JB/T 6306-1992 Dimensions of power semiconductor modules

JB/T 6306-1992 Power semiconductor module dimensions JB/T6306-1992 standard download decompression password: www.bzxz.net

Mechanical Industry Standard of the People's Republic of China
JB/T 6306-1992
Dimensions of Power Semiconductor Modules
Issued on 1992-06-26
Implementation of the Ministry of Machinery and Electronics Industry of the People's Republic of China on 1993-01-01
Mechanical Industry Standard of the People's Republic of China
Dimensions of Power Semiconductor Modules
This standard specifies the shape code, shape dimensions and installation dimensions of power semiconductor modules. This standard applies to power semiconductor modules with a current of 5A and above. ×××口×口
JB/T 6306-1992
One letter, indicating the derived shape type Sequence number One digit, indicating the number of main terminals
One letter, indicating the shape structure form (see Table 1) Two digits, indicating the sequence number of the shape classification One digit, indicating the number of module installation (screw) holes 1 Shape code
Shape structure form, see Table 1.
Structural form
One-way lead type
With heat sink
One-way heat sink type
Note: If a new derived type serial number is required due to the difference in terminals (leads), the serial number should be applied to the technical management unit. 2
Dimension symbols and meanings
The maximum height of the module shell (excluding leads); the width of the module;
The maximum width of the terminal that can be arranged on the module; the minimum installation width at the module mounting hole;
The diameter of the module mounting (screw) hole:
The minimum installation plane diameter at the module mounting hole; the maximum height of the module;
The length of the module,
The maximum length of the terminal that can be arranged on the module; the minimum installation length outside the module mounting hole;
The distance between mounting holes;
The maximum thickness of the mounting base.
3 Dimension series
The dimension series of one-way leaded modules shall comply with the provisions of Figure 1 and Table 2. Approved by the Ministry of Machinery and Electronics Industry on June 26, 1992 and implemented on January 1, 1993
Dimension code
001AX口
002AX口
003AX口
004AX口
JB/T63061992
Should be specified in the enterprise standard and product manual, the same below. Note: The shape, size and position of the lead-out terminals are as follows: 3.2 Dimension series of modules with heat sinks 3.2.1 The dimensions of modules with single (screw) holes and heat sinks shall comply with the requirements of Figure 2 and Table 3. 3.2.2 The dimensions of modules with double holes and heat sinks shall comply with the requirements of Figure 3 and Table 4. Inch
Appearance code
201B×口
202B×口
JB/T63061992
The appearance dimensions of the four-hole module with heater shall comply with the provisions of Figure 4 and Table 5 3.2.3
Appearance code
401BX口
402BX口
Appearance dimension series of one-way radiator type module 3.3
JB/T 6306—1992
The appearance dimensions of the single-hole one-way radiator type module shall comply with the provisions of Figure 5 and Table 6. l
Appearance codewwW.bzxz.Net
101F×口
102F×口
103F×口
104F×口
The dimensions of the double-hole one-way heat sink type module shall comply with the requirements of Figure 6 and Table 7. 3.3.2
JB/T6306-1992
Appearance code
201F×口
202F×口
203F×口
204F×口
205F×口
206F×口
207F×口
208F×口
The dimensions of the four-hole one-way heat sink type module shall comply with the requirements of Figure 7 and Table 8. 3.3.3
Appearance code
401F×口
402F×口
493F×口
404F×口
405F×口
406F×口
JB/T 6306-1992
JB/T6306-1992
Schematic diagram of the appearance code for power semiconductor modules (reference)
1102F4A Appearance diagram of power semiconductor module, see Figure A1. A1
A2202F5A Appearance diagram of power semiconductor module, see Figure A2. Additional remarks:
JB/T 6306-1992
This standard is proposed and managed by the Xi'an Power Electronics Technology Research Institute of the Ministry of Machinery and Electronics Industry. This standard was drafted by Xi'an Power Electronics Technology Research Institute and Shanghai Rectifier General Factory. The main drafters of this standard are Chen Zesheng, Gu Kanglin and Cheng Jie.
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