SJ 20278-1993 Detailed specification for semiconductor integrated circuits JC4014, JC4015 and JC4021 CMOS shift registers

SJ 20278-1993 Semiconductor Integrated Circuits JC4014, JC4015 and JC4021 CMOS Shift Registers Detailed Specification SJ20278-1993 Standard Download Decompression Password: www.bzxz.net

Military Standard for Electronic Industry of the People's Republic of China FL5692
Semiconductor Integrated Circuits
SJ20278--93
Detail specification for types JC4014. JC4015 andJC4021 shift registers of CMOS semiconductor integrated circuitsPublished on May 11, 1993
Implemented on July 1, 1993
Published by the Ministry of Machinery and Electronics Industry of the People's Republic of China 1 Scope
1.1 Contents of the topic...
1.2 Applicable scope...3 Classification
2 Reference documents
Detailed requirements
Design, construction and dimensions
Lead materials and coating
Electrical characteristics
Electrical test requirements
Division of microcircuit groups
Quality assurance regulations
Sampling and inspection
Qualification inspection
Quality consistency inspection
Inspection methods
4.6 Data report
5 Delivery preparation||t t||5.1 Packaging requirements
6 Notes
Ordering information
6.2 Abbreviations, symbols and definitions
Substitution
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People's Republic of China Electronic Industry Military Standard Semiconductor Integrated Circuits
JC4104, JC4015 and JC4021 types
Detail specification for types JC4014.JC401S and JC4021shift registers of CMos semiconductor integrated circuits1 Scope
1.1 Subject content
SJ 20278—93
This specification specifies the detailed requirements for silicon monolithic JC4014, JC4015 and JC4021 types CMOS shift registers (hereinafter referred to as devices).
1.2 Scope of Application
This specification applies to the development, production and procurement of devices. 1.3 Classification
The devices given in this specification are classified by device model, device grade, packaging form, rated value, and recommended operating conditions. 1.3.1 Device Numbering
The device numbering shall comply with the provisions of Section 3.6.2 of GJB597 Microcircuit General Specifications. 1.3.1.1 Device model
The device models are as follows:
JC4014
JC401S
JC4021
1.3.1.2 Device grade
Device name
8-bit shift register (serial input, serial output)
Dual 4-bit shift register (serial input, parallel output)8-bit shift register (asynchronous parallel input, step input/output)The devices should be Class B as specified in Article 3.4 of GJB597 (see Section 3.6.2.3 of GJB 597) and Class B1 as specified in this specification.
1.3.1.3 Packaging form
The packaging form is as follows:
Approved by the Ministry of Machinery and Electronics Industry of the People's Republic of China on May 11, 1993 and implemented on July 1, 1993
SJ 2027893
Packaging type
DI6S3 (ceramic dual-row package)
F16X2 (ceramic flat package)
H16X2 (ceramic flat package)
J16S3 (ceramic double-row package)
Note: 1) According to GB7092 "Outline Dimensions of Semiconductor Integrated Circuits". 1.3.2 Absolute maximum ratings
The absolute maximum ratings are as follows:
Power supply voltage
Input current
Storage temperature
Lead soldering resistance temperature (10s)
1.3.3 Recommended operating conditions
The recommended operating conditions are as follows:
Power supply voltage
Working environment temperaturewww.bzxz.net
Referenced documents
GB3431.1—82 Semiconductor integrated circuit symbol symbol for electrical parameters GB3431.2—86 Conductor integrated circuit symbol symbol for terminal function symbol GB3834-83 Basic principles of semiconductor integrated circuit CMOS circuit test methods GB4590-84 Mechanical and climatic test methods for semiconductor integrated circuits GB4728.12-85 Graphic symbols for electrical diagrams Binary logic units GB7092 Dimensions of semiconductor integrated circuits GJB548-88 Test methods and procedures for microelectronic devices GJB597-88 General specifications for microcircuits GIBZ105 Manual for control of anti-static discharge of electronic products 3 Requirements 3.1 Detailed requirements All requirements shall be in accordance with the provisions of GJB597 and this specification. -2 - KAoNrKAca- 3.2 Design, structure and dimensions SJ2027893 Design, structure and dimensions shall comply with the provisions of GJB597 and this specification. 3.2.1 Logic symbols, logic diagrams and terminal arrangement The logic symbols, logic diagrams and terminal arrangement shall comply with the provisions of Figure 1. The terminal arrangement is the screen gauge diagram. a.JC4014
Logic symbol
CP(10)
D,(11)
134(13)
Dst14)
De(15)
- (2) Q5
Terminal arrangement
D, F, H, J type
16□Vpp
12□Q
Logic diagram
Logic symbol
2D, (15)
SJ 20278--93
Leader arrangement
D, F, H
28,□2
16 Vep
13 z0a
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Logic diagram (1/2)
JC4021
Logic symbol
HP GLOAM
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Dg ciy
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Logic diagram
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SJ 20278—93
Leader arrangement
D, F, H, J Figure 1 Logic symbol, logic diagram and pin arrangement 3.2.2 Function table The function table should be as follows: SJ 20278-93 Q (internal) Parallel transmission JC4015 JC4021 Qa (internal) Parallel transmission 3.2.3 Electrical schematic The electrical schematic should be submitted to the appraisal organization before appraisal. 3.2.4 Package form
The package form shall comply with the provisions of Article 1.3.1.3 of this specification. 3.3 Lead material and coating
Lead material inspection and coating shall comply with the provisions of Section 3.5.6 of GJB597. 3.4 Electrical characteristics
The output characteristics shall comply with the provisions of Table 1 of this specification. 3.5 Electrical test requirements
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SJ20278—93
The electrical test requirements of the device shall be the relevant groups specified in Table 2 of this specification, and the electrical tests of each group shall comply with the provisions of Table 3.
3.6 Marking
Device marking shall comply with the provisions of Article 3.6 of GJB597. 3.6.1 Total dose radiation hardening marking
Total dose radiation hardening marking shall comply with the provisions of Article 3.6.2 of GJB597. 3.6.2 Correctness of marking
After marking the device number, all devices shall be subjected to the final electrical test specified in Table 2, and may also be subjected to specially designed and approved electrical tests to verify the accuracy of the device number marking. 3.7 Division of microcircuit groups
The devices involved in this specification are the 40th microcircuit (compared to Appendix E of GJB597). SJ 20278—93
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