cause functional failure. 4.9.1.5 (Opto)electrical test requirements
Optoelectronic test parameters, values, limit values ​​(including △ values ​​when applicable) and conditions should comply with the relevant detailed specifications or procurement documents.
4.9.2 Semiconductor devices
Semiconductor devices include discrete devices, integrated circuit devices, and optoelectronic devices, all of which should be evaluated according to the requirements of Table 1. Table 1 Evaluation requirements for semiconductor devices
Test items
Device (optical) electrical parameter test
External visual inspection
Stability baking
Temperature cycle
Mechanical shock
Or constant acceleration
Intermediate (optical) electrical test
Steady-state life
End point (optical) electrical test
Solderability
Pigtail tension load
Lead firmness|| tt||1010Al
1005A'
GJB548A
B, YI direction
B, Y1 direction
Soldering temperature 245℃±5℃
CJB915
Lead 10(0)
Reference chapter
Note: 1) For optoelectronic devices with optical fiber (cable), the relevant test temperature is specified as follows: high temperature 70°℃, low temperature ~40℃. 4.9.2.11 Grouping
Each semiconductor device shall be subjected to (optical) electrical testing at 25℃ as specified in the procurement documents. 4.9.2.22 Grouping
Each semiconductor device shall be visually inspected and shall comply with the applicable requirements of GJB548A Method 2009A and the requirements of the relevant detailed specifications.
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4.9.2.33 Grouping
SJ 20723 1998
When testing the test samples of semiconductor devices for mechanical tests, only one test can be selected, or the samples can be equally divided into two groups, one for mechanical impact test and the other for constant speed test. 4.9.2.4 (Photo)electric test
The minimum requirements for the intermediate (photo)electric test of semiconductor devices and the final (photo)electric test after the steady-state life test should include static tests at the following three temperatures.
b.125℃ [70℃ for devices with optical fiber (cable)1; c.-55℃ [-40℃ for devices with optical fiber (cable)]. 4.9.2.54 Grouping
The requirement for the solderability test is 10 pins, and at least 2 samples should be tested. 4.9.2.65 Grouping
Pigtail tension load is only performed on optoelectronic devices with pigtails (clipped). 4.9.3 Passive components
Passive components shall be evaluated as specified in Table 2. When the components are purchased according to the corresponding military specifications and have a certificate of conformity, no evaluation is required.
Table 2 Passive component evaluation requirements
Test items
Electrical test
External visual inspection
Stability baking
Temperature cycling
Mechanical shock
or rated acceleration
Voltage treatment
or aging (capacitors)
Electrical test
Solderability
Lead retention
4.9.3.11 Grouping
GIB 548A
B, YI direction
A, Y1 direction
Soldering temperature 245%±5°℃
Lead 10(0)
Each passive component shall be electrically tested at 25% as specified in the component procurement documents. Reference to the Children's Day
4.9.3.22 Grouping
Passive components shall be inspected monthly and shall comply with the applicable requirements of GJB548A Method 2009A and the requirements of the relevant detailed specifications. 4.9.3.33 Grouping
When testing the passive component samples for mechanical testing, only one of the items may be selected for testing, or the samples may be divided into two groups and tested separately.
4.9.3.4 Self-test
S3 20723 1998
Components shall be visually inspected to check for corrosion or damage caused by the test and process. 4.9.3.5 Electrical testing
Component samples shall be tested for the following electrical characteristics at least at 25°C: Resistors: DC resistance.
Capacitors: Ceramic capacitors - dielectric withstand voltage, insulation resistance, capacitance and loss factor. Aluminum dielectric capacitors - DC current, capacitance and loss factor. 4.9.3.64 Grouping
The requirement for solderability test is 10 leads. 4.10 Screening
Before handover or quality consistency inspection, all components shall be screened according to the items, sequence and requirements listed in Table 3. Those that do not meet the requirements of this specification shall be rejected. The rejected samples cannot be delivered as qualified products. The PDA of the aging screening is not allowed to exceed 10% or 3, whichever is greater. If the unqualified rate is 10%20%, the batch can be resubmitted once, but the PDA is not allowed to exceed %. If the PDA exceeds 20%, the batch of components cannot be accepted. 4.11 Qualification Inspection
Qualification inspection shall be carried out on the components screened according to the requirements of Section 4.10 in a laboratory approved by the certification body, including the inspections specified in Tables 4, 5 and 6.
4.11.1 Number of samples submitted for qualification inspection The number of samples submitted for qualification inspection shall be determined by the contractor, but shall be at least twice the number of samples required for Group B and Group C inspections.
4.11,2 Maintenance of Qualification
In order to maintain the qualification, the contractor shall submit a report to the certification body every 12 months. The report shall include the following:
. Summary of all Group A test results conducted, which shall at least indicate the qualified rate of the batch; h Summary of Group B and Group C test results, including the number of failures and failure modes. The summary includes the results of all Group B and Group C tests conducted and completed within 12 months. If the test result summary indicates that the requirements of the specification are not met and corrective measures approved by the certification body are not taken, the qualification of the component shall be revoked. If production is discontinued during the validity period of the report, the contractor shall submit a report stating that the contractor still maintains the necessary capabilities to produce such components.
If there is no production for three consecutive reporting periods, the contractor shall re-perform the qualification test before providing certification mark components.
4.12 Quality consistency inspection
Quality consistency inspection includes Group A inspection, Group B inspection and periodic Group C inspection conducted on a batch-by-batch basis. Within the qualified period of Group C inspection, the batches that have passed both Group A and Group B inspections can be delivered. 4.12.1 Group A inspection
Group A inspection shall consist of the various inspections and tests specified in Table 4. 4.12.2 Group B inspection
Group B inspection shall consist of the various inspections and tests specified in Table 5. The samples for Group B inspection shall be randomly selected from the inspection batches that have passed Group A inspection. 4.12.3 Group C inspection
TKANiKAca-3 Evaluation location
The evaluation can be completed at the component manufacturer or at the optoelectronic assembly manufacturer. 4.9.1.4 Characteristics
The characteristics to be checked should be those required by both the component specifications and the assembly process, at least the characteristics that cannot be checked after assembly but may cause functional failure. 4.9.1.5 (Opto)electrical test requirements
Optoelectronic test parameters, values, limit values ​​(including △ values ​​when applicable) and conditions should comply with the relevant detailed specifications or procurement documents.
4.9.2 Semiconductor devices
Semiconductor devices include discrete devices, integrated circuit devices, and optoelectronic devices, all of which should be evaluated according to the requirements of Table 1. Table 1 Evaluation requirements for semiconductor devices
Test items
Device (optical) electrical parameter test
External visual inspection
Stability baking
Temperature cycle
Mechanical shock
Or constant acceleration
Intermediate (optical) electrical test
Steady-state life
End point (optical) electrical test
Solderability
Pigtail tension load
Lead firmness|| tt||1010Al
1005A'
GJB548A
B, YI direction
B, Y1 direction
Soldering temperature 245℃±5℃
CJB915
Lead 10(0)
Reference chapter
Note: 1) For optoelectronic devices with optical fiber (cable), the relevant test temperature is specified as follows: high temperature 70°℃, low temperature ~40℃. 4.9.2.11 Grouping
Each semiconductor device shall be subjected to (optical) electrical testing at 25℃ as specified in the procurement documents. 4.9.2.22 Grouping
Each semiconductor device shall be visually inspected and shall comply with the applicable requirements of GJB548A Method 2009A and the requirements of the relevant detailed specifications.
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4.9.2.33 Grouping
SJ 20723 1998
When testing the test samples of semiconductor devices for mechanical tests, only one test can be selected, or the samples can be equally divided into two groups, one for mechanical impact test and the other for constant speed test. 4.9.2.4 (Photo)electric test
The minimum requirements for the intermediate (photo)electric test of semiconductor devices and the final (photo)electric test after the steady-state life test should include static tests at the following three temperatures.
b.125℃ [70℃ for devices with optical fiber (cable)1; c.-55℃ [-40℃ for devices with optical fiber (cable)]. 4.9.2.54 Grouping
The requirement for the solderability test is 10 pins, and at least 2 samples should be tested. 4.9.2.65 Grouping
Pigtail tension load is only performed on optoelectronic devices with pigtails (clipped). 4.9.3 Passive components
Passive components shall be evaluated as specified in Table 2. When the components are purchased according to the corresponding military specifications and have a certificate of conformity, no evaluation is required.
Table 2 Passive component evaluation requirements
Test items
Electrical test
External visual inspection
Stability baking
Temperature cycling
Mechanical shock
or rated acceleration
Voltage treatment
or aging (capacitors)
Electrical test
Solderability
Lead retention
4.9.3.11 Grouping
GIB 548A
B, YI direction
A, Y1 direction
Soldering temperature 245%±5°℃
Lead 10(0)
Each passive component shall be electrically tested at 25% as specified in the component procurement documents. Reference to the Children's Day
4.9.3.22 Grouping
Passive components shall be inspected monthly and shall comply with the applicable requirements of GJB548A Method 2009A and the requirements of the relevant detailed specifications. 4.9.3.33 Grouping
When testing the passive component samples for mechanical testing, only one of the items may be selected for testing, or the samples may be divided into two groups and tested separately.
4.9.3.4 Self-test
S3 20723 1998
Components shall be visually inspected to check for corrosion or damage caused by the test and process. 4.9.3.5 Electrical testing
Component samples shall be tested for the following electrical characteristics at least at 25°C: Resistors: DC resistance.
Capacitors: Ceramic capacitors - dielectric withstand voltage, insulation resistance, capacitance and loss factor. Aluminum dielectric capacitors - DC current, capacitance and loss factor. 4.9.3.64 Grouping
The requirement for solderability test is 10 leads. 4.10 Screening
Before handover or quality consistency inspection, all components shall be screened according to the items, sequence and requirements listed in Table 3. Those that do not meet the requirements of this specification shall be rejected. The rejected samples cannot be delivered as qualified products. The PDA of the aging screening is not allowed to exceed 10% or 3, whichever is greater. If the unqualified rate is 10%20%, the batch can be resubmitted once, but the PDA is not allowed to exceed %. If the PDA exceeds 20%, the batch of components cannot be accepted. 4.11 Qualification Inspection
Qualification inspection shall be carried out on the components screened according to the requirements of Section 4.10 in a laboratory approved by the certification body, including the inspections specified in Tables 4, 5 and 6.
4.11.1 Number of samples submitted for qualification inspection The number of samples submitted for qualification inspection shall be determined by the contractor, but shall be at least twice the number of samples required for Group B and Group C inspections.
4.11,2 Maintenance of Qualification
In order to maintain the qualification, the contractor shall submit a report to the certification body every 12 months. The report shall include the following:
. Summary of all Group A test results conducted, which shall at least indicate the qualified rate of the batch; h Summary of Group B and Group C test results, including the number of failures and failure modes. The summary includes the results of all Group B and Group C tests conducted and completed within 12 months. If the test result summary indicates that the requirements of the specification are not met and corrective measures approved by the certification body are not taken, the qualification of the component shall be revoked. If production is discontinued during the validity period of the report, the contractor shall submit a report stating that the contractor still maintains the necessary capabilities to produce such components.
If there is no production for three consecutive reporting periods, the contractor shall re-perform the qualification test before providing certification mark components.
4.12 Quality consistency inspection
Quality consistency inspection includes Group A inspection, Group B inspection and periodic Group C inspection conducted on a batch-by-batch basis. Within the qualified period of Group C inspection, the batches that have passed both Group A and Group B inspections can be delivered. 4.12.1 Group A inspection
Group A inspection shall consist of the various inspections and tests specified in Table 4. 4.12.2 Group B inspection
Group B inspection shall consist of the various inspections and tests specified in Table 5. The samples for Group B inspection shall be randomly selected from the inspection batches that have passed Group A inspection. 4.12.3 Group C inspection
TKANiKAca-3 Evaluation location
The evaluation can be completed at the component manufacturer or at the optoelectronic assembly manufacturer. 4.9.1.4 Characteristics
The characteristics to be checked should be those required by both the component specifications and the assembly process, at least the characteristics that cannot be checked after assembly but may cause functional failure. 4.9.1.5 (Opto)electrical test requirements
Optoelectronic test parameters, values, limit values ​​(including △ values ​​when applicable) and conditions should comply with the relevant detailed specifications or procurement documents.
4.9.2 Semiconductor devices
Semiconductor devices include discrete devices, integrated circuit devices, and optoelectronic devices, all of which should be evaluated according to the requirements of Table 1. Table 1 Evaluation requirements for semiconductor devices
Test items
Device (optical) electrical parameter test
External visual inspection
Stability baking
Temperature cycle
Mechanical shock
Or constant acceleration
Intermediate (optical) electrical test
Steady-state life
End point (optical) electrical test
Solderability
Pigtail tension load
Lead firmness|| tt||1010Al
1005A'
GJB548A
B, YI direction
B, Y1 direction
Soldering temperature 245℃±5℃
CJB915
Lead 10(0)
Reference chapter
Note: 1) For optoelectronic devices with optical fiber (cable), the relevant test temperature is specified as follows: high temperature 70°℃, low temperature ~40℃. 4.9.2.11 Grouping
Each semiconductor device shall be subjected to (optical) electrical testing at 25℃ as specified in the procurement documents. 4.9.2.22 Grouping
Each semiconductor device shall be visually inspected and shall comply with the applicable requirements of GJB548A Method 2009A and the requirements of the relevant detailed specifications.
KAoNrKAca-
4.9.2.33 Grouping
SJ 20723 1998
When testing the test samples of semiconductor devices for mechanical tests, only one test can be selected, or the samples can be equally divided into two groups, one for mechanical impact test and the other for constant speed test. 4.9.2.4 (Photo)electric test
The minimum requirements for the intermediate (photo)electric test of semiconductor devices and the final (photo)electric test after the steady-state life test should include static tests at the following three temperatures.
b.125℃ [70℃ for devices with optical fiber (cable)1; c.-55℃ [-40℃ for devices with optical fiber (cable)]. 4.9.2.54 Grouping
The requirement for the solderability test is 10 pins, and at least 2 samples should be tested. 4.9.2.65 Grouping
Pigtail tension load is only performed on optoelectronic devices with pigtails (clipped). 4.9.3 Passive components
Passive components shall be evaluated as specified in Table 2. When the components are purchased according to the corresponding military specifications and have a certificate of conformity, no evaluation is required.
Table 2 Passive component evaluation requirements
Test items
Electrical test
External visual inspection
Stability baking
Temperature cycling
Mechanical shock
or rated acceleration
Voltage treatment
or aging (capacitors)
Electrical test
Solderability
Lead retention
4.9.3.11 Grouping
GIB 548A
B, YI direction
A, Y1 direction
Soldering temperature 245%±5°℃
Lead 10(0)
Each passive component shall be electrically tested at 25% as specified in the component procurement documents. Reference to the Children's Day
4.9.3.22 Grouping
Passive components shall be inspected monthly and shall comply with the applicable requirements of GJB548A Method 2009A and the requirements of the relevant detailed specifications. 4.9.3.33 Grouping
When testing the passive component samples for mechanical testing, only one of the items may be selected for testing, or the samples may be divided into two groups and tested separately.
4.9.3.4 Self-test
S3 20723 1998
Components shall be visually inspected to check for corrosion or damage caused by the test and process. 4.9.3.5 Electrical testing
Component samples shall be tested for the following electrical characteristics at least at 25°C: Resistors: DC resistance.
Capacitors: Ceramic capacitors - dielectric withstand voltage, insulation resistance, capacitance and loss factor. Aluminum dielectric capacitors - DC current, capacitance and loss factor. 4.9.3.64 Grouping
The requirement for solderability test is 10 leads. 4.10 Screening
Before handover or quality consistency inspection, all components shall be screened according to the items, sequence and requirements listed in Table 3. Those that do not meet the requirements of this specification shall be rejected. The rejected samples cannot be delivered as qualified products. The PDA of the aging screening is not allowed to exceed 10% or 3, whichever is greater. If the unqualified rate is 10%20%, the batch can be resubmitted once, but the PDA is not allowed to exceed %. If the PDA exceeds 20%, the batch of components cannot be accepted. 4.11 Qualification Inspection
Qualification inspection shall be carried out on the components screened according to the requirements of Section 4.10 in a laboratory approved by the certification body, including the inspections specified in Tables 4, 5 and 6.
4.11.1 Number of samples submitted for qualification inspection The number of samples submitted for qualification inspection shall be determined by the contractor, but shall be at least twice the number of samples required for Group B and Group C inspections.
4.11,2 Maintenance of Qualification
In order to maintain the qualification, the contractor shall submit a report to the certification body every 12 months. The report shall include the following:
. Summary of all Group A test results conducted, which shall at least indicate the qualified rate of the batch; h Summary of Group B and Group C test results, including the number of failures and failure modes. The summary includes the results of all Group B and Group C tests conducted and completed within 12 months. If the test result summary indicates that the requirements of the specification are not met and corrective measures approved by the certification body are not taken, the qualification of the component shall be revoked. If production is discontinued during the validity period of the report, the contractor shall submit a report stating that the contractor still maintains the necessary capabilities to produce such components.
If there is no production for three consecutive reporting periods, the contractor shall re-perform the qualification test before providing certification mark components.
4.12 Quality consistency inspection
Quality consistency inspection includes Group A inspection, Group B inspection and periodic Group C inspection conducted on a batch-by-batch basis. Within the qualified period of Group C inspection, the batches that have passed both Group A and Group B inspections can be delivered. 4.12.1 Group A inspection
Group A inspection shall consist of the various inspections and tests specified in Table 4. 4.12.2 Group B inspection
Group B inspection shall consist of the various inspections and tests specified in Table 5. The samples for Group B inspection shall be randomly selected from the inspection batches that have passed Group A inspection. 4.12.3 Group C inspection
TKANiKAca-Y1 direction
Soldering temperature 245℃±5℃
CJB915
Lead 10(0)
Reference chapter
Note: 1) For optoelectronic devices with optical fiber (cable), the relevant test temperature is specified as follows: high temperature 70°℃, low temperature ~40℃. 4.9.2.11 Grouping
Each semiconductor device shall be subjected to (optical) electrical testing at 25℃ as specified in the procurement documents. 4.9.2.22 Grouping
Each semiconductor device shall be visually inspected and shall comply with the applicable requirements of GJB548A Method 2009A and the requirements of the relevant detailed specifications.
KAoNrKAca-
4.9.2.33 Grouping
SJ 20723 1998
When testing the test samples of semiconductor devices for mechanical tests, only one test can be selected, or the samples can be equally divided into two groups, one for mechanical impact test and the other for constant speed test. 4.9.2.4 (Photo)electric test
The minimum requirements for the intermediate (photo)electric test of semiconductor devices and the final (photo)electric test after the steady-state life test should include static tests at the following three temperatures.
b.125℃ [70℃ for devices with optical fiber (cable)1; c.-55℃ [-40℃ for devices with optical fiber (cable)]. 4.9.2.54 Grouping
The requirement for the solderability test is 10 pins, and at least 2 samples should be tested. 4.9.2.65 Grouping
Pigtail tension load is only performed on optoelectronic devices with pigtails (clipped). 4.9.3 Passive components
Passive components shall be evaluated as specified in Table 2. When the components are purchased according to the corresponding military specifications and have a certificate of conformity, no evaluation is required.
Table 2 Passive component evaluation requirements
Test items
Electrical test
External visual inspection
Stability baking
Temperature cycling
Mechanical shock
or rated acceleration
Voltage treatment
or aging (capacitors)
Electrical test
Solderability
Lead retention
4.9.3.11 Grouping
GIB 548A
B, YI direction
A, Y1 direction
Soldering temperature 245%±5°℃
Lead 10(0)
Each passive component shall be electrically tested at 25% as specified in the component procurement documents. Reference to the Children's Day
4.9.3.22 Grouping
Passive components shall be inspected monthly and shall comply with the applicable requirements of GJB548A Method 2009A and the requirements of the relevant detailed specifications. 4.9.3.33 Grouping
When testing the passive component samples for mechanical testing, only one of the items may be selected for testing, or the samples may be divided into two groups and tested separately.
4.9.3.4 Self-test
S3 20723 1998
Components shall be visually inspected to check for corrosion or damage caused by the test and process. 4.9.3.5 Electrical testing
Component samples shall be tested for the following electrical characteristics at least at 25°C: Resistors: DC resistance.
Capacitors: Ceramic capacitors - dielectric withstand voltage, insulation resistance, capacitance and loss factor. Aluminum dielectric capacitors - DC current, capacitance and loss factor. 4.9.3.64 Grouping
The requirement for solderability test is 10 leads. 4.10 Screening
Before handover or quality consistency inspection, all components shall be screened according to the items, sequence and requirements listed in Table 3. Those that do not meet the requirements of this specification shall be rejected. The rejected samples cannot be delivered as qualified products. The PDA of the aging screening is not allowed to exceed 10% or 3, whichever is greater. If the unqualified rate is 10%20%, the batch can be resubmitted once, but the PDA is not allowed to exceed %. If the PDA exceeds 20%, the batch of components cannot be accepted. 4.11 Qualification Inspection
Qualification inspection shall be carried out on the components screened according to the requirements of Section 4.10 in a laboratory approved by the certification body, including the inspections specified in Tables 4, 5 and 6.
4.11.1 Number of samples submitted for qualification inspection The number of samples submitted for qualification inspection shall be determined by the contractor, but shall be at least twice the number of samples required for Group B and Group C inspections.
4.11,2 Maintenance of Qualification
In order to maintain the qualification, the contractor shall submit a report to the certification body every 12 months. The report shall include the following:
. Summary of all Group A test results conducted, which shall at least indicate the qualified rate of the batch; h Summary of Group B and Group C test results, including the number of failures and failure modes. The summary includes the results of all Group B and Group C tests conducted and completed within 12 months. If the test result summary indicates that the requirements of the specification are not met and corrective measures approved by the certification body are not taken, the qualification of the component shall be revoked. If production is discontinued during the validity period of the report, the contractor shall submit a report stating that the contractor still maintains the necessary capabilities to produce such components.
If there is no production for three consecutive reporting periods, the contractor shall re-perform the qualification test before providing certification mark components.
4.12 Quality consistency inspection
Quality consistency inspection includes Group A inspection, Group B inspection and periodic Group C inspection conducted on a batch-by-batch basis. Within the qualified period of Group C inspection, the batches that have passed both Group A and Group B inspections can be delivered. 4.12.1 Group A inspection
Group A inspection shall consist of the various inspections and tests specified in Table 4. 4.12.2 Group B inspection
Group B inspection shall consist of the various inspections and tests specified in Table 5. The samples for Group B inspection shall be randomly selected from the inspection batches that have passed Group A inspection. 4.12.3 Group C inspection
TKANiKAca-Y1 direction
Soldering temperature 245℃±5℃
CJB915
Lead 10(0)
Reference chapter
Note: 1) For optoelectronic devices with optical fiber (cable), the relevant test temperature is specified as follows: high temperature 70°℃, low temperature ~40℃. 4.9.2.11 Grouping
Each semiconductor device shall be subjected to (optical) electrical testing at 25℃ as specified in the procurement documents. 4.9.2.22 Grouping
Each semiconductor device shall be visually inspected and shall comply with the applicable requirements of GJB548A Method 2009A and the requirements of the relevant detailed specifications.
KAoNrKAca-
4.9.2.33 Grouping
SJ 20723 1998
When testing the test samples of semiconductor devices for mechanical tests, only one test can be selected, or the samples can be equally divided into two groups, one for mechanical impact test and the other for constant speed test. 4.9.2.4 (Photo)electric test
The minimum requirements for the intermediate (photo)electric test of semiconductor devices and the final (photo)electric test after the steady-state life test should include static tests at the following three temperatures.
b.125℃ [70℃ for devices with optical fiber (cable)1; c.-55℃ [-40℃ for devices with optical fiber (cable)]. 4.9.2.54 Grouping
The requirement for the solderability test is 10 pins, and at least 2 samples should be tested. 4.9.2.65 Grouping
Pigtail tension load is only performed on optoelectronic devices with pigtails (clipped). 4.9.3 Passive components
Passive components shall be evaluated as specified in Table 2. When the components are purchased according to the corresponding military specifications and have a certificate of conformity, no evaluation is required.
Table 2 Passive component evaluation requirements
Test items
Electrical test
External visual inspection
Stability baking
Temperature cycling
Mechanical shock
or rated acceleration
Voltage treatment
or aging (capacitors)
Electrical test
Solderability
Lead retention
4.9.3.11 Grouping
GIB 548A
B, YI direction
A, Y1 direction
Soldering temperature 245%±5°℃
Lead 10(0)
Each passive component shall be electrically tested at 25% as specified in the component procurement documents. Reference to the Children's Day
4.9.3.22 Grouping
Passive components shall be inspected monthly and shall comply with the applicable requirements of GJB548A Method 2009A and the requirements of the relevant detailed specifications. 4.9.3.33 Grouping
When testing the passive component samples for mechanical testing, only one of the items may be selected for testing, or the samples may be divided into two groups and tested separately.
4.9.3.4 Self-test
S3 20723 1998
Components shall be visually inspected to check for corrosion or damage caused by the test and process. 4.9.3.5 Electrical testing
Component samples shall be tested for the following electrical characteristics at least at 25°C: Resistors: DC resistance.
Capacitors: Ceramic capacitors - dielectric withstand voltage, insulation resistance, capacitance and loss factor. Aluminum dielectric capacitors - DC current, capacitance and loss factor. 4.9.3.64 Grouping
The requirement for solderability test is 10 leads. 4.10 Screening
Before handover or quality consistency inspection, all components shall be screened according to the items, sequence and requirements listed in Table 3. Those that do not meet the requirements of this specification shall be rejected. The rejected samples cannot be delivered as qualified products. The PDA of the aging screening is not allowed to exceed 10% or 3, whichever is greater. If the unqualified rate is 10%20%, the batch can be resubmitted once, but the PDA is not allowed to exceed %. If the PDA exceeds 20%, the batch of components cannot be accepted. 4.11 Qualification Inspection
Qualification inspection shall be carried out on the components screened according to the requirements of Section 4.10 in a laboratory approved by the certification body, including the inspections specified in Tables 4, 5 and 6.
4.11.1 Number of samples submitted for qualification inspection The number of samples submitted for qualification inspection shall be determined by the contractor, but shall be at least twice the number of samples required for Group B and Group C inspections.
4.11,2 Maintenance of Qualification
In order to maintain the qualification, the contractor shall submit a report to the certification body every 12 months. The report shall include the following:
. Summary of all Group A test results conducted, which shall at least indicate the qualified rate of the batch; h Summary of Group B and Group C test results, including the number of failures and failure modes. The summary includes the results of all Group B and Group C tests conducted and completed within 12 months. If the test result summary indicates that the requirements of the specification are not met and corrective measures approved by the certification body are not taken, the qualification of the component shall be revoked. If production is discontinued during the validity period of the report, the contractor shall submit a report stating that the contractor still maintains the necessary capabilities to produce such components.
If there is no production for three consecutive reporting periods, the contractor shall re-perform the qualification test before providing certification mark components.
4.12 Quality consistency inspection
Quality consistency inspection includes Group A inspection, Group B inspection and periodic Group C inspection conducted on a batch-by-batch basis. Within the qualified period of Group C inspection, the batches that have passed both Group A and Group B inspections can be delivered. 4.12.1 Group A inspection
Group A inspection shall consist of the various inspections and tests specified in Table 4. 4.12.2 Group B inspection
Group B inspection shall consist of the various inspections and tests specified in Table 5. The samples for Group B inspection shall be randomly selected from the inspection batches that have passed Group A inspection. 4.12.3 Group C inspection
TKANiKAca-5 Electrical Tests
Component samples shall be subjected to the following electrical characteristic tests at least at 25°C: Resistors: DC resistance.
Capacitors: Ceramic capacitors - dielectric withstand voltage, insulation resistance, capacitance and loss factor. Aluminum dielectric capacitors - DC current, capacitance and loss factor. 4.9.3.64 Grouping
The requirement for solderability test is 10 leads. 4.10 Screening
Before handover appraisal or quality consistency inspection, all components shall be screened according to the items, sequence and requirements listed in Table 3. Those that do not meet the requirements of this specification shall be removed. The removed samples shall not be delivered as qualified products. The PDA of the aging screening is not allowed to exceed 10% or 3, whichever is greater. If the unqualified rate is 10%-20%, the batch can be resubmitted once, but the PDA is not allowed to exceed %. If the PDA exceeds 20%, the batch of components cannot be accepted. 4.11 Qualification Tests
Qualification tests shall be conducted on the components screened in accordance with the requirements of 4.10 in a laboratory approved by the certification body, including the tests specified in Tables 4, 5 and 6.
4.11.1 Number of samples submitted for qualification tests The number of samples submitted for qualification tests shall be determined by the contractor, but shall be at least twice the number of samples required for Group B and Group C tests.
4.11.2 Maintenance of qualification
In order to maintain qualification, the contractor shall submit a report to the certification body every 12 months. The report shall include the following:
. A summary of all Group A test results conducted, which shall at least indicate the qualified percentage of the batch; h Summary of Group B and Group C test results, including the number and failure mode of failure. The summary shall include the results of all Group B and Group C tests conducted and completed within 12 months. If the test result summary shows non-conformity with the specification requirements and no corrective measures approved by the certification body are taken, the component shall be disqualified. If production is discontinued during the validity period of the report, the contractor shall submit a report stating that the contractor still maintains the necessary capabilities to produce such components.
If production has not occurred for three consecutive reporting periods, the contractor shall re-perform identification tests before providing certification mark components.
4.12 Quality consistency inspection
Quality consistency inspection includes Group A inspection and Group B inspection conducted batch by batch and Group C inspection conducted periodically. Within the qualified period of Group C inspection, batches that pass both Group A and Group B inspections can be delivered. 4.12.1 Group A inspection
Group A inspection shall consist of the inspections and tests specified in Table 4. 4.12.2 Group B inspection
Group B inspection shall consist of the inspections and tests specified in Table 5. Samples for Group B inspection shall be randomly selected from inspection batches that have passed Group A inspection. 4.12.3 Group C inspection
TKANiKAca-5 Electrical Tests
Component samples shall be subjected to the following electrical characteristic tests at least at 25°C: Resistors: DC resistance.
Capacitors: Ceramic capacitors - dielectric withstand voltage, insulation resistance, capacitance and loss factor. Aluminum dielectric capacitors - DC current, capacitance and loss factor. 4.9.3.64 Grouping
The requirement for solderability test is 10 leads. 4.10 Screening
Before handover appraisal or quality consistency inspection, all components shall be screened according to the items, sequence and requirements listed in Table 3. Those that do not meet the requirements of this specification shall be removed. The removed samples shall not be delivered as qualified products. The PDA of the aging screening is not allowed to exceed 10% or 3, whichever is greater. If the unqualified rate is 10%-20%, the batch can be resubmitted once, but the PDA is not allowed to exceed %. If the PDA exceeds 20%, the batch of components cannot be accepted. 4.11 Qualification Tests
Qualification tests shall be conducted on the components screened in accordance with the requirements of 4.10 in a laboratory approved by the certification body, including the tests specified in Tables 4, 5 and 6.
4.11.1 Number of samples submitted for qualification tests The number of samples submitted for qualification tests shall be determined by the contractor, but shall be at least twice the number of samples required for Group B and Group C tests.
4.11.2 Maintenance of qualification
In order to maintain qualification, the contractor shall submit a report to the certification body every 12 months. The report shall include the following:
. A summary of all Group A test results conducted, which shall at least indicate the qualified percentage of the batch; h Summary of Group B and Group C test results, including the number and failure mode of failure. The summary shall include the results of all Group B and Group C tests conducted and completed within 12 months. If the test result summary shows non-conformity with the specification requirements and no corrective measures approved by the certification body are taken, the component shall be disqualified. If production is discontinued during the validity period of the report, the contractor shall submit a report stating that the contractor still maintains the necessary capabilities to produce such components.
If production has not occurred for three consecutive reporting periods, the contractor shall re-perform identification tests before providing certification mark components.
4.12 Quality consistency inspection
Quality consistency inspection includes Group A inspection and Group B inspection conducted batch by batch and Group C inspection conducted periodically. Within the qualified period of Group C inspection, batches that pass both Group A and Group B inspections can be delivered. 4.12.1 Group A inspection
Group A inspection shall consist of the inspections and tests specified in Table 4. 4.12.2 Group B inspection
Group B inspection shall consist of the inspections and tests specified in Table 5. Samples for Group B inspection shall be randomly selected from inspection batches that have passed Group A inspection. 4.12.3 Group C inspection
TKANiKAca-
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