GB/T 15877-1995 Specification for etched dual-row package lead frame
time:
2024-08-08 13:38:43
- GB/T 15877-1995
- in force
Standard ID:
GB/T 15877-1995
Standard Name:
Specification for etched dual-row package lead frame
Chinese Name:
蚀刻型双列封装引线框架规范
Standard category:
National Standard (GB)
-
Date of Release:
1995-01-02 -
Date of Implementation:
1996-08-01
Standard ICS number:
Electronics>>31.200 Integrated Circuits, MicroelectronicsChina Standard Classification Number:
Electronic Components and Information Technology>>Microcircuit>>L55 Microcircuit Comprehensive
Release date:
1995-12-22Review date:
2004-10-14Drafting Organization:
Ningbo Integrated Circuit FactoryFocal point Organization:
National Semiconductor Device Standardization Technical CommitteePublishing Department:
State Bureau of Technical SupervisionCompetent Authority:
Ministry of Information Industry (Electronics)
Description (Translated English) / downloadSkip to download
Summary:
This specification specifies the technical requirements and inspection rules for semiconductor integrated circuit etched dual-row package lead frames. This specification is applicable to semiconductor integrated circuit plastic dual-row package lead frames, and other package lead frames can also be used as a reference. GB/T 15877-1995 Etched dual-row package lead frame specification GB/T15877-1995 Standard download decompression password: www.bzxz.net
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