SJ 20780-2000 Specification for flame retardant aluminum-based copper-clad laminates

SJ 20780-2000 Flame retardant aluminum-based copper-clad laminate specification SJ20780-2000 standard download decompression password: www.bzxz.net

Military standard of the electronics industry of the People's Republic of China FL5999
SJ20780—2000
Specification for flame resistant aluminum base copper-clad laminated sheets Issued on 2000-10-20
Implementation on 2000-10-20
Approved by the Ministry of Information Industry of the People's Republic of China Military standard of the electronics industry of the People's Republic of China Specification for flame resistant aluminum base copper-clad laminated sheets
Specification for flame resistaluminum base copper-ciad laminated sheets 1 Scope
1.1 Subject content
SJ 20780—2000
This specification specifies the performance requirements, test methods and quality assurance provisions for flame retardant aluminum base copper clad laminated sheets (hereinafter referred to as aluminum base copper clad sheets).
1.2 Scope of application
This specification is applicable to flame-retardant aluminum-based foil-clad laminates and aluminum-based foil-clad laminates for high-frequency circuits. 1.3 Classification
1.3.1 Model representation
The aluminum-based foil-clad laminates specified in this specification are divided into three categories according to their characteristics. The models and characteristics are shown in Table 1. Table 1 Models and characteristics
LF--01
LF—02
1.3.2 Code representation
General thermal resistance R≤2.0C/W
Commercial heat dissipation thermal resistance R≤1.5C/W
Thermal resistance for high-frequency circuits R≤2.0C/W
The base material of aluminum-based foil-clad laminates is represented by two letters. The first letter represents the type of base material, and the second letter represents the resin system. The base material and resin codes are as follows: L: Metal aluminum plate
F: Flame retardant epoxy resin
I Polyimide resin
2 Reference documents
GB1409-88 Test method for relative dielectric constant and dielectric loss tangent of solid electrical insulating materials at power frequency, audio frequency and high frequency
GB4677.5-84 Test method for warpage of printed boards GB/T4722-92 Test method for copper-clad laminates for printed circuits Issued by the Ministry of Information Industry of the People's Republic of China on October 20, 2000 2000-10~20 Implementation
GB/T5230--95 Electrolytic copper foil
SJ207B0--2000
GB10569-89 High-quality aluminum and aluminum alloy cold-rolled plate GJB2142-94 General specification for metal foil laminates for printed circuit boards GJB1651--93 Test methods for metal foil laminates for printed circuits 3 Requirements
3.1 Materials and structure
Lead-based foil laminates are made of aluminum substrate, insulating adhesive layer, single-sided or double-sided copper foil. Its structure is shown in Figure 1: Aluminum plate
3.1.1 Copper foil
Insulating layer
Figure 1 Aluminum-based double-sided copper foil laminate
Copper foil should comply with GB/T5230 regulations.
3.1.2 Aluminum plate
Aluminum plate shall comply with the provisions of GB10569.
3.2 Dimensions and deviations
3.2.1 Nominal plate dimensions and allowable deviations shall comply with the provisions of Table 2. Non-nominal plate dimensions and their deviations shall be agreed upon by the supplier and the buyer.
Table 2 Nominal plate dimensions and allowable deviations
Nominal plate dimensions (length × width)
500×500
3.2.2 Nominal thickness and deviation
Nominal thickness and deviation of aluminum-based foil-clad plates shall comply with the provisions of Table 3. Allowable deviation
Table 3 Nominal thickness and allowable deviation
Nominal thickness1
(excluding saw foil)
0.5≤0.8
1.04≤1.7
1.7<1≤2.6
Verticality
Allowable deviation
SJ20780--2000
When the vertical height of aluminum-based foil-clad plates is inspected in accordance with Chapter 24 of GB/T4722, it shall comply with the provisions of Table 4. 3.2.4 Warpage
When the warpage of aluminum-based foil-clad plates is inspected in accordance with GB4677.5, it shall comply with the provisions of Table 5. Table 4 Verticality
Board size (length × width)
500×500
Covered board thickness
0.50~0.78
Maximum size of test specimen
200~300
200~300
200~300
Table 5 Warpage
Allowable warpage!
Single-sided foil-clad board
Maximum value %
Double-sided foil-clad board
Test method
GB 4677.5
Note: 1) When measuring the warpage, the test size should not be greater than 300mmx300mm. If it is a whole board or the side length is greater than 300mm, it should be cut into 300mmx300mm. However, the side length used in calculation is the measured side length. 3.3 Appearance
3.3.1 The end faces of the aluminum-based clad box board should be neat and should not have delamination, cracks or burrs. 3.3.2 The aluminum plate surface is flat, the oxide film is uniform and smooth, and there should be no defects such as dents, cracks, scratches, etc. that affect use. 3.3.3 The copper foil surface should not have bubbles, wrinkles, pinholes, scratches, pitting and glue spots that affect use. Any discoloration or dirt should be able to be wiped off with a hydrochloric acid solution with a density of 1.02g/cm2 or a suitable organic solvent. 3.4 Performance requirements
The various properties of the aluminum-based foil clad board should comply with the requirements of Table 6. - 3 -
Minimum peel strength
Minimum surface resistivity
Minimum volume resistivity
Minimum breakdown voltage
Maximum dielectric constant
Maximum dielectric loss factor
Blistering test after thermal shock
Flammability
Minimum arc resistance S
Minimum thermal resistance C/W
Test conditions
After thermal stress
C-96/35/90
C-96/35/90
0-96/35/90
After recovery
C-96/35/90
After recovery
SJ 20780—2000
1×105
1×106
LF—02
1×10s
No delamination
No blistering
Test method
4010 in GJB1651
5020 in GJB 1651
5020 in GJB165I
5040 in GJB 1651
Appendix A
Chapter 17 in GB/T4722
Chapter 26 in GB4722
(The specimen is an insulating substrate pressed into 0.8 mm
friction)
GJB 1651 5060
Appendix B
Note: 1) The performance indicators of dielectric constant and dielectric loss factor of LI~11 aluminum-based foil-clad laminates at high frequencies shall be negotiated by the supply and demand parties. 4 Quality Assurance Provisions
4.1 Inspection Classification
The inspection classification specified in this specification is as follows:
B. Identification Inspection:
b. Quality Consistency Inspection.
4.2 Identification Inspection
When the product is finalized for production, the raw materials and process are changed, or the production and product certification are resumed after one year of suspension, the normal production products shall be subject to identification inspection, and the identification inspection items shall be all the items specified in Chapter 3 of this standard. 4.2.1 Sampling Plan
A sufficient number of samples shall be randomly selected from the normal production products of the application identification model. 4.2.2 Determination of failure
If one item fails, the identification test is determined to be unqualified. The determination of failure of each inspection item of the sample shall be in accordance with the corresponding performance requirements and test method clauses of this specification. 4.3 Extended scope of identification of aluminum-based clad plate
$J 207802000
The nominal thickness, copper foil type, and nominal copper foil quality of aluminum-based foil clad plate The extended scope of identification shall be in accordance with 4, 5.3.1 of GJB2142.
4.4 Quality consistency inspection
4.4.1 Delivery inspection
Product delivery inspection includes Group A inspection and Group B inspection. 4. 4. 1. 1 Inspection batch
The same (same batch or equivalent) materials, using the same process, 200 products continuously pressed are considered a batch. 4.4. 1.2 Group A inspection
Group A inspection is carried out in accordance with the provisions of Table 7
Table 7 Group A inspection
Length and width
Verticality
Curvature
Copper foil surface
Aluminum substrate surface
Requirement clause
4.4.1.2.1 Sampling plan
Inspection method
GJB2142
Chapter 24 of GB/T 4722
GB 4677.5
All products should be inspected for Group A items. 4.4.1.2.2 Rejection of lot
Specimen size
Number of specimens
Number of defects allowed
If the Group A inspection does not meet the number of defects allowed in Table 7, the inspection lot shall be rejected. The supplier may screen out defective products and resubmit them for inspection. Such batches shall be separated from the received batches or the newly submitted batches for inspection and clearly marked.
4.4.1.2.3 Sample processing
Samples that have passed the Group A inspection shall be retained for the Group B inspection. 4. 4. 1. 3 Group B inspection
Group B inspection includes the inspection items specified in Table 8. Table 8 Group B test
Peel strength
Heat shock blister test
4.4.1.3.1 Sampling plan
Test conditions
Requirement clause
Test method
Method 4010 in GJB 1651
Chapter 17 in GB/T 4722
Allowable number of defects
Group B inspection shall be randomly selected from batches that have passed the Group A inspection, and the number of samples randomly selected from each batch of products shall be no less than one.
4.4.1.3.2 Rejection of Batch
If the Group B inspection does not meet the number of defects allowed in Table 7, the inspection batch is unqualified. The supplier shall take appropriate corrective measures and resubmit the inspection batch for re-inspection. The re-inspection batch shall be subject to stricter inspection. If the re-inspection still fails, the batch shall be rejected.
4.4.1.3.3 Handling of Samples
SJ 2Q780—2000
Samples that pass the Group B inspection can be delivered according to the contract or order. 4. 4. 2 Group C Inspection
Group C inspection is a periodic inspection. Group C inspection is in accordance with the provisions of Table 9. Table 9 Test of Group C
Peel strength
Surface resistivity
Volume resistivity
Breakdown voltage
Dielectric constant
Dielectric loss factor
Flammability
4.4.2.tSampling plan
Test conditions
After thermal stress
C-96/35/90
C-96/35/90
C-96/35/90 after recovery
C-96/35/90 after recovery
Requirement Clause No.
Test method
Method 4010 in GJB1651
Method 5020 in GJB1651
Method 5020 in GJB1651
Method 5040 in GJB 1651
Appendix A
Appendix A
Chapter 26 in GB/T 74722
Appendix Day
Sampling period
(month)
Samples for Group C inspection shall be taken from batches that have passed Group B inspection, and the sample size shall comply with the provisions of Table 10. Table 10
Total number of foil-clad laminates produced
in each sampling period (sheets)
Not more than 100
101~1000
100110000
Not less than 10001
4.4.2.2 Unqualified
C group inspection sampling plan
Sample size
Number of unqualified judgments
If the sample units drawn according to the sampling plan do not pass the C group inspection, the batch of products is judged to be unqualified. 4.4.2.3 Handling of unqualified
According to the provisions of Article 4.6.2.1.4 of GJB2142. 5 Delivery preparation
Delivery preparation shall be in accordance with the provisions of Chapter 5 of GJB2142. 6
A1 Key points of the method
SJ20780--2000
Appendix A
Measurement method of dielectric constant and dielectric loss factor - Variable Q value series resonance method (supplement)
This method uses the principle of connecting the sample and the tuning capacitor in series to the commercial frequency circuit to measure the quality factor Q value of the series circuit to measure the dielectric constant and dielectric loss factor of large capacitance, small resistance, and small inductance plate-shaped samples. The measurement principle is shown in Figure A1.
Zx: Test piece L1: Auxiliary inductor Gl: High-frequency oscillation power supply C1, C2: Tuning capacitor PI voltmeter (Q meter) Figure A1 Measurement principle diagram
A2 Equipment, instruments and materials
A2.1 Fuzzy current thickness gauge (TC-103 or equivalent instrument), range 0~200μum, accurate to ±1μm. A2.2 The Q value measurement range of the Q meter is 10600, the capacitance measurement range is 0～400pF, and the accuracy is ±0.2pF A2.3 Electrode device, the electrode device should be clean, and its dielectric loss should be as small as possible. Use a two-electrode system, the electrode size and other requirements are in accordance with the provisions of GB1409, A2.4 0.02 mm annealed aluminum foil.
A2.5 Medical vaseline or silicone grease.
A2.6 High-frequency oscillation power supply, lazy frequency 0.1MHz～100MHz. A3 Sample
A3.1 Cut and process 4 square test pieces of 55mmx55mm. A3.2 Etch and remove the copper foil according to method 3031 in GJB[651. A4 Procedure
A4.1 Use a very small amount of medical vaseline or silicone grease or other low dielectric loss materials to stick the aluminum foil on the sample. No pores and wrinkles should be visible on the aluminum foil.
A4.2Pre-treat the sample according to the product standard and attach a Φ50mm electrode. The upper and lower electrodes are aligned concentrically. -7 -
SJ 20780--2000
A4.3Connect the series fixture and the micrometer electrode according to the schematic diagram. A4.4Adjust the frequency and select an appropriate auxiliary inductor to connect to the circuit. A4.5Put the test sample into the micrometer electrode and tighten it in parallel. A4.6Tighten the short-circuit ring on the series fixture to short-circuit the test sample, adjust the tuning capacitor to make the test circuit resonate, and record C, and
A4.7Release the short-circuit ring to connect the test sample to the test circuit, adjust the tuning capacitor again to make the test circuit resonate, and record and C2.
A4.BMeasure the thickness of the insulation layer of each sample and record the average value of the three-point thickness of each sample. A5 Calculation
The dielectric loss factor and dielectric constant are calculated as follows: C,O -C,
Where: 6-Dielectric constant:
gs——Dielectric loss factor;
A——Electrode area, cm;
d-Insulation layer thickness, cm
4C, ----|Ci-C,l.
g= 0.08854x10-12 F/cm.
A6 Result
A6.1 The average value of the dielectric constant of the four samples is the test result. A6.2 The average value of the dielectric loss factor of the four samples is the test result. A7 Report
a. The individual values ​​and average values ​​of the three samples measured: b. The pretreatment conditions of the samples;
The environmental conditions during the measurement:
d. Any abnormal phenomenon or deviation from the prescribed procedure during the measurement. 8
B1 Method Principle
SJ20780--2000
Appendix B
Thermal Resistance Test Method
(Supplement)
Temperature difference is the driving force of heat transfer. Under stable working conditions, the heat conduction is PT-T,/R, where P is the heat conduction (W), T, T, are the surface temperatures on both sides of the object (\C), and R is the thermal resistance (C/W). See Figure B1 for a schematic diagram of thermal resistance measurement.
Temperature measurement point 1 transistor
Thermal grease
Temperature measurement point 2
Insulation layer
An aluminum plate
Thermal grease
Figure B1 Schematic diagram of thermal resistance measurement
B2 Instruments and materials
B2.1 A high-power transistor with a power of 5W and a TO-220 packageB2.2 A high-power transistor power supply (consisting of a DC voltage regulator and related circuits) to keep the transistor in a DC steady state.
B2.3 A radiator made of copper plate and placed in a constant temperature water tank. B2.4 Two thermometers, the temperature sensors are required to be placed at the two temperature measuring points shown in Figure B1, and the influence on the temperature of the two points can be ignored.
B3 Specimen
B3.1 Two specimens with the size of 30mmx40mmx plate thickness. B4 Procedure
B4.1 The specimens are treated for not less than 16 hours at a temperature of 15 °C~35 °C, a relative humidity of 45%~75%, and a pressure of 86 kPa~106 kPa.
B4.2 As shown in Figure 1, place the sensors of the thermometer at temperature measuring points 1 and 2, apply thermal grease to the contact part of the sample transistor and the contact part of the radiator and the sample, and fix the three together so that there is no gap between the transistor and the sample, and between the sample and the radiator.
B4.3 Connect the transistor to the power supply. B4.4 Turn on the power supply switch, record the temperature of temperature measuring point 1 and temperature measuring point 2 every 5 minutes, and when the temperature stabilizes, set the timer (about 30 minutes), read T, and 7 from the temperature display. And measure the voltage VcE between the collector and emitter of the transistor and the collector current I.
B5 Calculate the thermal resistance R-
Where: P=VceIc
R— Thermal resistance:
VcE—Voltage between the collector and emitter of the triode; Ic—Collector current of the triode.
Take the arithmetic mean of the thermal resistance of the two samples in each group as the test result. Additional remarks:
This specification is proposed by the Ministry of Information Industry. bzxZ.net
This specification is under the jurisdiction of the China Electronics Technology Standardization Institute. This specification was drafted by the State-owned No. 704 Factory. The drafters of this specification are Gao Yanru, Tong Xiaoming, Han Jiangzhou, Wang Huanbao, and Li Xiaolan. The project code of this specification is B85002. - 10 -
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