Method for measurement of remaiming viscose stress of glass powder for soldering with low-melt point

SJ 3232.2-1989 Test method for residual stress of low melting welding glass powder SJ3232.2-1989 Standard download decompression password: www.bzxz.net

Standard of Ministry of Machinery and Electronics Industry of the People's Republic of China Test method for residual stress of low-melting welding glass powder bonding 1 Subject content and scope of application 1.1 Subject content This standard specifies the determination of residual stress of low-melting welding glass powder bonding. 1.2 Scope of application This standard is applicable to low-melting welding glass powder used in color picture tubes and other electronic devices 2 Key points of the method SJ3232.2-89 Mix the low-melting welding glass powder into a paste and apply it on a stress-free DB442 glass sheet. After firing, observe and measure the stress on the glass sheet.
3 Instruments and materials
Test furnace: 30KW, structural diagram is the same as SJ3231 low-melting welding glass powder Appendix A1.1.3.1
3.2 Polarimeter: POLARIMETERMODEL33; 3.3 Magnetic stirrer
3.4 ​​Viscometer: VGA--L type; bzxZ.net
3.5 Stainless steel block: size 1×b×h, mm: 50×22×11 (×4); 3.6 Glass sheet: DB442, size 1×b×h, mm: 38×19×4, the two parallel planes of 38×4 are polished surfaces, and the rest are ground surfaces.
3.7 Beaker: 3000ml, 50ml;
Ground bottle: 2500ml;
3.9 Burette: 10ml;
3.10 Isoamyl acetate (analytical grade);
3.11 Saltpeter cotton.
4 Determination steps
Preparation of the blending agent
Dry the saltpeter cotton in a fume hood for more than 12 hours, and then place it in a dryer for 10 hours. Weigh 50g and carefully add it to the beaker pre-filled with 1000ml of isoamyl acetate. Place the beaker on a magnetic stirrer and stir while adding the saltpeter cotton until the saltpeter cotton is completely dissolved. Determine its viscosity. Approved by the Ministry of Machinery and Electronics Industry of the People's Republic of China on March 20, 1989, and implemented on March 25, 1989
SJ3232.2--89
Put the above-mentioned saltpeter cotton solution on a magnetic stirrer, add isoamyl acetate while stirring to adjust the viscosity to 25±1CPS (25℃). Move the prepared concoction agent to a ground-mouth bottle for storage and use it after two weeks. 4.2 Weigh 3.5g of glass powder sample into a 50ml beaker, add about 0.3ml of concoction agent, and stir into a uniform paste. Pour it onto the DB442 glass sheet surrounded by a stainless steel block (as shown in Figure 2), vibrate it to make it evenly distributed, dry it in a fume hood for about 30 minutes, carefully remove the stainless steel block, scrape the concoction on the polished surface with a knife, and dry it in an oven at 110-120℃ for 20 minutes. Then move it into the test furnace and let in compressed air at 3.5Lmin-1. Sinter it according to the heat treatment procedure: room temperature 410, heating rate 7.5℃min-1, 410~440℃ at 3.5℃·min-1, 440℃, keep warm for 40min, 440~350℃, cooling rate 2.5Cmin-cut off the power. Turn off the compressed air and cool it naturally to room temperature.
4.3 Place the treated sample horizontally on the measuring table of the polarimeter, with the polished surface of the sample parallel to the measuring table. Turn the polarimeter dial to move the dark line on the polished surface to the boundary between the glass and the low-melting solder glass, read the dial reading at this time, then turn the dial to move the dark line to the other side of the polished surface of the glass, and then read the dial reading 5. Calculation of test results
The bonding residual stress is calculated as follows:
F=3.3×(R1-R2)
Where: R1-the reading of the dark line on the boundary, nm; R2-the reading of the dark line on the other side of the polished surface of the glass: m; H-the distance between the two polished surfaces of the glass, nm; 3.3-photoelastic coefficient.
Additional notes:
This standard is under the jurisdiction of the Electronic Standardization Research Institute of the Ministry of Machinery and Electronics Industry. This standard was drafted by Factory 4400.
The main drafters of this standard are Shi Jifen and Li Guanghui, -2
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