GB/T 14663-1993 Technical requirements for plastic packaging molds
time:
2024-08-09 08:16:41
- GB/T 14663-1993
- Abolished
Standard ID:
GB/T 14663-1993
Standard Name:
Technical requirements for plastic packaging molds
Chinese Name:
塑封模具技术条件
Standard category:
National Standard (GB)
-
Date of Release:
1993-10-16 -
Date of Implementation:
1994-07-01 -
Date of Expiration:
2007-09-01
Standard ICS number:
Mechanical Manufacturing>>Chipless Processing Equipment>>25.120.30 Molding Equipment and Casting EquipmentChina Standard Classification Number:
Electrical Engineering>>Electrical Materials and General Parts>>K15 Electrical Insulation Materials and Products
alternative situation:
Replaced by GB/T 14663-2007
Review date:
2004-10-14Drafting Organization:
Electronic Standardization Institute of the Ministry of ElectronicsFocal point Organization:
National Technical Committee for Mould StandardizationPublishing Department:
State Bureau of Technical SupervisionCompetent Authority:
National Standardization Administration
Description (Translated English) / downloadSkip to download
Summary:
This standard specifies the basic performance of plastic molds, assembly technical conditions, testing and acceptance regulations, packaging, transportation, storage, etc. This standard is applicable to plastic molds for integrated circuits, semiconductor discrete devices, and components encapsulated in plastic. The encapsulation material is thermosetting plastic, such as modified epoxy resin, silicone plastic, etc. GB/T 14663-1993 Technical conditions for plastic molds GB/T14663-1993 Standard download decompression password: www.bzxz.net
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