GB/T 5593-1996 Structural ceramic materials for electronic components

This standard specifies the requirements, test methods, inspection rules, marking, packaging, transportation, storage, etc. of structural ceramic materials for electronic devices. This standard is applicable to various ceramic materials used in device parts, electron tubes, resistor substrates, semiconductors and integrated circuits. GB/T 5593-1996 Structural ceramic materials for electronic components GB/T5593-1996 Standard download decompression password: www.bzxz.net

ICS31.030
National Standard of the People's Republic of China
GB/T5593—1996
Structural ceramic materials used in electronic components
Structure ceramic materials used in electronic components1996-09-09
State Bureau of Technical Supervision
Implementation on 1997-05-01
GB/T5593-1996
Cited standards
Test methods
Inspection rules
Marking, packaging, transportation and storage
GB/T5593-1996
This standard text is the first revised version of the national standard GB5593-85 "Structural ceramic materials used in electronic components". This standard amends GB5593-85 according to the requirements of national standard GB/T1.1-1993; supplements and amends some performance indicators of structural ceramic materials for electronic components; and amends the shape, size and requirements of test samples in GB5593-85 according to the provisions of national standards GB4457-446084 and GB1182-1184-80. This standard replaces GB5593-85 from the date of implementation. This standard is proposed by the Ministry of Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the Standardization Institute of the Ministry of Electronics Industry. The drafting units of this standard are: Beijing Vacuum Electronic Technology Institute and Standardization Institute of the Ministry of Electronics Industry. The main drafters of this standard are: Gao Longqiao, Xiao Yongguang, Zeng Guisheng, Tan Shaohua, and Wang Yugong. 1 Scope
National Standard of the People's Republic of China
Structural ceramic materials for electronic components
Structure ceramic materials used in electronic components GB/T5593--1996
Replaces GB5593-85
This standard specifies the requirements, test methods, inspection rules, marking, packaging, transportation, storage, etc. of structural ceramic materials for electronic components (hereinafter referred to as ceramic materials).
This standard applies to various ceramic materials used for device parts, electron tubes, resistor substrates, semiconductors and integrated circuits. 2 Referenced standards
The provisions contained in the following standards constitute the provisions of this standard through reference in this standard. When this standard is published, the versions shown are valid. All standards will be revised, and parties using this standard should explore the possibility of using the latest versions of the following standards. GB1966—80
GB241381
GB2421—89
GB5592—85
Test method for apparent porosity and bulk density of porous ceramics. Measurement method for bulk density of piezoelectric ceramic materials. General rules for basic environmental testing procedures for electrical and electronic products. Nomenclature of names and grades of structural ceramic materials for electronic components. GB5594.1—85
GB5594.2—85
GB5594.3—85
GB5594.4—85||tt ||GB5594.5—85
GB5594.6-85
Test methods for performance of structural ceramic materials for electronic components Test methods for performance of structural ceramic materials for electronic components Test methods for performance of structural ceramic materials for electronic components Test methods for performance of structural ceramic materials for electronic components Test methods for performance of structural ceramic materials for electronic components GB5594.7—85
Test methods for performance of structural ceramic materials for electronic components GB5594.8--85
GB 5597-85
GB 5598--85
GB9530--88
3 Definitions
Test methods for performance of structural ceramic materials for electronic components Test method for microwave complex permittivity of solid dielectrics Determination method for thermal conductivity of beryllium oxide ceramics
Terminology of electronic ceramics
The definitions used in this standard conform to the provisions of GB9530. 4 Requirements
4.1 Classification and naming
Test method for air tightness
Test method for Young's elastic modulus and Poisson's ratio
Test method for average linear expansion coefficient
Test method for dielectric loss tangent
Test method for volume resistivity
Test method for chemical stability
Test method for liquid permeability
Determination method for microstructure
Ceramic materials are classified according to Table 1 based on their uses and properties. The naming of their names and grades shall comply with the provisions of GB5592. 4.2 Performance
The physical properties, electrical properties, chemical properties, etc. of ceramic materials shall comply with the provisions of Table 1. Approved by the State Bureau of Technical Supervision on September 9, 1996, and implemented on May 1, 1997
Volume density
Air tightness
Liquid permeability
Flexural strength
Elastic modulus
Poisson's ratio
Thermal shock resistance
Linear expansion coefficient
Thermal conductivity
Dielectric constant
Dielectric loss tangent
Volume resistivity
Breakdown strength
Chemical stability
Porosity
Grain size
Test conditions
20℃~100℃
20℃～500℃
20℃~800℃
100℃
500℃
300℃
500℃
1:9HCI
10%Na0H
GB/ T5593-1996
Units and symbols
x10-6/C
X10-°/C
X10-*/C
W/m·K
mg/cm2www.bzxz.net
Mullite porcelain
Mainly used as
Resistor
Mullite porcelain
≥>100
≥>1012
Mainly used as||tt| |Large equipment
≥120
≥102
Suitable for general equipment
Forsterite
≥110
≥150
0.20~0.25
10.5~11.5
≥103
≥1010
Used as small
Electric vacuum zero|| tt||75%Al.0, porcelain 90%Ai0: porcelain
95%A1,0, porcelain
≥200
≥1012
Can be used as
high mechanical strength
device parts
≥230
≥250
0.20~0.25
≥1013
Used as tube
shell and packaging
≥28 0
≥280
0.20~0.25
≥1013
Used as tube shell
And circuit substrate
GB/T5593—1996
99%Al,0 porcelain
≥300
≥10t3
Used as tube shell
And circuit substrate
Transparent porcelain
≥300
≥1 0″
Used as integrated
circuit substrate,
output window
A·Porous
Porous Al,O: Porcelain
≥1013
Used as insulator and attenuation
material inside the tube
95%BeO Porcelain
≥146
≥1013
99%BeO Porcelain
≥140||tt| |≥176
Used as high temperature, high thermal conductivity insulation parts
and semiconductor device substrates
5 Test methods
GB/T5593-1996
5.1 Unless otherwise specified in this standard, all tests on ceramic materials shall be conducted under normal test atmospheric conditions specified in GB2421 (temperature 15℃～35℃, relative humidity 45%～75%, air pressure 86kPa～106kPa). 5.2 The shape, size, requirements and quantity of the samples used in the test shall comply with the provisions of Table 2 of this standard. Except for the test items of porous porcelain and three-centimeter band (10GHz), when measuring the electrical properties of ceramic materials, both sides of the sample shall be covered with a complete silver layer as an electrode by the sintering method according to the requirements of Table 2. Table 2
Volume density
Air tightness
Flexural strength
Number of samples
(1) Round
(2) Square
Shape, size and requirements
0.25±0.02
Elastic modulus, Poisson's ratio
Heat exposure resistance (thermal stability)
Expansion coefficient||tt| |GB/T5593—1996
Table 2 (continued)
Number of samples
Shape, size and requirements
120±1
$20±1
Both ends should be ground flat, and their verticality should not be greater than 0.050
Thermal conductivity
High temperature loss
Dielectric constant, dielectric
Loss angle positive
GB/T5593-1996
Table 2 (continued)
Number of samples
Shape, size and requirements
$35±5
$65±0.05
Silver layer
2.3±0.04
2.5±0.02
Volume resistivity
Breakdown strength
Chemical stability
GB/T5593-1996
Table 2 (end)
Number of samples
Silver coating
Shape, size and requirements
$26±1
$35±5
5.3 When measuring the bulk density of ceramic materials, the method specified in GB2413 shall be followed. 5.4 When measuring the air tightness of ceramic materials, the method specified in GB5594.1 shall be followed. Silver coating
s'0王
5.5 When measuring the liquid permeability of ceramic materials, the manufacturer shall generally conduct a red absorption inspection of the product under normal pressure. The manufacturer shall ensure that the product does not absorb red. If any problem is found, the two parties may jointly take samples for re-inspection, and the inspection shall be carried out in accordance with the method specified in GB5594.7. 5.6 When measuring the flexural strength of ceramic materials, the distance between the fulcrums should be 5 cm, the load should be applied to the center of the sample, the speed of load increase should not exceed 39 N/s, and the measurement error should not exceed ±10%. Flexural strength. Calculate according to the following formula: Cylindrical specimen: (1) Where: g—flexural strength, MPa; P—flexural load, N; L—distance between fulcrums, cm; GB/T5593-1996 D—diameter of the fractured section of the specimen, cm. Square section specimen; Where: g—flexural strength, MPa; P—flexural load, N; L—distance between fulcrums, cm; b—width of the fractured section of the specimen, cm; h—thickness of the fractured section of the specimen, cm.
5.7·When measuring the elastic modulus and Poisson's ratio of ceramic materials, the method specified in GB5594.2 shall be followed. (2)
5.8When measuring thermal shock resistance (thermal stability), the sample shall be cleaned and dried in a heating box at 120℃±10℃, cooled naturally to room temperature, and then placed in a heating furnace at the specified test temperature for 30 minutes. The sample shall be taken out and placed on an asbestos board, cooled naturally to room temperature under normal test atmospheric conditions, and then placed in a heating furnace at the specified temperature. The test shall be repeated until the specified number of times. Finally, the sample shall be immersed in a 1% fuchsin solution for 3 minutes, taken out, cleaned, and wiped dry. When observing the sample under the light, there shall be no cracks or bursts. For A-90, A-95, A-99, A-99.5, B-95, and B-99 ceramic materials, the specified temperature is 800℃±10℃, and repeated 10 times is qualified. For M2S ceramic materials, the test temperature is 400℃±10℃, and it is qualified after five repetitions. 5.9 The linear expansion coefficient of ceramic materials shall be measured according to the method specified in GB5594.3. 5.10 The thermal conductivity of ceramic materials shall be measured according to the method specified in GB5598. 5.11 The dielectric constant and dielectric loss tangent of ceramic materials shall be measured according to 5.11.1~5.11.4. 5.11.1. When measuring the dielectric constant of ceramic materials (except 10GHz), any method and instrument that ensures that the measurement voltage is not greater than 5V and the test error is not greater than 2% can be used.
The test frequency is 1MHz±0.3MHz.
The test result is calculated according to the following formula:
Where: e dielectric constant;
C—capacitance of the sample, PF;
h thickness of the sample, cm;
D—diameter of the sample, cm
5.11.2 When measuring the dielectric loss tangent of ceramic materials (except 10GHz), the method with a test error not greater than (0.1tano+0.0002) can be used.
Test frequency: 1MHz±0.5MHz.
Tano in the test error is the dielectric loss tangent of the sample. The test voltage should not be greater than 15V, and the sample should be carefully cleaned before testing. For the measurement of dielectric loss tangent of AS2, MS and A-75 ceramic materials after being dampened, the sample should be boiled in distilled water for 1 hour, cooled to room temperature in water, taken out and wiped dry with filter paper or clean gauze, and then placed in normal test atmosphere for 2 hours, and measured immediately.
5.11.3 When measuring the high-temperature dielectric loss tangent and dielectric constant of ceramic materials, the method specified in GB5594.4 shall be followed. 8N;
L—distance between supporting points, cm;
b-width of fractured section of specimen, cm;
h thickness of fractured section of specimen, cm.
5.7·When measuring elastic modulus and Poisson's ratio of ceramic materials, the method specified in GB5594.2 shall be followed. (2)
5.8When measuring thermal shock resistance (thermal stability), the specimen shall be cleaned and dried in a heating box at 120℃+10℃, cooled naturally to room temperature, and then placed in a heating furnace at the specified test temperature for 30 minutes. Take out the specimen and place it on an asbestos board, cool it naturally to room temperature under normal test atmospheric conditions, and then place the specimen in a heating furnace at the specified temperature. Repeat the test until the specified number of times. Finally, immerse it in a 1% fuchsin solution for 3 minutes, take it out, wash it, wipe it dry, and observe the sample under the light. There should be no cracks or bursts. For A-90, A-95, A-99, A-99.5, B-95, B-99 ceramic materials, the specified temperature is 800℃±10℃, repeated 10 times to pass. For M2S ceramic materials, the test temperature is 400℃±10℃, repeated five times to pass. 5.9 The linear expansion coefficient of ceramic materials shall be measured according to the method specified in GB5594.3. 5.10 The thermal conductivity of ceramic materials shall be measured according to the method specified in GB5598. 5.11 The dielectric constant and dielectric loss tangent of ceramic materials shall be measured according to 5.11.1~5.11.4. 5.11.1. When measuring the dielectric constant of ceramic materials (except 10GHz), any method and instrument that ensures that the measurement voltage is not greater than 5V and the test error is not greater than 2% can be used.
The test frequency is 1MHz±0.3MHz.
The test result is calculated according to the following formula:
Where: e dielectric constant;
C—capacitance of the sample, PF;
h thickness of the sample, cm;
D—diameter of the sample, cm
5.11.2 When measuring the dielectric loss tangent of ceramic materials (except 10GHz), the method with a test error not greater than (0.1tano+0.0002) can be used.
Test frequency: 1MHz±0.5MHz.
Tano in the test error is the dielectric loss tangent of the sample. The test voltage should not be greater than 15V, and the sample should be carefully cleaned before testing. For the measurement of dielectric loss tangent of AS2, MS and A-75 ceramic materials after being dampened, the sample should be boiled in distilled water for 1 hour, cooled to room temperature in water, taken out and wiped dry with filter paper or clean gauze, and then placed in normal test atmosphere for 2 hours, and measured immediately.
5.11.3 When measuring the high-temperature dielectric loss tangent and dielectric constant of ceramic materials, the method specified in GB5594.4 shall be followed. 8N;
L—distance between supporting points, cm;
b-width of fractured section of specimen, cm;
h thickness of fractured section of specimen, cm.
5.7·When measuring elastic modulus and Poisson's ratio of ceramic materials, the method specified in GB5594.2 shall be followed. (2)
5.8When measuring thermal shock resistance (thermal stability), the specimen shall be cleaned and dried in a heating box at 120℃+10℃, cooled naturally to room temperature, and then placed in a heating furnace at the specified test temperature for 30 minutes. Take out the specimen and place it on an asbestos board, cool it naturally to room temperature under normal test atmospheric conditions, and then place the specimen in a heating furnace at the specified temperature. Repeat the test until the specified number of times. Finally, immerse it in a 1% fuchsin solution for 3 minutes, take it out, wash it, wipe it dry, and observe the sample under the light. There should be no cracks or bursts. For A-90, A-95, A-99, A-99.5, B-95, B-99 ceramic materials, the specified temperature is 800℃±10℃, repeated 10 times to pass. For M2S ceramic materials, the test temperature is 400℃±10℃, repeated five times to pass. 5.9 The linear expansion coefficient of ceramic materials shall be measured according to the method specified in GB5594.3. 5.10 The thermal conductivity of ceramic materials shall be measured according to the method specified in GB5598. 5.11 The dielectric constant and dielectric loss tangent of ceramic materials shall be measured according to 5.11.1~5.11.4. 5.11.1. When measuring the dielectric constant of ceramic materials (except 10GHz), any method and instrument that ensures that the measurement voltage is not greater than 5V and the test error is not greater than 2% can be used.
The test frequency is 1MHz±0.3MHz.
The test result is calculated according to the following formula:
Where: e dielectric constant;
C—capacitance of the sample, PF;
h thickness of the sample, cm;
D—diameter of the sample, cm
5.11.2 When measuring the dielectric loss tangent of ceramic materials (except 10GHz), the method with a test error not greater than (0.1tano+0.0002) can be used.
Test frequency: 1MHz±0.5MHz.
Tano in the test error is the dielectric loss tangent of the sample. The test voltage should not be greater than 15V, and the sample should be carefully cleaned before testing. For the measurement of dielectric loss tangent of AS2, MS and A-75 ceramic materials after being dampened, the sample should be boiled in distilled water for 1 hour, cooled to room temperature in water, taken out and wiped dry with filter paper or clean gauze, and then placed in normal test atmosphere for 2 hours, and measured immediately.
5.11.3 When measuring the high-temperature dielectric loss tangent and dielectric constant of ceramic materials, the method specified in GB5594.4 shall be followed. 8
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