GB/T 15878-1995 Specification for lead frames for small outline packages

time: 2024-08-08 13:37:58
  • GB/T 15878-1995
  • in force

Basic Information

standard classification number

  • Standard ICS number:

    Electronics>>31.200 Integrated Circuits, Microelectronics
  • China Standard Classification Number:

    Electronic Components and Information Technology>>Microcircuit>>L55 Microcircuit Comprehensive

associated standards

  • Procurement status:

    SEEDS G28:1986

Publication information

  • publishing house:

    China Standards Press
  • Publication date:

    1996-08-01

Other Information

  • Release date:

    1995-12-22
  • Review date:

    2004-10-14
  • Drafting Organization:

    Xiamen Yonghong Electronics Company
  • Focal point Organization:

    National Semiconductor Device Standardization Technical Committee
  • Publishing Department:

    State Bureau of Technical Supervision
  • Competent Authority:

    Ministry of Information Industry (Electronics)
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Summary:

This specification specifies the technical requirements and inspection rules for semiconductor integrated circuit small outline package (SOP) lead frame. This specification is applicable to semiconductor integrated circuit plastic small outline package punching type lead frame. GB/T 15878-1995 Small outline package lead frame specification GB/T15878-1995 Standard download decompression password: www.bzxz.net
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