GB/T 15615-1995 Test method for bending strength of silicon wafer
time:
2024-08-08 17:56:47
- GB/T 15615-1995
- Abolished
Standard ID:
GB/T 15615-1995
Standard Name:
Test method for bending strength of silicon wafer
Chinese Name:
硅片抗弯强度测试方法
Standard category:
National Standard (GB)
-
Date of Release:
1995-07-12 -
Date of Implementation:
1996-02-01 -
Date of Expiration:
2005-10-14
Standard ICS number:
Metallurgy>>Metal Material Testing>>77.040.01 Metal Material Testing GeneralChina Standard Classification Number:
Metallurgy>>Methods for testing physical and chemical properties of metals>>Methods for testing H23 metal processing properties
Review date:
2004-10-14Drafting Organization:
Central South University of TechnologyFocal point Organization:
National Technical Committee for Standardization of Semiconductor Materials and EquipmentPublishing Department:
State Bureau of Technical SupervisionCompetent Authority:
National Standardization Administration
Description (Translated English) / downloadSkip to download
Summary:
This standard specifies the test method for the bending strength of silicon single crystal cutting, grinding and polishing wafers. This standard is applicable to the measurement of the bending strength of CZ and FZ silicon single crystal wafers with crystal orientation of <111> and <100> at room temperature. The thickness of silicon wafer is 250～900μm. GB/T 15615-1995 Test method for bending strength of silicon wafer GB/T15615-1995 Standard download decompression password: www.bzxz.net
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