GB/T 15878-1995 Specification for lead frames for small outline packages
time:
2024-08-08 13:37:58
- GB/T 15878-1995
- in force
Standard ID:
GB/T 15878-1995
Standard Name:
Specification for lead frames for small outline packages
Chinese Name:
小外形封装引线框架规范
Standard category:
National Standard (GB)
-
Date of Release:
1995-01-02 -
Date of Implementation:
1996-08-01
Standard ICS number:
Electronics>>31.200 Integrated Circuits, MicroelectronicsChina Standard Classification Number:
Electronic Components and Information Technology>>Microcircuit>>L55 Microcircuit Comprehensive
Release date:
1995-12-22Review date:
2004-10-14Drafting Organization:
Xiamen Yonghong Electronics CompanyFocal point Organization:
National Semiconductor Device Standardization Technical CommitteePublishing Department:
State Bureau of Technical SupervisionCompetent Authority:
Ministry of Information Industry (Electronics)
Description (Translated English) / downloadSkip to download
Summary:
This specification specifies the technical requirements and inspection rules for semiconductor integrated circuit small outline package (SOP) lead frame. This specification is applicable to semiconductor integrated circuit plastic small outline package punching type lead frame. GB/T 15878-1995 Small outline package lead frame specification GB/T15878-1995 Standard download decompression password: www.bzxz.net
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