
SJ 20644-1997 General specification for PIN and APD photodetectors
time:
2024-08-05 11:41:42
- SJ 20644-1997
- in force
Standard ID:
SJ 20644-1997
Standard Name:
General specification for PIN and APD photodetectors
Chinese Name:
PIN、APD光电探测器总规范
Standard category:
Electronic Industry Standard (SJ)
-
Date of Release:
1997-06-17 -
Date of Implementation:
1997-10-01

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SJ 20644-1997 PIN, APD Photoelectric Detector General Specification SJ20644-1997 Standard download decompression password: www.bzxz.net

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Military Standard FL5961 of the Electronic Industry of the People's Republic of China
SJ 20644--97wwW.bzxz.Net
General Specification for
Detectors of PIN,APD
Published on June 17, 1997
Implemented on October 1, 1997
Approved by the Ministry of Electronics Industry of the People's Republic of China Military Standard PIN, APD Photoelectric Detector General Specification for Detectors uf PIN.APD1 Scope
SJ 20644-97
1.1 Scope of Application
This specification specifies the general requirements for military PIN, APD photoelectric detectors (hereinafter referred to as devices or products). Specific requirements and characteristics are specified in the corresponding military detailed specifications (hereinafter referred to as detailed specifications). 1.2 Classification
The products covered by this specification shall be classified according to the sealing level specified in 1.2.1, the wavelength classification specified in 1.2.2, and the optical coupler type specified in 1.2.3.
1.2.1 Sealing level
Grade A: Sealed
Grade B: Unsealed
1.2.2 Wavelength classification
Class 1: 380nm~750nm
Class 2: 820mm--1100nm
Class 3: 1250mm~1350m
Class 4: 1400nm-1600nm
1.2.3 Optical coupling type
Type 1, 50μm/125gm optical fiber
Type 2: 100μm/140μm optical fiber
Type 3: Optical window or lens
2 Reference documents
Semiconductor device packaging specification
Semiconductor devices Discrete devices and integrated circuits Part 5: Optoelectronic devices GB/T 15651—95:
GJR 128A—97
GJB 546A--96
GJB 548-—88
GJB 1427— 92
2.1 Order of precedence
Test methods for discrete semiconductor devices
Quality assurance reduction for electronic components
Test methods and procedures for microelectronic devices
General specification for optical fibers
Promulgated by the Ministry of Electronics Industry of the People's Republic of China on June 17, 1997 and implemented on October 1, 1997
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When the contents of this specification are inconsistent with the documents referenced in this specification (excluding relevant detailed specifications), the contents of this specification shall prevail.
3 Requirements
3.1 Detailed Specifications
Specific requirements shall be specified in this specification and the relevant detailed specifications. When the requirements of this specification are inconsistent with the requirements of the detailed specifications, the detailed specifications shall prevail. When the term "specified" or "as specified" is used in this specification without citing the source, the detailed specifications shall be used.
3.2 Identification
Products provided in accordance with this specification shall be products that have been identified as qualified and listed or approved for inclusion in the qualified product catalog within the time specified in the contract (see Chapter 4 and Chapter 6). 3.3 Product Assurance Requirements
Products provided in accordance with this specification shall establish and implement product assurance requirements in accordance with the procedures and requirements specified in Chapter 4 of this specification and G.TB546A.
3.4 Materials
Products shall be manufactured from materials specified in this specification or detailed specifications (see 3.1). If a particular material specification is not specified, such material may be used as long as it enables the product to meet the performance requirements of the specification. Materials used in the manufacture of the product shall be non-degradable, non-corrosive and non-flammable and explosive when tested under the conditions of this specification. They shall not be harmful to the health of personnel when used for their intended purpose. The acceptance or approval of any component material shall not be considered a guarantee of acceptance of the final product.
Note: Any package containing oxides shall not be ground, sanded, machined or otherwise processed in a manner that would produce oxides or beryllium dust, and packages containing oxides shall not be placed in acids to avoid the generation of beryllium-containing vapors. 3.4.1 Metals
All metals shall be corrosion-resistant or electroplated or otherwise treated to resist corrosion. They shall be corrosion-resistant during the service life under any environmental conditions specified in this specification. 3.4.1.1 Bacteria
All materials used in products designed in accordance with this specification shall be non-bacterial materials. 3.5 Structure
The structure of the product shall comply with the provisions of this specification and the detailed specifications. 3.5.1 Pigtail Components
3.5.1.1 Coating (sheath)
The fiber coating material should be non-metallic, and the material and structure should have anti-bending properties, and should be able to ensure that the minimum bending radius of the fiber is less than 10mm
3.5.1.2 Buffer Layer
There should be a buffer layer between the tube shell and the pigtail sheath, and the expansion structure can use metal or non-metallic materials. The total length of the buffer layer should not exceed 30mm, and under normal circumstances, it should have a minimum bending radius of 20mm. 3.5.1.3 Fiber
The pigtail should be an optical fiber in accordance with the regulations (see 3.1). 3.5.2 Lead Conductor
3.5.2.1 Lead Coating
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The coating of all external leads or lead ends should meet the following conditions. 3.5.2.1.1 Hot-dip tinning
Hot-dip tinning shall uniformly immerse round leads in a minimum tin layer of 1.5 μm thick. For other shapes, the minimum thickness of the tin layer on the main plane protrusion is 5.1 μm. Hot-dip tinning shall extend beyond the effective pad or glass seal for direct mounting of devices. Hot-dip tinning is applicable to:
a. Plated parts according to 3.5.2.1.2 or 3.5.2.1.3; b. Electroplated nickel or chemically plated nickel-phosphorus according to 3.5.2.2; c. When used for base metal, hot-dip tinning shall cover all leads from the glass seal or the connection between the lead and the package shell. 3.5.2.1.2 Tinning
The tin layer shall be dense, uniform and continuous, with a minimum thickness of 7.6 μm. The organic matter deposited in the tin layer shall not exceed 0.05% by weight of carbon element. Before (or after) aging, the coating should be melted when heated above the liquidus temperature of the tin layer. After melting, a dense, uniform and continuous coating can be observed visually. When measuring the molten tin layer at the main plane protrusion, the molten tin layer should be at least 5.1μum. This measurement should be made between the bottom surface of the package and the end of the lead (this provision is to avoid the inspector from selecting atypical lead parts for measurement).
Fusing tin plating is applicable to:
a, according to 3.5,2,2, on nickel plating or chemical nickel phosphorus plating (only for hard leads or packaging materials other than leads); h. On base metal.
If the leads are completely hot-dip tinned according to 3.5.2.1a, the tin layer does not need to be dissolved. Tin-lead plating can replace tin plating. Lead accounts for 2% to 50% by weight in the electroplating middle layer (the rest is tin). The minimum thickness of the tin-lead layer shall be 7.6 μm, and the organic matter deposited in the tin-lead layer shall not exceed 0.05% by weight of carbon element. Tin-lead electroplating is applicable to: a. on a tin-plated layer; b. on electroplated or chemically plated phosphorus according to 3.5.2.2; c. on the base metal. After electroplating, the coating may melt when heated above the liquidus temperature of tin-lead before (or after) aging. After melting, the coating should be dense, uniform and continuous when visually observed. The minimum thickness should be 5.1 μm when measured on the protrusion of the main plane. This measurement should be made between the bottom surface of the package and the end of the lead (this provision is extended to avoid the inspector from selecting atypical lead parts for measurement). For tin or tin-lead plating, the maximum carbon content in the bond layer (and the minimum lead content in the case of tin-lead plating) should be determined by the manufacturer every week. After melting, the manufacturer shall perform visual inspections of samples as a process control. Such inspections shall be performed with sufficient frequency to ensure that the various requirements for product coating are met. The content of carbon and lead may be obtained by permitted analytical techniques (e.g., carbon, by high temperature decomposition, infrared detection, etc., lead, by X-ray, emission spectroscopy, etc.), as long as the analysis can reflect the actual content of the deposited coating.
3.5.2.1.3 Gold plating
The purity of the gold used for electroplating shall be at least 99.7%, and only sickle cobalt hardener shall be used. The gold plating layer shall be at least 1.2μm and the maximum thickness shall be 5.7μm. Gold plating is allowed to be electroplated on nickel or on the bottom coating according to 3.5.2.2. 3.5.2.2 Nickel plating or inner coating
It is recommended that the inner coating be electroplated in a nickel sulfamate plating bath. The layer thickness measured on the main plane or diameter shall be 1.3μm to 8.9um. When chemical nickel plating is allowed, the thickness for the lead should be 1.3um~2.5um, and the thickness for the package body except the lead should be 1.3μum~6.4um, and the thickness should be measured on the surface or diameter. No organic additives are allowed to be added to either the nickel sulfamate or nickel phosphite plating bath. Electroplating (or) chemical nickel plating (or a combination of the two) for nickel coating can only be applied to the package (except the lead or terminal part) when corrosion resistance and environmental requirements are met. In all cases, the inner layer of electroplated nickel for lead and terminal coating is preferably coated with a nickel sulfamate plating bath. Chemical phosphorous acid nickel plating cannot be used for the inner coating of soft leads or semi-soft leads (see 3.3.1 and 3.3.2 of GIB548, Method 2004). It can only be used by hand to coat the hard leads or package body parts other than soft leads.
3.5.2.3 Lead or terminal identification
Lead or terminal identification shall be as specified (see 3.1). 3.6 Performance
Optical, electrical and optoelectronic characteristics shall comply with the provisions of this specification and relevant detailed specifications, and shall be used to verify the results of the inspection requirements specified in Clauses 4 and 8. When applied, the maximum forward current, maximum dissipated power and maximum reverse voltage under pulse and continuous operating conditions shall be as specified (see 3.1).
3.6.1 Spectral responsivity and quantum efficiency
Spectral responsivity and quantum efficiency shall not be less than the specified level (see 3.1 and 4.7.1)g3.6.2 Capacitance
The capacitance of the device shall be as specified (see 3.1 and 4.7.2),3.6.3 Reverse current and breakdown voltage
The reverse leakage current shall not exceed the specification value (see 3.1), and the breakdown voltage shall exceed the voltage value specified in the detailed specification for a certain reverse current (see 4.7.3).
3.6.4 Dark current
The dark current shall not exceed the specification value (see 3.1 and 4.7.5),3.6.5 Responsivity linearity
The responsivity linearity shall meet the requirements (see 3.1 and 4.7.5). 3.6.6 Pulse response
The pulse rise time (from 10% to 90% of the maximum pulse power amplitude) and the fall time (from 90% to 10% of the maximum pulse power amplitude) shall not exceed the specified values (see 3.1 and 4.7.6). 3.6.7 Analog bandwidth
The analog bandwidth shall meet the requirements (see 3.1 and 4.7.7). 3.6.B Noise equivalent power
The noise equivalent power (NEP) shall not exceed the requirements of the detailed specification (see 3.1 and 4.7.8). 3.7 Environmental and mechanical requirements
3.7. 1 Internal national inspection (before capping)
The product shall meet the requirements of internal visual inspection (before capping) as specified in Table 1 (see 4.8.1). 3.7.2 Visual and Mechanical Inspection
Products shall comply with the requirements for the allowable lot nonconformance (LIPD) for visual and mechanical inspection as specified in Table 1 and (see 4, 8.2) (see 6.6.6).
3.7.3 Physical Dimensions
The dimensions and tolerances of the product shall be as specified (see 3.1 and 4.8.3) and shall comply with the LTPD inspection requirements in Table IV. 3.7.4 High Temperature Life (Non-operating)
Products shall comply with the visual inspection in 4.8.2 and the allowable lot nonconformance requirements in the table and the requirements for endpoint parameters and parameter limits in this specification (see 4.8.4). 3.7.5 Thermal shock (temperature cycle)
SJ 20644-97
The product shall be subjected to thermal shock according to the provisions of this specification (see 4.8.5). The product shall have no visible signs of damage and other damage, and shall meet the requirements of visual inspection in 4.8.2 and the batch allowable defective rate, endpoint parameters and parameter limit values in Table III. 3.7.6 Constant acceleration
The product shall meet the requirements of the batch allowable defective rate in Table IV and the specified endpoint parameters and parameter limit values (see 4.8.6). 3.7.7 Steady-state reverse bias aging
The product shall meet the requirements of reverse current and the optical parameters and parameter limit values specified in this specification (see 4.8.7). 3.7.8 Sealing
The product shall meet the requirements of the batch allowable defective rate in Table I and Table IV and shall not exceed the leakage rate specified in this specification (see 4.8.8).
3.7.9 Solderability
The leads of the product shall meet the solderability requirements of Method 2026 in GIB128A and meet the requirements for the allowable defective rate of the batch specified in Table III (see 4.8.9).
3.7.10 Marking Durability
The marking of the product shall remain clear and intact (see 4.8.10) and meet the requirements for the allowable defective rate of the batch specified in Table III.
3.7.11 Steady State Working Life (LTPD)
The product shall meet the requirements for the allowable defective rate of the batch specified in Table III and Table IV for the steady state working life and meet the requirements for the endpoint parameters and parameter limit values specified in this specification and the detail specification (see 3.1 and 4.8.11). 3.7.12 Intermittent working life (L.TPD)
The product shall meet the requirements of the batch allowable defective rate specified in the table and for the intermittent working life, and meet the requirements of the endpoint parameters and parameter limit values specified in this specification and the detailed specifications (3.1 and 4.8.12). 3.7.13 Visual inspection of the inside of the open cap
The product shall meet the requirements of the batch allowable defective rate specified in Table II for the visual inspection of the inside of the open cap (see 4.8.13). 3.7.14 Bonding strength
The product shall meet the requirements of the batch allowable defective rate specified in the table for the bonding strength, and the failure standard shall be in accordance with the provisions of GJB128A Method 2037 (4.8.14).
3.7.15 Thermal shock (glass stress)
For the stress applied to the optical fiber and glass sealing device, the product shall meet the requirements of the batch allowable defective rate specified in Table IV.
3.7.16 Terminal Strength
Terminal tensile strength requirements apply to products with pigtails, and terminal fatigue requirements apply to the external leads of the product. The test conditions such as the minimum acceptable tension and duration shall be applied as specified (see 3.1). The relative displacement, looseness or breakage between the product itself and the lead or optical fiber shall be judged as failure or scrap, and the LTPD shall meet the requirements of Table IV (see 4.8.16). 3.7.17 Moisture Resistance
Products shall meet the requirements of LTPD in Table I and the requirements of the endpoint parameters and parameter limit values specified in this specification (see 4.8.17).
3.7.18 Impact
Products shall meet the requirements of LTPD in Table IV and the requirements of the endpoint parameters and parameter limit values specified in this specification (see 4.8.18).
3.7.19 Sweep frequency vibration
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The product shall meet the requirements of LTPD in Table IV and the requirements of the endpoint parameters and parameter limits specified in this specification (see 4.8.19). 3.7.20 Salt spray
The product shall not have blurred writing, peeling or coating corrosion pits that affect the use, and shall meet the requirements of I.TPD in Table IV (see 4.8.20).
3.7.21 Steady-state working life (2)
The product shall meet the entry requirements specified in Table IV and the endpoint parameters and parameter limits specified in this specification and detailed specifications (see 3.1 and 4. 8.211
3.7.22 Neutron irradiation
When specified (see 3.1), the product shall be exposed to the neutron irradiation level specified by the table and shall meet the endpoint parameters and parameter limits specified in this specification and the detailed specification (see 3.1 and 4.8.22). 3.7.23 Steady-state dose radiation
When specified (see 3.1, the product shall be exposed to the total ionization level radiation conditions specified in the table and shall meet the endpoint parameters and parameter limits specified in this specification and the detailed specification (see 3.1 and 4.8.23). 3.8 Marking
3.8.1 Identification of marking
The marking shall comply with this The following markings shall be marked on each device and be legible during transportation according to the requirements of the specification and related specifications. Model or identification number (see 3.1 as specified); Electric:
h. Product quality mark (see 3.8.2):
Contractor name or trademark (see 3.8.3); c.
Polarity mark (see 3.1 as specified);
Inspection batch identification code (see 3.8.4);
Special mark (see 3.8.5);
Electrostatic discharge sensitive mark (see 3.8.5.1); g.
h. Identification mark of beryllium oxide package (see 3.8.5.2). 3.8.2 Product Quality Mark
Products produced and approved in batches in accordance with the requirements of this specification and relevant detailed specifications shall be marked with the letter \J\ as the quality mark for military products.
3.8.3 Name or Trademark of Contractor
The product shall be marked with the name or trademark of the equipment contractor who signs a contract in accordance with this specification to manufacture devices. The quality-consistency inspection of all specified products shall be carried out at the contractor. Only when the equipment is also a device, the identification mark of the equipment may be printed on the device. Only the name or trademark of the original contractor may appear on the device or original packaging. Re-marking is not allowed. 3.8.4 Inspection Batch Identification Code
The product shall be marked with an identification code indicating the last day on which the devices of the inspection batch were sealed. The first two digits of the code indicate the last two digits of the year. The last two digits of the code indicate the number of the calendar week of the year. When the calendar number is a single digit, add a \0\ before it. The year and week of the identification code shall be marked together and may be marked after the assurance level. When more than one batch of devices are sealed and submitted for quality consistency inspection within the same 6-week period, a capital letter shall be selected as the suffix letter to identify the batch. This suffix letter shall be placed immediately after the calendar week number. The batch identification code and the code suffix letter can then be used to unambiguously identify each inspection batch. 3.8.5 Special markings
If any special markings are used, they shall not affect or confuse the markings specified in 3.8.1. 6
3.8.5.1 Electrostatic discharge sensitivity marking
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When the level of a device is determined by the electrostatic discharge sensitivity test (see 4.4), the device represented by the test shall be marked as follows:
a, Level 1: 1999V, represented by a hollow or solid equilateral blue triangle. b. Level 2: 2000V.3999V, represented by two hollow or solid equilateral triangles. c, Level 3: 4000V, no identification mark.
The Company reserves the right to classify devices that have not passed the ESD test according to their sensitivity based on their own historical evaluation or implementation of the test. These untested devices should be marked in accordance with the relevant regulations. 3.8.5.2 Identification Marking of Beryllium Oxide Packages
If the package of the device contains beryllium oxide, the device shall be marked with the \BeO\ mark. 3.8.6 Clarity of Marking
The marking shall remain clear after all tests have been carried out. Damage to the marking caused by mechanical fixtures in Group B and Group C tests shall not lead to rejection of the batch. However, devices with damaged markings must be re-printed to ensure that the markings are clear before shipment. 3.9 Processing Quality
Products shall be manufactured in accordance with the relevant design, process documents and the requirements of this specification. After completion, there shall be no defects or pits on the product packaging surface, probe head or flange, unless it is part of the original design. Burrs and sharp edges on the shell and leads shall be removed.
4 Quality Assurance Provisions
4.1 Inspection Responsibilities
Unless otherwise specified in the contract or at the request of the ordering party, the contractor shall be responsible for completing all inspections specified in this specification. Unless otherwise specified, the inspections required by this specification may be carried out using its own or other suitable equipment. If necessary, the ordering party or the certification agency has the right to re-inspect any item in accordance with the provisions of this specification. 4.1.1 Qualified Responsibilities
All items shall meet the requirements of Chapter 3 and Chapter 5. The inspections mentioned in the previous section of this specification shall become part of the entire inspection system or quality program of the contract executor. Any omission in the inspections required by this specification shall not exclude the responsibility of the contractor, who shall ensure that all products and equipment provided to the user fully meet the requirements of the contract. 4.1.2 Quality Assurance Outline
The quality assurance outline shall be established and maintained in accordance with GJR546A and shall be a prerequisite for quality certification. 4.2 Inspection Classification
The inspection requirements specified in this specification are divided into the following categories: a: Identification inspection (see 4.4)
b. Screening (see 4.5);
c. Quality consistency inspection (see 4.6).
4.2.1 Inspection Methods
Unless otherwise specified in this specification, all inspections shall be carried out in accordance with the provisions of GIB128A. 4.2.2 Composition of Inspection Lots
The products shall be organized into a collection of identifiable inspection lots or inspection sub-lots. 4.2.2.1 Inspection Lots
All products submitted for identification inspection or quality consistency inspection at any time constitute an inspection lot. The purpose of submitting an inspection lot is to determine whether the requirements of the detailed specification are met. Each inspection lot shall consist of products of alternate models, or sub-lots of similar structure belonging to one or several detailed specifications. These products shall be manufactured on the same production line in the same factory from the beginning of manufacturing to sealing, using the same production process within the same 6 weeks, according to the same product design and the same material standards. The identification of the inspection lot shall be maintained from the time the lot is assembled until the lot is accepted or rejected. 4.2.2.1.1 Inspection sub-lots
An inspection sub-lot shall consist of products of the same model in the same detailed specification. These products are manufactured on the same production line within the same 6 weeks using the same production process, according to the same product design and the same material standards, and are always produced on the same production line until the final sealing.
4.2.2.1.2 Structurally Similar Products
Structurally similar products are products that are manufactured on the same production line using the same manufacturing process from the beginning to the final sealing, with the same product design according to the same material standards, and with different optoelectronic performance. For example, products classified by different rated current values are structurally similar products. 4.2.2.2 Maintenance of Batch Identification
Each batch and sub-batch shall remain isolated, safe and traceable during all screening inspections and marking processes. 4.2.3 Sampling
Statistical sampling for identification inspection and quality consistency inspection shall be carried out in accordance with Appendix A (Supplement) of this specification. 4.2.4 Performance Test
The optoelectronic performance test (see 4.7) shall be completed without any adverse effect on the product. 4.2.5 Resubmitted Batch
Resubmitted batches shall be separated from new batches, and the resubmitted batches shall be clearly identified. When any inspection lot submitted for qualification or quality consistency testing fails to meet any of the requirements of Groups A, B, and C, it may be resubmitted once for the failed group test using the tightened inspection criteria (see Appendix A of this specification). A second resubmission using the tightened inspection criteria is permitted only when the failure analysis confirms the failure mechanism in each of the previous submissions and determines that the failure is caused by the following reasons.
a. Defects can be effectively screened out by rescreening the entire lot. h. Random defects. They do not reflect poor basic product design or poor basic manufacturing processes. Analysis of failed products shows that the failure mechanism is caused by poor basic process, basic design errors or defects that cannot be screened out. In all these cases, the lot shall not be resubmitted. 4.3 Inspection of materials
The materials used to manufacture the product shall comply with the requirements of the relevant detail specifications. 4.4 Qualification inspection
Qualification inspection shall be carried out in a laboratory approved by the qualification body (see 6.3) on samples produced with equipment and processes used in normal production. The electrostatic discharge sensitivity test shall be carried out in accordance with the provisions of Method 1020 and the detailed specifications in GIB128A.
4.4.1 Qualification Procedure
During qualification, the product shall be subjected to screening tests (see 4.5) and group A, B, and C tests as specified for sealing level A or B. All samples for group B and group C tests must be selected from batches that have passed the group A test requirements, using the following conditions 2. Samples drawn from each product sub-batch of each model submitted according to the required ITPI) value shall be tested for each group of group A.
b. Samples shall be drawn from a sub-batch for each group of group B tests. Products shall be drawn from each sub-batch (each product model) for design verification testing (see 4.8.24.8.3). t. Samples shall be drawn from a sub-batch for each group of group C tests. At the manufacturer's option, products in Table III B3 group can be continuously sampled in Table IVC5 group to meet the specified requirements, or separate samples can be used. 4.4.2 Final test
Before and after the test, all groups in Group B and Group C specify the final test of photoelectric parameters. Products that fail the test before the test should be replaced by qualified products. 4.4.3 Variable data
The test report should include the variable data of Group A, and the test data before and after the test of Group B and Group C: 4.4.4 Submission of data
All test data should be recorded in sufficient detail to verify the test procedures and test conditions. 4.4.5 batches are too small
The identification inspection batch shall be selected by the manufacturer, and the number of products in the inspection batch and each sub-batch shall be at least twice the number of samples required for the identification inspection. For inspection batches less than 500, small quantity quality inspection can be adopted (see Table Ⅱ, Table Ⅱ, Table WV). 4.4.5.1 Sample selection
All samples shall be randomly selected from the identification inspection batch. After the test begins, the manufacturer may add a certain number of additional samples to the initial samples, but any group can only be added once, and the added samples shall undergo all tests of the group. The total number of samples (the initial and additional samples shall determine the new qualified number: the total number of defects in the initial and additional samples shall be added together and shall comply with the specified LTPD value or input value. The manufacturer shall retain sufficient products in the identification inspection batch to provide additional samples. 4.4.5.2 Identification of samples
The supervisory representative of the identification body may mark each product that requires identification testing, or authorize others to mark it, to distinguish these products from those that are not intended for identification testing. 4.4.6 Release of batches
If the batch represented by the identification inspection sample meets the screening and quality consistency requirements, it can be delivered according to the contract after obtaining identification approval.
4.4.7 Maintenance of identification qualification
In order to maintain the qualification, the manufacturer shall submit a report to the certification body every 12 months, and the certification body shall determine the time for the first submission of the report. The content of the report shall include: a summary of the results of the quality consistency test (Group A, Group B, Group C), and the number and failure mode of any failure group. The report shall also include the results of the quality consistency test of all batches completed within 12 months, and the test results of all rework batches shall be identified and explained. If the test results of the report show that it is inconsistent with the specification requirements (see 4.6.2 and 4.6.3), and corrective measures approved by the certification body are not taken, the failed products will be removed from the catalog of qualified products. If the above report is not submitted within 60 days after the end of the 12-month period, its qualification will be revoked. 4.4.7.1 Handling of non-production situations
If production is not carried out during the period of submitting the report, the manufacturer shall submit a report to the certification body to prove that it still has the ability and equipment conditions to produce the marked products. If the production of sealing grade A or B or similar products is not carried out within three consecutive reporting periods, the manufacturer shall provide a representative product for the corresponding test in accordance with the requirements of the certification inspection according to the requirements of the certification inspection.
4.5 Screening
The products shall withstand and pass all screening tests in the order of Table I and 3.1 for the specified product type and the allowed non-conforming product rate (PD) A) and the specified sealing level (Group A and Class B). Products that fail in any test during the screening process shall be immediately removed from the batch when the failure is found or when the conclusion of test failure is made, and these products shall not be used for delivery.
4.5.1 Aging acceptance criteria
The selected optoelectronic parameters shall be those specified in the detailed specifications (see 3.1) as intermediate and final tests for 100% aging in Table I. These parameters can be used to compare whether the change (△) during aging indicates a problem with batch stability. The PDA of each inspection batch for aging and intermittent aging shall not exceed 10%. The manufacturer cannot perform aging outside the regulations, and the change (4) limit value shall be as specified (see 3.1). When the (4) value uses PA, the parameter values tested before and after aging should be compared (100% screening).
4.5.2 Resubmitted batches for aging
The batch can only be submitted for aging if the defective rate does not exceed twice the specified PDA, and only one submission is allowed. The resubmitted batch can only be part of the original batch, and the resubmitted batch should be distinguished from the new batch. A stricter inspection with a PDA of 3% is used for the inspection of all specified properties. If the defective rate of the batch exceeds the PDA of the stricter inspection, the entire resubmitted batch shall not be accepted at any quality level. (4) Criteria applicable to resubmission: The following procedures shall be followed: 1. Perform screening (aging) and calculate (4)) deviation values, and calculate the average deviation or standard deviation (n) from this data. b. (△) Deviation values exceeding the mean value ± 3. Products with such deviation values shall be removed from the batch and scrapped. The remaining products shall be submitted for comparison after inspection according to this specification. 4.6 Quality consistency inspection
Quality consistency inspection shall be carried out according to the requirements of the specified sealing level (Grade A, Grade B), Group A, Group B and Group C. Sampling of inspection batches shall comply with the provisions of Appendix A of this specification. If a batch of products fails to meet the quality consistency requirements and is rejected and cannot be submitted again, it shall be regarded as an invalid batch and reported truthfully. Each batch of products shall be inspected for Group A and Group B. For a given sealing level, Group C inspection shall be successfully completed. The Group C requirements for the products represented by the test level and structurally similar group are met. The manufacturer's method of grouping structurally similar products shall be submitted to the certification body for approval. 4.6.1 Acceptance inspection
Acceptance inspection shall include inspections of Group A and Group B. 4.6.2 Corrective action
If 6 out of 10 consecutive batches or 3 consecutive batches of the same model of products or structurally similar products are rejected due to the same failure mechanism, the manufacturer shall take corrective actions approved by the certification body. If corrective actions cannot be taken, these products shall be removed from the qualified product list. .
4.6.3 Failure
The batches that fail in each group of Group A, Group B or Group C shall be resubmitted in accordance with the provisions of Article 4.2.5 of this specification. However, if the batch is not resubmitted or the resubmission fails, the batch shall not be shipped and the \\ mark shall be removed within 30 days. After the failure of the C group test, the product samples of various models submitted by the new Asian structure machine-like products represented by the V group test shall be subjected to all tests of all failed groups batch by batch. After three consecutive batches pass the tests of the failed groups, the periodic test can be resumed. C group test The product of the failed model cannot be accepted unless the product of that model successfully passes the tests of each group of Group C failure. The other models of products in the same identification group represented by the failed product model can be accepted as long as they meet the Group C inspection requirements.
4.6.4 Group A inspection
For each inspection lot, Group A inspection shall be carried out in accordance with Table II and relevant detailed specifications (see 3.1). Group A inspection can be carried out in any order. If an inspection lot consists of 10 sub-lots, each sub-lot shall pass Group A inspection as required. — 10
Internal daily inspection (before packaging)
High temperature life (1.TPD)
(not working)
Thermal shock (temperature cycle)
Constant acceleration +
a.Paper leak detection 2)
b.Grain leak detection
Photoelectric digital test
[Steady-state anti-counterfeiting
Photoelectric parameter test
Appearance and mechanical inspection"
GJB128A method
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Table sieve
Grade A:TA=125t
Grade B:T.=85c
At least 24h
Test condition A-1
Low temperature==45℃
High temperature= [25℃ (A Grade)
Required terms
High temperature = 85℃ (Grade B)
At, = 23C, Y, direction room at least 3.7.6
196060m/s2
No need to maintain Imin
Instrument for Grade A, test piece H
For Grade A, Grade B, test conditions (,
Liquid temperature = 85℃
As specified
Test conditions A.80%
Maximum Vr.48h.
Grade A: Ta-10T
Grade B; TA = 70℃
As specified, but all (4) numbers
According to the minimum value
Note: 1) For more detailed test conditions, see the requirements and test methods clauses of this specification. 2) R-grade sealing products can omit this test. 3) After marking, all products should be inspected for appearance and machine inspection. 4) Products with large optical surface, flip-chip and pigtail structure can be inspected according to detailed specifications. Table 2A Inspection Group 1 Mechanical inspection (GJB128A method 2071) Group 2 Photoelectric parameter test (=25) Group 3 Photoelectric parameter test at the highest, high and low rated operating temperatures Test terms Small batch quality inspection n/c 16/0334 TTKAONKAa-Ta-10T
B grade;TA=70℃
As specified, but all (4) numbers
As minimum
Note: 1) For more detailed test conditions, see the requirements and test methods of this specification. 2) This test can be omitted for R grade sealing products. 3) After marking, all products should be inspected for appearance and mechanical inspection. 4) Products with large optical surface, flip chip and pigtail structure can be inspected according to detailed specifications. Table 2A Discipline Inspection
1 Group
Required Existing Mechanical Qualification Inspection
(GJB128A Method 2071)
2 Group
Photoelectric Parameter Test (=25)
3 Group
Photoelectric Parameter Test at Highest, High and Low Rated Operating Temperatures
Test Clauses
Small Batch Quality Inspectionn/c
16/0334
TTKAONKAa-
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SJ 20644--97wwW.bzxz.Net
General Specification for
Detectors of PIN,APD
Published on June 17, 1997
Implemented on October 1, 1997
Approved by the Ministry of Electronics Industry of the People's Republic of China Military Standard PIN, APD Photoelectric Detector General Specification for Detectors uf PIN.APD1 Scope
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1.1 Scope of Application
This specification specifies the general requirements for military PIN, APD photoelectric detectors (hereinafter referred to as devices or products). Specific requirements and characteristics are specified in the corresponding military detailed specifications (hereinafter referred to as detailed specifications). 1.2 Classification
The products covered by this specification shall be classified according to the sealing level specified in 1.2.1, the wavelength classification specified in 1.2.2, and the optical coupler type specified in 1.2.3.
1.2.1 Sealing level
Grade A: Sealed
Grade B: Unsealed
1.2.2 Wavelength classification
Class 1: 380nm~750nm
Class 2: 820mm--1100nm
Class 3: 1250mm~1350m
Class 4: 1400nm-1600nm
1.2.3 Optical coupling type
Type 1, 50μm/125gm optical fiber
Type 2: 100μm/140μm optical fiber
Type 3: Optical window or lens
2 Reference documents
Semiconductor device packaging specification
Semiconductor devices Discrete devices and integrated circuits Part 5: Optoelectronic devices GB/T 15651—95:
GJR 128A—97
GJB 546A--96
GJB 548-—88
GJB 1427— 92
2.1 Order of precedence
Test methods for discrete semiconductor devices
Quality assurance reduction for electronic components
Test methods and procedures for microelectronic devices
General specification for optical fibers
Promulgated by the Ministry of Electronics Industry of the People's Republic of China on June 17, 1997 and implemented on October 1, 1997
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When the contents of this specification are inconsistent with the documents referenced in this specification (excluding relevant detailed specifications), the contents of this specification shall prevail.
3 Requirements
3.1 Detailed Specifications
Specific requirements shall be specified in this specification and the relevant detailed specifications. When the requirements of this specification are inconsistent with the requirements of the detailed specifications, the detailed specifications shall prevail. When the term "specified" or "as specified" is used in this specification without citing the source, the detailed specifications shall be used.
3.2 Identification
Products provided in accordance with this specification shall be products that have been identified as qualified and listed or approved for inclusion in the qualified product catalog within the time specified in the contract (see Chapter 4 and Chapter 6). 3.3 Product Assurance Requirements
Products provided in accordance with this specification shall establish and implement product assurance requirements in accordance with the procedures and requirements specified in Chapter 4 of this specification and G.TB546A.
3.4 Materials
Products shall be manufactured from materials specified in this specification or detailed specifications (see 3.1). If a particular material specification is not specified, such material may be used as long as it enables the product to meet the performance requirements of the specification. Materials used in the manufacture of the product shall be non-degradable, non-corrosive and non-flammable and explosive when tested under the conditions of this specification. They shall not be harmful to the health of personnel when used for their intended purpose. The acceptance or approval of any component material shall not be considered a guarantee of acceptance of the final product.
Note: Any package containing oxides shall not be ground, sanded, machined or otherwise processed in a manner that would produce oxides or beryllium dust, and packages containing oxides shall not be placed in acids to avoid the generation of beryllium-containing vapors. 3.4.1 Metals
All metals shall be corrosion-resistant or electroplated or otherwise treated to resist corrosion. They shall be corrosion-resistant during the service life under any environmental conditions specified in this specification. 3.4.1.1 Bacteria
All materials used in products designed in accordance with this specification shall be non-bacterial materials. 3.5 Structure
The structure of the product shall comply with the provisions of this specification and the detailed specifications. 3.5.1 Pigtail Components
3.5.1.1 Coating (sheath)
The fiber coating material should be non-metallic, and the material and structure should have anti-bending properties, and should be able to ensure that the minimum bending radius of the fiber is less than 10mm
3.5.1.2 Buffer Layer
There should be a buffer layer between the tube shell and the pigtail sheath, and the expansion structure can use metal or non-metallic materials. The total length of the buffer layer should not exceed 30mm, and under normal circumstances, it should have a minimum bending radius of 20mm. 3.5.1.3 Fiber
The pigtail should be an optical fiber in accordance with the regulations (see 3.1). 3.5.2 Lead Conductor
3.5.2.1 Lead Coating
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The coating of all external leads or lead ends should meet the following conditions. 3.5.2.1.1 Hot-dip tinning
Hot-dip tinning shall uniformly immerse round leads in a minimum tin layer of 1.5 μm thick. For other shapes, the minimum thickness of the tin layer on the main plane protrusion is 5.1 μm. Hot-dip tinning shall extend beyond the effective pad or glass seal for direct mounting of devices. Hot-dip tinning is applicable to:
a. Plated parts according to 3.5.2.1.2 or 3.5.2.1.3; b. Electroplated nickel or chemically plated nickel-phosphorus according to 3.5.2.2; c. When used for base metal, hot-dip tinning shall cover all leads from the glass seal or the connection between the lead and the package shell. 3.5.2.1.2 Tinning
The tin layer shall be dense, uniform and continuous, with a minimum thickness of 7.6 μm. The organic matter deposited in the tin layer shall not exceed 0.05% by weight of carbon element. Before (or after) aging, the coating should be melted when heated above the liquidus temperature of the tin layer. After melting, a dense, uniform and continuous coating can be observed visually. When measuring the molten tin layer at the main plane protrusion, the molten tin layer should be at least 5.1μum. This measurement should be made between the bottom surface of the package and the end of the lead (this provision is to avoid the inspector from selecting atypical lead parts for measurement).
Fusing tin plating is applicable to:
a, according to 3.5,2,2, on nickel plating or chemical nickel phosphorus plating (only for hard leads or packaging materials other than leads); h. On base metal.
If the leads are completely hot-dip tinned according to 3.5.2.1a, the tin layer does not need to be dissolved. Tin-lead plating can replace tin plating. Lead accounts for 2% to 50% by weight in the electroplating middle layer (the rest is tin). The minimum thickness of the tin-lead layer shall be 7.6 μm, and the organic matter deposited in the tin-lead layer shall not exceed 0.05% by weight of carbon element. Tin-lead electroplating is applicable to: a. on a tin-plated layer; b. on electroplated or chemically plated phosphorus according to 3.5.2.2; c. on the base metal. After electroplating, the coating may melt when heated above the liquidus temperature of tin-lead before (or after) aging. After melting, the coating should be dense, uniform and continuous when visually observed. The minimum thickness should be 5.1 μm when measured on the protrusion of the main plane. This measurement should be made between the bottom surface of the package and the end of the lead (this provision is extended to avoid the inspector from selecting atypical lead parts for measurement). For tin or tin-lead plating, the maximum carbon content in the bond layer (and the minimum lead content in the case of tin-lead plating) should be determined by the manufacturer every week. After melting, the manufacturer shall perform visual inspections of samples as a process control. Such inspections shall be performed with sufficient frequency to ensure that the various requirements for product coating are met. The content of carbon and lead may be obtained by permitted analytical techniques (e.g., carbon, by high temperature decomposition, infrared detection, etc., lead, by X-ray, emission spectroscopy, etc.), as long as the analysis can reflect the actual content of the deposited coating.
3.5.2.1.3 Gold plating
The purity of the gold used for electroplating shall be at least 99.7%, and only sickle cobalt hardener shall be used. The gold plating layer shall be at least 1.2μm and the maximum thickness shall be 5.7μm. Gold plating is allowed to be electroplated on nickel or on the bottom coating according to 3.5.2.2. 3.5.2.2 Nickel plating or inner coating
It is recommended that the inner coating be electroplated in a nickel sulfamate plating bath. The layer thickness measured on the main plane or diameter shall be 1.3μm to 8.9um. When chemical nickel plating is allowed, the thickness for the lead should be 1.3um~2.5um, and the thickness for the package body except the lead should be 1.3μum~6.4um, and the thickness should be measured on the surface or diameter. No organic additives are allowed to be added to either the nickel sulfamate or nickel phosphite plating bath. Electroplating (or) chemical nickel plating (or a combination of the two) for nickel coating can only be applied to the package (except the lead or terminal part) when corrosion resistance and environmental requirements are met. In all cases, the inner layer of electroplated nickel for lead and terminal coating is preferably coated with a nickel sulfamate plating bath. Chemical phosphorous acid nickel plating cannot be used for the inner coating of soft leads or semi-soft leads (see 3.3.1 and 3.3.2 of GIB548, Method 2004). It can only be used by hand to coat the hard leads or package body parts other than soft leads.
3.5.2.3 Lead or terminal identification
Lead or terminal identification shall be as specified (see 3.1). 3.6 Performance
Optical, electrical and optoelectronic characteristics shall comply with the provisions of this specification and relevant detailed specifications, and shall be used to verify the results of the inspection requirements specified in Clauses 4 and 8. When applied, the maximum forward current, maximum dissipated power and maximum reverse voltage under pulse and continuous operating conditions shall be as specified (see 3.1).
3.6.1 Spectral responsivity and quantum efficiency
Spectral responsivity and quantum efficiency shall not be less than the specified level (see 3.1 and 4.7.1)g3.6.2 Capacitance
The capacitance of the device shall be as specified (see 3.1 and 4.7.2),3.6.3 Reverse current and breakdown voltage
The reverse leakage current shall not exceed the specification value (see 3.1), and the breakdown voltage shall exceed the voltage value specified in the detailed specification for a certain reverse current (see 4.7.3).
3.6.4 Dark current
The dark current shall not exceed the specification value (see 3.1 and 4.7.5),3.6.5 Responsivity linearity
The responsivity linearity shall meet the requirements (see 3.1 and 4.7.5). 3.6.6 Pulse response
The pulse rise time (from 10% to 90% of the maximum pulse power amplitude) and the fall time (from 90% to 10% of the maximum pulse power amplitude) shall not exceed the specified values (see 3.1 and 4.7.6). 3.6.7 Analog bandwidth
The analog bandwidth shall meet the requirements (see 3.1 and 4.7.7). 3.6.B Noise equivalent power
The noise equivalent power (NEP) shall not exceed the requirements of the detailed specification (see 3.1 and 4.7.8). 3.7 Environmental and mechanical requirements
3.7. 1 Internal national inspection (before capping)
The product shall meet the requirements of internal visual inspection (before capping) as specified in Table 1 (see 4.8.1). 3.7.2 Visual and Mechanical Inspection
Products shall comply with the requirements for the allowable lot nonconformance (LIPD) for visual and mechanical inspection as specified in Table 1 and (see 4, 8.2) (see 6.6.6).
3.7.3 Physical Dimensions
The dimensions and tolerances of the product shall be as specified (see 3.1 and 4.8.3) and shall comply with the LTPD inspection requirements in Table IV. 3.7.4 High Temperature Life (Non-operating)
Products shall comply with the visual inspection in 4.8.2 and the allowable lot nonconformance requirements in the table and the requirements for endpoint parameters and parameter limits in this specification (see 4.8.4). 3.7.5 Thermal shock (temperature cycle)
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The product shall be subjected to thermal shock according to the provisions of this specification (see 4.8.5). The product shall have no visible signs of damage and other damage, and shall meet the requirements of visual inspection in 4.8.2 and the batch allowable defective rate, endpoint parameters and parameter limit values in Table III. 3.7.6 Constant acceleration
The product shall meet the requirements of the batch allowable defective rate in Table IV and the specified endpoint parameters and parameter limit values (see 4.8.6). 3.7.7 Steady-state reverse bias aging
The product shall meet the requirements of reverse current and the optical parameters and parameter limit values specified in this specification (see 4.8.7). 3.7.8 Sealing
The product shall meet the requirements of the batch allowable defective rate in Table I and Table IV and shall not exceed the leakage rate specified in this specification (see 4.8.8).
3.7.9 Solderability
The leads of the product shall meet the solderability requirements of Method 2026 in GIB128A and meet the requirements for the allowable defective rate of the batch specified in Table III (see 4.8.9).
3.7.10 Marking Durability
The marking of the product shall remain clear and intact (see 4.8.10) and meet the requirements for the allowable defective rate of the batch specified in Table III.
3.7.11 Steady State Working Life (LTPD)
The product shall meet the requirements for the allowable defective rate of the batch specified in Table III and Table IV for the steady state working life and meet the requirements for the endpoint parameters and parameter limit values specified in this specification and the detail specification (see 3.1 and 4.8.11). 3.7.12 Intermittent working life (L.TPD)
The product shall meet the requirements of the batch allowable defective rate specified in the table and for the intermittent working life, and meet the requirements of the endpoint parameters and parameter limit values specified in this specification and the detailed specifications (3.1 and 4.8.12). 3.7.13 Visual inspection of the inside of the open cap
The product shall meet the requirements of the batch allowable defective rate specified in Table II for the visual inspection of the inside of the open cap (see 4.8.13). 3.7.14 Bonding strength
The product shall meet the requirements of the batch allowable defective rate specified in the table for the bonding strength, and the failure standard shall be in accordance with the provisions of GJB128A Method 2037 (4.8.14).
3.7.15 Thermal shock (glass stress)
For the stress applied to the optical fiber and glass sealing device, the product shall meet the requirements of the batch allowable defective rate specified in Table IV.
3.7.16 Terminal Strength
Terminal tensile strength requirements apply to products with pigtails, and terminal fatigue requirements apply to the external leads of the product. The test conditions such as the minimum acceptable tension and duration shall be applied as specified (see 3.1). The relative displacement, looseness or breakage between the product itself and the lead or optical fiber shall be judged as failure or scrap, and the LTPD shall meet the requirements of Table IV (see 4.8.16). 3.7.17 Moisture Resistance
Products shall meet the requirements of LTPD in Table I and the requirements of the endpoint parameters and parameter limit values specified in this specification (see 4.8.17).
3.7.18 Impact
Products shall meet the requirements of LTPD in Table IV and the requirements of the endpoint parameters and parameter limit values specified in this specification (see 4.8.18).
3.7.19 Sweep frequency vibration
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The product shall meet the requirements of LTPD in Table IV and the requirements of the endpoint parameters and parameter limits specified in this specification (see 4.8.19). 3.7.20 Salt spray
The product shall not have blurred writing, peeling or coating corrosion pits that affect the use, and shall meet the requirements of I.TPD in Table IV (see 4.8.20).
3.7.21 Steady-state working life (2)
The product shall meet the entry requirements specified in Table IV and the endpoint parameters and parameter limits specified in this specification and detailed specifications (see 3.1 and 4. 8.211
3.7.22 Neutron irradiation
When specified (see 3.1), the product shall be exposed to the neutron irradiation level specified by the table and shall meet the endpoint parameters and parameter limits specified in this specification and the detailed specification (see 3.1 and 4.8.22). 3.7.23 Steady-state dose radiation
When specified (see 3.1, the product shall be exposed to the total ionization level radiation conditions specified in the table and shall meet the endpoint parameters and parameter limits specified in this specification and the detailed specification (see 3.1 and 4.8.23). 3.8 Marking
3.8.1 Identification of marking
The marking shall comply with this The following markings shall be marked on each device and be legible during transportation according to the requirements of the specification and related specifications. Model or identification number (see 3.1 as specified); Electric:
h. Product quality mark (see 3.8.2):
Contractor name or trademark (see 3.8.3); c.
Polarity mark (see 3.1 as specified);
Inspection batch identification code (see 3.8.4);
Special mark (see 3.8.5);
Electrostatic discharge sensitive mark (see 3.8.5.1); g.
h. Identification mark of beryllium oxide package (see 3.8.5.2). 3.8.2 Product Quality Mark
Products produced and approved in batches in accordance with the requirements of this specification and relevant detailed specifications shall be marked with the letter \J\ as the quality mark for military products.
3.8.3 Name or Trademark of Contractor
The product shall be marked with the name or trademark of the equipment contractor who signs a contract in accordance with this specification to manufacture devices. The quality-consistency inspection of all specified products shall be carried out at the contractor. Only when the equipment is also a device, the identification mark of the equipment may be printed on the device. Only the name or trademark of the original contractor may appear on the device or original packaging. Re-marking is not allowed. 3.8.4 Inspection Batch Identification Code
The product shall be marked with an identification code indicating the last day on which the devices of the inspection batch were sealed. The first two digits of the code indicate the last two digits of the year. The last two digits of the code indicate the number of the calendar week of the year. When the calendar number is a single digit, add a \0\ before it. The year and week of the identification code shall be marked together and may be marked after the assurance level. When more than one batch of devices are sealed and submitted for quality consistency inspection within the same 6-week period, a capital letter shall be selected as the suffix letter to identify the batch. This suffix letter shall be placed immediately after the calendar week number. The batch identification code and the code suffix letter can then be used to unambiguously identify each inspection batch. 3.8.5 Special markings
If any special markings are used, they shall not affect or confuse the markings specified in 3.8.1. 6
3.8.5.1 Electrostatic discharge sensitivity marking
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When the level of a device is determined by the electrostatic discharge sensitivity test (see 4.4), the device represented by the test shall be marked as follows:
a, Level 1: 1999V, represented by a hollow or solid equilateral blue triangle. b. Level 2: 2000V.3999V, represented by two hollow or solid equilateral triangles. c, Level 3: 4000V, no identification mark.
The Company reserves the right to classify devices that have not passed the ESD test according to their sensitivity based on their own historical evaluation or implementation of the test. These untested devices should be marked in accordance with the relevant regulations. 3.8.5.2 Identification Marking of Beryllium Oxide Packages
If the package of the device contains beryllium oxide, the device shall be marked with the \BeO\ mark. 3.8.6 Clarity of Marking
The marking shall remain clear after all tests have been carried out. Damage to the marking caused by mechanical fixtures in Group B and Group C tests shall not lead to rejection of the batch. However, devices with damaged markings must be re-printed to ensure that the markings are clear before shipment. 3.9 Processing Quality
Products shall be manufactured in accordance with the relevant design, process documents and the requirements of this specification. After completion, there shall be no defects or pits on the product packaging surface, probe head or flange, unless it is part of the original design. Burrs and sharp edges on the shell and leads shall be removed.
4 Quality Assurance Provisions
4.1 Inspection Responsibilities
Unless otherwise specified in the contract or at the request of the ordering party, the contractor shall be responsible for completing all inspections specified in this specification. Unless otherwise specified, the inspections required by this specification may be carried out using its own or other suitable equipment. If necessary, the ordering party or the certification agency has the right to re-inspect any item in accordance with the provisions of this specification. 4.1.1 Qualified Responsibilities
All items shall meet the requirements of Chapter 3 and Chapter 5. The inspections mentioned in the previous section of this specification shall become part of the entire inspection system or quality program of the contract executor. Any omission in the inspections required by this specification shall not exclude the responsibility of the contractor, who shall ensure that all products and equipment provided to the user fully meet the requirements of the contract. 4.1.2 Quality Assurance Outline
The quality assurance outline shall be established and maintained in accordance with GJR546A and shall be a prerequisite for quality certification. 4.2 Inspection Classification
The inspection requirements specified in this specification are divided into the following categories: a: Identification inspection (see 4.4)
b. Screening (see 4.5);
c. Quality consistency inspection (see 4.6).
4.2.1 Inspection Methods
Unless otherwise specified in this specification, all inspections shall be carried out in accordance with the provisions of GIB128A. 4.2.2 Composition of Inspection Lots
The products shall be organized into a collection of identifiable inspection lots or inspection sub-lots. 4.2.2.1 Inspection Lots
All products submitted for identification inspection or quality consistency inspection at any time constitute an inspection lot. The purpose of submitting an inspection lot is to determine whether the requirements of the detailed specification are met. Each inspection lot shall consist of products of alternate models, or sub-lots of similar structure belonging to one or several detailed specifications. These products shall be manufactured on the same production line in the same factory from the beginning of manufacturing to sealing, using the same production process within the same 6 weeks, according to the same product design and the same material standards. The identification of the inspection lot shall be maintained from the time the lot is assembled until the lot is accepted or rejected. 4.2.2.1.1 Inspection sub-lots
An inspection sub-lot shall consist of products of the same model in the same detailed specification. These products are manufactured on the same production line within the same 6 weeks using the same production process, according to the same product design and the same material standards, and are always produced on the same production line until the final sealing.
4.2.2.1.2 Structurally Similar Products
Structurally similar products are products that are manufactured on the same production line using the same manufacturing process from the beginning to the final sealing, with the same product design according to the same material standards, and with different optoelectronic performance. For example, products classified by different rated current values are structurally similar products. 4.2.2.2 Maintenance of Batch Identification
Each batch and sub-batch shall remain isolated, safe and traceable during all screening inspections and marking processes. 4.2.3 Sampling
Statistical sampling for identification inspection and quality consistency inspection shall be carried out in accordance with Appendix A (Supplement) of this specification. 4.2.4 Performance Test
The optoelectronic performance test (see 4.7) shall be completed without any adverse effect on the product. 4.2.5 Resubmitted Batch
Resubmitted batches shall be separated from new batches, and the resubmitted batches shall be clearly identified. When any inspection lot submitted for qualification or quality consistency testing fails to meet any of the requirements of Groups A, B, and C, it may be resubmitted once for the failed group test using the tightened inspection criteria (see Appendix A of this specification). A second resubmission using the tightened inspection criteria is permitted only when the failure analysis confirms the failure mechanism in each of the previous submissions and determines that the failure is caused by the following reasons.
a. Defects can be effectively screened out by rescreening the entire lot. h. Random defects. They do not reflect poor basic product design or poor basic manufacturing processes. Analysis of failed products shows that the failure mechanism is caused by poor basic process, basic design errors or defects that cannot be screened out. In all these cases, the lot shall not be resubmitted. 4.3 Inspection of materials
The materials used to manufacture the product shall comply with the requirements of the relevant detail specifications. 4.4 Qualification inspection
Qualification inspection shall be carried out in a laboratory approved by the qualification body (see 6.3) on samples produced with equipment and processes used in normal production. The electrostatic discharge sensitivity test shall be carried out in accordance with the provisions of Method 1020 and the detailed specifications in GIB128A.
4.4.1 Qualification Procedure
During qualification, the product shall be subjected to screening tests (see 4.5) and group A, B, and C tests as specified for sealing level A or B. All samples for group B and group C tests must be selected from batches that have passed the group A test requirements, using the following conditions 2. Samples drawn from each product sub-batch of each model submitted according to the required ITPI) value shall be tested for each group of group A.
b. Samples shall be drawn from a sub-batch for each group of group B tests. Products shall be drawn from each sub-batch (each product model) for design verification testing (see 4.8.24.8.3). t. Samples shall be drawn from a sub-batch for each group of group C tests. At the manufacturer's option, products in Table III B3 group can be continuously sampled in Table IVC5 group to meet the specified requirements, or separate samples can be used. 4.4.2 Final test
Before and after the test, all groups in Group B and Group C specify the final test of photoelectric parameters. Products that fail the test before the test should be replaced by qualified products. 4.4.3 Variable data
The test report should include the variable data of Group A, and the test data before and after the test of Group B and Group C: 4.4.4 Submission of data
All test data should be recorded in sufficient detail to verify the test procedures and test conditions. 4.4.5 batches are too small
The identification inspection batch shall be selected by the manufacturer, and the number of products in the inspection batch and each sub-batch shall be at least twice the number of samples required for the identification inspection. For inspection batches less than 500, small quantity quality inspection can be adopted (see Table Ⅱ, Table Ⅱ, Table WV). 4.4.5.1 Sample selection
All samples shall be randomly selected from the identification inspection batch. After the test begins, the manufacturer may add a certain number of additional samples to the initial samples, but any group can only be added once, and the added samples shall undergo all tests of the group. The total number of samples (the initial and additional samples shall determine the new qualified number: the total number of defects in the initial and additional samples shall be added together and shall comply with the specified LTPD value or input value. The manufacturer shall retain sufficient products in the identification inspection batch to provide additional samples. 4.4.5.2 Identification of samples
The supervisory representative of the identification body may mark each product that requires identification testing, or authorize others to mark it, to distinguish these products from those that are not intended for identification testing. 4.4.6 Release of batches
If the batch represented by the identification inspection sample meets the screening and quality consistency requirements, it can be delivered according to the contract after obtaining identification approval.
4.4.7 Maintenance of identification qualification
In order to maintain the qualification, the manufacturer shall submit a report to the certification body every 12 months, and the certification body shall determine the time for the first submission of the report. The content of the report shall include: a summary of the results of the quality consistency test (Group A, Group B, Group C), and the number and failure mode of any failure group. The report shall also include the results of the quality consistency test of all batches completed within 12 months, and the test results of all rework batches shall be identified and explained. If the test results of the report show that it is inconsistent with the specification requirements (see 4.6.2 and 4.6.3), and corrective measures approved by the certification body are not taken, the failed products will be removed from the catalog of qualified products. If the above report is not submitted within 60 days after the end of the 12-month period, its qualification will be revoked. 4.4.7.1 Handling of non-production situations
If production is not carried out during the period of submitting the report, the manufacturer shall submit a report to the certification body to prove that it still has the ability and equipment conditions to produce the marked products. If the production of sealing grade A or B or similar products is not carried out within three consecutive reporting periods, the manufacturer shall provide a representative product for the corresponding test in accordance with the requirements of the certification inspection according to the requirements of the certification inspection.
4.5 Screening
The products shall withstand and pass all screening tests in the order of Table I and 3.1 for the specified product type and the allowed non-conforming product rate (PD) A) and the specified sealing level (Group A and Class B). Products that fail in any test during the screening process shall be immediately removed from the batch when the failure is found or when the conclusion of test failure is made, and these products shall not be used for delivery.
4.5.1 Aging acceptance criteria
The selected optoelectronic parameters shall be those specified in the detailed specifications (see 3.1) as intermediate and final tests for 100% aging in Table I. These parameters can be used to compare whether the change (△) during aging indicates a problem with batch stability. The PDA of each inspection batch for aging and intermittent aging shall not exceed 10%. The manufacturer cannot perform aging outside the regulations, and the change (4) limit value shall be as specified (see 3.1). When the (4) value uses PA, the parameter values tested before and after aging should be compared (100% screening).
4.5.2 Resubmitted batches for aging
The batch can only be submitted for aging if the defective rate does not exceed twice the specified PDA, and only one submission is allowed. The resubmitted batch can only be part of the original batch, and the resubmitted batch should be distinguished from the new batch. A stricter inspection with a PDA of 3% is used for the inspection of all specified properties. If the defective rate of the batch exceeds the PDA of the stricter inspection, the entire resubmitted batch shall not be accepted at any quality level. (4) Criteria applicable to resubmission: The following procedures shall be followed: 1. Perform screening (aging) and calculate (4)) deviation values, and calculate the average deviation or standard deviation (n) from this data. b. (△) Deviation values exceeding the mean value ± 3. Products with such deviation values shall be removed from the batch and scrapped. The remaining products shall be submitted for comparison after inspection according to this specification. 4.6 Quality consistency inspection
Quality consistency inspection shall be carried out according to the requirements of the specified sealing level (Grade A, Grade B), Group A, Group B and Group C. Sampling of inspection batches shall comply with the provisions of Appendix A of this specification. If a batch of products fails to meet the quality consistency requirements and is rejected and cannot be submitted again, it shall be regarded as an invalid batch and reported truthfully. Each batch of products shall be inspected for Group A and Group B. For a given sealing level, Group C inspection shall be successfully completed. The Group C requirements for the products represented by the test level and structurally similar group are met. The manufacturer's method of grouping structurally similar products shall be submitted to the certification body for approval. 4.6.1 Acceptance inspection
Acceptance inspection shall include inspections of Group A and Group B. 4.6.2 Corrective action
If 6 out of 10 consecutive batches or 3 consecutive batches of the same model of products or structurally similar products are rejected due to the same failure mechanism, the manufacturer shall take corrective actions approved by the certification body. If corrective actions cannot be taken, these products shall be removed from the qualified product list. .
4.6.3 Failure
The batches that fail in each group of Group A, Group B or Group C shall be resubmitted in accordance with the provisions of Article 4.2.5 of this specification. However, if the batch is not resubmitted or the resubmission fails, the batch shall not be shipped and the \\ mark shall be removed within 30 days. After the failure of the C group test, the product samples of various models submitted by the new Asian structure machine-like products represented by the V group test shall be subjected to all tests of all failed groups batch by batch. After three consecutive batches pass the tests of the failed groups, the periodic test can be resumed. C group test The product of the failed model cannot be accepted unless the product of that model successfully passes the tests of each group of Group C failure. The other models of products in the same identification group represented by the failed product model can be accepted as long as they meet the Group C inspection requirements.
4.6.4 Group A inspection
For each inspection lot, Group A inspection shall be carried out in accordance with Table II and relevant detailed specifications (see 3.1). Group A inspection can be carried out in any order. If an inspection lot consists of 10 sub-lots, each sub-lot shall pass Group A inspection as required. — 10
Internal daily inspection (before packaging)
High temperature life (1.TPD)
(not working)
Thermal shock (temperature cycle)
Constant acceleration +
a.Paper leak detection 2)
b.Grain leak detection
Photoelectric digital test
[Steady-state anti-counterfeiting
Photoelectric parameter test
Appearance and mechanical inspection"
GJB128A method
SJ 20644—97
Table sieve
Grade A:TA=125t
Grade B:T.=85c
At least 24h
Test condition A-1
Low temperature==45℃
High temperature= [25℃ (A Grade)
Required terms
High temperature = 85℃ (Grade B)
At, = 23C, Y, direction room at least 3.7.6
196060m/s2
No need to maintain Imin
Instrument for Grade A, test piece H
For Grade A, Grade B, test conditions (,
Liquid temperature = 85℃
As specified
Test conditions A.80%
Maximum Vr.48h.
Grade A: Ta-10T
Grade B; TA = 70℃
As specified, but all (4) numbers
According to the minimum value
Note: 1) For more detailed test conditions, see the requirements and test methods clauses of this specification. 2) R-grade sealing products can omit this test. 3) After marking, all products should be inspected for appearance and machine inspection. 4) Products with large optical surface, flip-chip and pigtail structure can be inspected according to detailed specifications. Table 2A Inspection Group 1 Mechanical inspection (GJB128A method 2071) Group 2 Photoelectric parameter test (=25) Group 3 Photoelectric parameter test at the highest, high and low rated operating temperatures Test terms Small batch quality inspection n/c 16/0334 TTKAONKAa-Ta-10T
B grade;TA=70℃
As specified, but all (4) numbers
As minimum
Note: 1) For more detailed test conditions, see the requirements and test methods of this specification. 2) This test can be omitted for R grade sealing products. 3) After marking, all products should be inspected for appearance and mechanical inspection. 4) Products with large optical surface, flip chip and pigtail structure can be inspected according to detailed specifications. Table 2A Discipline Inspection
1 Group
Required Existing Mechanical Qualification Inspection
(GJB128A Method 2071)
2 Group
Photoelectric Parameter Test (=25)
3 Group
Photoelectric Parameter Test at Highest, High and Low Rated Operating Temperatures
Test Clauses
Small Batch Quality Inspectionn/c
16/0334
TTKAONKAa-
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