GB/T 15877-1995 Specification for etched dual-row package lead frame

time: 2024-08-08 13:38:43
  • GB/T 15877-1995
  • in force

Basic Information

standard classification number

  • Standard ICS number:

    Electronics>>31.200 Integrated Circuits, Microelectronics
  • China Standard Classification Number:

    Electronic Components and Information Technology>>Microcircuit>>L55 Microcircuit Comprehensive

associated standards

  • Procurement status:

    SEMI G19:1984

Publication information

  • publishing house:

    China Standards Press
  • Publication date:

    1996-08-01

Other Information

  • Release date:

    1995-12-22
  • Review date:

    2004-10-14
  • Drafting Organization:

    Ningbo Integrated Circuit Factory
  • Focal point Organization:

    National Semiconductor Device Standardization Technical Committee
  • Publishing Department:

    State Bureau of Technical Supervision
  • Competent Authority:

    Ministry of Information Industry (Electronics)
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Summary:

This specification specifies the technical requirements and inspection rules for semiconductor integrated circuit etched dual-row package lead frames. This specification is applicable to semiconductor integrated circuit plastic dual-row package lead frames, and other package lead frames can also be used as a reference. GB/T 15877-1995 Etched dual-row package lead frame specification GB/T15877-1995 Standard download decompression password: www.bzxz.net
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