Screen plants-Codification for designating perforations

This standard specifies the marking method for sieve holes. GB 10061-1988 Sieve plate sieve hole marking method GB10061-1988 Standard download decompression password: www.bzxz.net
This standard specifies the marking method for sieve holes.

National Standard of the People's Republic of China
Method for marking holes in sieve plates
Screen plants-Codification for designating perforations
UDC 621.928
.028.2
GB 10061-88
This standard is equivalent to the international standard 1SO7806-1983 "Industrial perforated sieve plates---Method for marking holes". 1 Subject content and scope of application
This standard specifies the method for marking holes in sieve plates. 2 Reference standards
GB5329 Terminology for test sieves and screening tests
3 Terminology
In addition to the terms used in this standard as specified in GB5329, the following terms are supplemented: 3.1 Orientation
The direction of arrangement of sieve holes.
, marking method
The marking method for sieve plate holes is as follows:
Standard number
Hole arrangement positioning number
Basic hole spacing, mm
Hole arrangement code
Basic sieve hole size, mm
Hole shape code (see Table 1)
Product name
4.1 Hole shape code
The hole shapes are divided into round holes, square holes, square holes with diagonals parallel to the plate edges, hexagonal holes, oblong holes and oblong holes. The codes are as specified in the following table.
Approved by the State Bureau of Technical Supervision on December 10, 1988, 236
Implementation on July 1, 1989
4.2 Basic dimensions of sieve holes
GB 10061—88
Square holes with hole edges aligned with plate edges
Square holes with hole diagonals aligned with plate edges
Hexagonal holes
Oblong holes
Rectangular holes
4.2.1 The basic dimensions of sieve holes for round holes, square holes, square holes with diagonals parallel to plate edges, and hexagonal holes are denoted by W. The basic dimensions of oblong holes and rectangular holes are denoted by W, and W, as shown in the table. The unit is mm. 4.2.2 Mark the basic size of the sieve hole after the hole shape code; for long holes, the basic size of the hole width W and the basic size of the hole length W should be marked at the same time. The symbol "×" should be used to connect W and W. The marking example is shown in Figure 1. Figure 1 LC 5 ×25
4. Hole arrangement code
4..1 Leave one space after the basic size of the sieve hole and mark the hole arrangement code. 4..2 The center point (or midpoint, the same below) of the hole is located at the vertex of the rectangle, and the arrangement code is represented by "U", as shown in Figure 2. Figure 2 U-type arrangement
4..The center point of the hole is located at the vertex of the rectangle and the intersection of the diagonal of the rectangle. The arrangement code is "", as shown in Figure 3. Figure 3
Z-type arrangement
GB10061--88bZxz.net
4.8.4The center point of the hole is located at the vertex of the square and the intersection of the diagonal of the square. The arrangement code is "M", as shown in Figure 4. Figure 4M-type arrangement
4.3.5The center point of the hole is located at The vertices of the equilateral triangle are represented by the arrangement code "T", as shown in Figure 5. Figure 5 T-type arrangement
4.4 Basic size of hole spacing (referred to as hole spacing) 4.4.1 The basic size of hole spacing is represented by P and P,, P, in mm, as shown in Figures 2, 3, 4 and 5. 4.4.2 When the hole shapes R, C, CD and H are arranged in U or Z shape, the shorter hole spacing basic size PI and the longer hole 239
GB should be marked at the same time 10061-88
The basic dimension of the distance is P2, and the symbol "×" is used to connect P, as shown in Figure 6. If arranged in U shape, when Pi=P, only P is marked
Figure 6R10U15×20
4.4. When the hole shape LR or LC is arranged in U shape or Z shape, the basic dimension of the hole distance P parallel to the width of the long hole and the basic dimension of the hole distance P2 parallel to the length of the long hole should be marked at the same time, and the symbol "×" is used to connect Pi and P2, as shown in Figure 7. If arranged in U shape, when P,=P, only P is marked, as shown in Figure 8. Figure 7LC10×15U15×20
4.4.4 All hole shapes are arranged in M ​​shape or T shape, and only P is marked, as shown in Figure 9. Figure 9
Figure 8C10×15U20
4.5 Orientation number of hole arrangement
GB 1006188
When the orientation of the hole arrangement affects the performance of the screen plate, the selected hole arrangement orientation side should be marked, represented by "Orientation 1" and "Orientation 2" respectively.
4.$.1 Arrange in T shape, with the hole spacing parallel to the long side of the plate, which is "Orientation 1", as shown in Figure 10. The hole spacing is parallel to the short side of the plate, which is "Orientation 2", as shown in Figure 11.
Figure 10R8T20 Orientation 1
Figure 11R8T20 Orientation 2
4.5.2 Arrange in U shape or Z shape, with hole shapes of R, C, CD and H, which are relatively The short hole spacing is parallel to the long side of the board, which is "Orientation 1" as shown in Figure 12, and the shorter hole spacing is parallel to the short side of the board, which is "Orientation 2", as shown in Figure 13.
μ±±±
Figure 12C5z10×18 Orientation 1
GB10061-88
Figure 13C5Z10×18 Orientation 2
4.5.3 Arranged in U-type and Z-type, the hole shapes LR and LC, the long hole width direction is parallel to the long side of the board, which is "Orientation 1", as shown in Figure 14, and the long hole width direction is parallel to the short side of the board, which is "Orientation 2". As shown in Figure 15. 6
Figure 14LC6×16Z ９×54 Orientation 1
Figure 15LR3×18
Z12×36 Orientation 2
4.6 Sieve hole marking example
GB10061—88
凶函凶凶
区凶凶区
凶凶凶风
As shown in Figure 16, the square hole sieve plate arranged in Z shape has a basic size of 5mm sieve holes, and the basic sizes of hole spacing are 10mm and 20mm respectively, and the shorter hole spacing is parallel to the long side of the plate.
Marked as: Sieve plate C5Z10×20 Orientation 1GB10061 Additional remarks:
This standard is proposed by the Ministry of Machinery and Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the Mechanical Standardization Research Institute of the Ministry of Machinery and Electronics Industry. This standard is drafted by the Mechanical Standardization Research Institute of the Ministry of Machinery and Electronics Industry. The main drafter of this standard is Li Ning.
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