SJ 20749-1999 Detailed specification for flame retardant copper-clad polytetrafluoroethylene glass cloth laminate

This specification specifies the classification, requirements and test methods of flame retardant copper foil PTFE glass cloth laminated substrate (referred to as foil-clad laminate) for microwave printed boards. This specification is applicable to flame retardant copper foil PTFE glass cloth laminated sheets for microwave printed boards. SJ 20749-1999 Flame retardant copper foil PTFE glass cloth laminated sheets Detailed specification SJ20749-1999 Standard download decompression password: www.bzxz.net

Military Standard of the People's Republic of China for Electronic Industry FL5999
Flame-retardant copper clad
SJ 20749-1999
Detail Specification for flame-resistant copper clad PTFE glass cloth laminate1999-11-10Promulgated
Implementation on 1999-12-01
Approved by the Ministry of Information Industry of the People's Republic of China Military Standard of the People's Republic of China for Electronic Industry Detail specification for flame-resistant coppercladPTFEglassclothlaminate
SJ20749—1999
All requirements for flame-retardant copper clad PTFE glass cloth laminate for microwave printed boards specified in this specification are stipulated by this specification and GJB2142--94 "General Specification for Metal Foil Laminates for Printed Circuit Boards". 1 Scope
1.1 Subject Content
This specification specifies the classification, requirements and test methods of flame-retardant copper-clad polytetrafluoroethylene glass cloth laminates (referred to as foil-clad laminates) for microwave printed boards.
1.2 Scope of Application
This specification applies to flame-retardant copper-clad polytetrafluoroethylene glass cloth laminates for microwave printed boards. 1.3 Classification
1.3.1 The classification of foil-clad laminates is shown in Table 1.
Dielectric thickness
2 Reference documents
Table 1 Classification of foil-clad boards
Copper foil quality
152, 305
Test method for microwave complex dielectric constant of solid dielectrics Perturbation method GJB7265.1—87
GB/T1263690 Stripline test method for complex dielectric constant of microwave dielectric substrate GJB1651-93 Test method for metal-clad laminates for printed circuits GJB2142-94·General specification for metal-clad laminates for printed circuit boards 3 Requirements
See Table 2 for requirements.
Promulgated by the Ministry of Information Industry of the People's Republic of China on November 10, 1999 and implemented on December 1, 1999
Peel strength (minimum value)
152g/mm2 copper:
Accepted state
After thermal stress
At high temperature
After exposure to process solution
305g/mm2 copper:
Accepted state
After thermal stress
At high temperature
SJ20 749—1999
Table 2 Requirements and test methods
Test conditions
150°℃
After exposure to process solution
Volume resistivity (minimum value) MQ-cm
After moisture
At high temperature
Surface resistivity (minimum value) MQ
After moisture
At high temperature
Water absorption (maximum value) %
Breakdown voltage (minimum value)
( Parallel to the plate surface)
Dimensional stability (maximum value)
Arc resistance (minimum value)
Flexural strength (minimum value)
Relative dielectric constant
Dielectric loss factor (maximum value)
E-—24/150
E-24/150
E-1/105
+D-24/23
E-4/105+
E-4/105
D-48/105+
C-24/23
C-24/23
Dielectric thickness
1×105
0.25mm:0.20
0.5mm:0.20
Not applicable
Not applicable
2.70±0.05
2.55±0.05
Dielectric thickness
1×104
0.8mm: 0.20
1.6mm;0.10www.bzxz.net
2.3mm：0.08
3mm：0.08
6mm：0.05
2.70±0.05
2.55±0.05
Test method
GJB1651
Method 4010
GJB1651
Method 5020
GJB1651
Method 6010
GJB1651
Method 5030
GJB1651
Method 2020
GJB1651
Method 5060
GJB1651
Method 4020
GB/T1263
(Arbitration Law)
GB7265
Additional Notes:
SJ20749—1999
This specification is under the jurisdiction of China Electronics Standardization Institute. This specification was drafted by Taizhou Wangling Insulation Material Factory and Taizhou High Frequency Copper Clad Plate Factory. The main drafters of this specification are: Gu Genshan, Tong Xiaoming, Lai Zhaosheng, and Zhu Deming.
Project code: B75006.
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